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Highlight: | 60mil High Frequency PCB Material,1oz High Frequency PCB,High Frequency Immersion Gold PCB |
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Our newly shipped 2-layer rigid PCB has been specifically designed to meet the demanding requirements of high-performance and high-volume applications. Meticulously crafted using Rogers RO4003C Hydrocarbon Ceramic woven glass, this PCB offers unparalleled electrical performance and dimensional stability.
The PCB material, RO4003C, is a reinforced hydrocarbon/ceramic laminate renowned for its low dielectric tolerance and low loss. With a Dielectric Constant (DK) of 3.38 at 10 GHz and a Dissipation Factor of 0.0027 at 10 GHz, excellent electrical performance is achieved, making it ideal for applications requiring higher operating frequencies. Stable electrical properties across the frequency range enable it to excel in controlled impedance transmission lines and repeatable filter designs.
Featuring a low thermal coefficient of dielectric constant and excellent dimensional stability, reliable performance is ensured even under varying circuit processing temperatures. Plated-through holes benefit from the durability provided by its low Z-axis expansion, while stability throughout the manufacturing process is maintained due to the low in-plane expansion coefficient.
The stackup of this PCB consists of a 1.524mm Rogers 4003C core sandwiched between two 35 μm copper layers, providing optimal signal transmission and structural integrity. Versatility in circuit design is achieved with a finished board thickness of 1.6mm and a minimum trace/space of 5/4 mils.
This PCB comes with various construction details, including a board dimension of 42.56mm x 63.2mm (+/- 0.15mm), ensuring precise fitment in your applications. Efficient component integration is facilitated by the minimum hole size of 0.5mm, and the surface finish of Immersion Gold ensures excellent solderability and corrosion resistance.
With a total of 12 components and 38 pads, including 21 thru-hole pads and 17 top SMT pads, ample room is provided for your circuitry needs. Additional versatility is offered with two bottom SMT pads, and efficient routing and connectivity are achieved through the inclusion of 49 vias and 3 nets.
It meets IPC-Class-2 quality standards, this PCB undergoes a 100% electrical test prior to shipment, ensuring its reliability and functionality. Seamless integration into your manufacturing process is enabled by its compatibility with Gerber RS-274-X artwork.
This high-performance PCB finds applications in various industries, excelling in delivering reliable and efficient performance in areas such as cellular base station antennas and power amplifiers, automotive radar and sensors, and LNBs for direct broadcast satellites.
Prompt delivery to meet your project timelines is ensured through our worldwide availability. For any technical inquiries or further information, please contact Ivy at sales10@bichengpcb.com. Trust our expertise to deliver the highest quality PCBs for your cutting-edge applications.
Dielectric Constant,εProcess | 3.38±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
Dielectric Constant,εDesign | 3.55 | Z | 8 to 40 GHz | Differential Phase Length Method | |
Dissipation Factortan,δ | 0.0027 0.0021 |
Z | 10 GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 1.7 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
Surface Resistivity | 4.2 x 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
Tensile Modulus | 19,650(2,850) 19,450(2,821) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
Tensile Strength | 139(20.2) 100(14.5) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
Flexural Strength | 276 (40) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
Dimensional Stability | <0.3 | X,Y | mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion | 11 14 46 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
Td | 425 | ℃ TGA | ASTM D 3850 | ||
Thermal Conductivity | 0.71 | W/M/oK | 80℃ | ASTM C518 | |
Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
Density | 1.79 | gm/cm3 | 23℃ | ASTM D 792 | |
Copper Peel Stength | 1.05 (6.0) |
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
Flammability | N/A | UL 94 | |||
Lead-free Process Compatible | Yes |
Advantages of using RO4003C material:
1. Excellent electrical performance: RO4003C material offers low dielectric tolerance and low loss, making it ideal for applications with higher operating frequencies. It enables superior signal integrity and allows for efficient transmission of high-frequency signals.
2. Stable electrical properties vs. frequency: The material exhibits consistent electrical properties across a wide frequency range, which is crucial for controlled impedance transmission lines and the repeatable design of filters. This stability ensures reliable and predictable circuit performance.
3. Dimensional stability: RO4003C material has excellent dimensional stability, meaning it maintains its shape and size even under varying processing temperatures. This stability is essential for precise manufacturing processes and reliable circuit assembly.
4. CAF resistance: The material is resistant to Conductive Anodic Filament (CAF) formation, which is a common concern in electronic assemblies. This resistance ensures the long-term reliability and performance of the PCB.
5. Volume manufacturing process: RO4003C laminates can be fabricated using standard glass epoxy processes, making them compatible with cost-effective and widely available manufacturing techniques. This allows for efficient and scalable production.
Disadvantages of using RO4003C material:
1. Limited temperature range: While RO4003C has a wide operating temperature range of -40℃ to +85℃, it may not be suitable for extreme temperature environments beyond this range. Applications requiring higher temperature resistance may need alternative materials.
2. Cost: Compared to some other PCB materials, RO4003C may have a higher cost. However, it is competitively priced within its performance class and offers value for applications that require its specific advantages.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848