HASL 2-Layer Rogers RO3010 Ceramic Filled PTFE PCB 35uM Copper

It's glad to be here to intrduce our newly shipped 2-layer Rogers RO3010 ceramic-filled PTFE PCB. Engineered with precision and built to meet the highest industry standards, this PCB is intended to elevate your electronic projects. Let's delve into the details of this cutting-edge product.

Unmatched Material Properties:
The PCB is constructed using Rogers RO3010 ceramic-filled PTFE composites, known for their superior performance. With a dielectric constant of 10.2 at 10 GHz and 23°C, it ensures excellent signal integrity and minimal signal loss. The low dissipation factor of 0.0022 at 10 GHz and 23°C guarantees efficient energy transmission. Furthermore, the board exhibits outstanding thermal stability, with a decomposition temperature (Td) exceeding 500°C, allowing it to withstand extreme temperatures.

Robust 2-Layer Stackup:
Our PCB features a 2-layer rigid stackup configuration, offering flexibility and ease of use. The copper layer 1 has a thickness of 35 μm, followed by a Rogers RO3010 substrate with a thickness of 0.635 mm. The copper layer 2 also has a thickness of 35 μm, ensuring reliable electrical conductivity. This stackup construction provides a solid foundation for the electronic circuits.

Precise Construction Details:
The board dimensions measure 98.38 mm x 70 mm for both types, with a strict tolerance of +/- 0.15 mm, ensuring precise fitment. The minimum trace width and spacing are set at 4.5/5.5 mils, enabling intricate circuitry layouts. The minimum hole size of 0.4 mm allows for easy component integration. The finished board thickness is 0.7 mm, providing a slim and lightweight profile. With a 1 oz (1.4 mils) outer layer copper weight and 20 μm via plating thickness, the PCB guarantees optimal electrical conductivity and durability. The surface finish is Hot Air Soldering Level (HASL), ensuring reliable soldering connections.

Comprehensive Statistics:
The PCB boasts impressive statistics, including 51 components and a total of 67 pads. It features 41 through-hole pads and 26 top surface-mount technology (SMT) pads. With 78 vias, the board enables efficient signal routing and connectivity. The PCB incorporates 6 nets, ensuring seamless integration with other circuit elements.

Industry Standards and Global Availability:
Our PCB adheres to IPC-Class-2 standards, guaranteeing high-quality manufacturing and compliance with industry benchmarks. It accepts Gerber RS-274-X artwork format, ensuring compatibility and ease of use. With worldwide availability, customers from all regions can benefit from this exceptional product.

Contact Us for Technical Support:
For any technical inquiries or further information, our dedicated team, led by Ivy, is ready to provide comprehensive support. Feel free to reach out to us at sales10@bichengpcb.com, and we will be delighted to assist you.

In conclusion, our newly shipped 2-layer Rogers RO3010 ceramic-filled PTFE PCB is the perfect solution for your electronic projects. With its exceptional material properties, precise construction details, and adherence to industry standards, it promises unparalleled performance and reliability. Trust in this advanced PCB to bring your electronic projects to life.

Introducing RO3010: The Cutting-Edge Ceramic-Filled PTFE PCB Material

When it comes to high-performance PCB materials, the RO3010 ceramic-filled PTFE composites from Rogers Corporation are a true game-changer. Engineered with meticulous attention to detail, RO3010 offers exceptional electrical and mechanical properties, making it the ideal choice for a wide range of applications. Let's delve into the data sheet of RO3010 to understand its outstanding features and advantages.

Unparalleled Dielectric Performance:

RO3010 boasts an impressive dielectric constant (ε) of 10.2±0.05 at 10 GHz and 23℃, as per the IPC-TM-650 2.5.5.5 Clamped Stripline test method. This ensures excellent signal integrity and minimal signal loss, allowing for efficient energy transmission and reliable performance. The design dielectric constant (ε) of 11.2 from 8 GHz to 40 GHz, determined using the Differential Phase Length Method, further showcases the material's suitability for high-frequency applications.

Minimal Signal Loss:
The dissipation factor (tanδ) of RO3010 is an incredibly low 0.0022 at 10 GHz and 23℃, as per the IPC-TM-650 2.5.5.5 test method. This low value indicates that the material exhibits minimal energy loss during signal transmission, resulting in improved overall system efficiency.

Thermal Stability and Dimensional Accuracy:
RO3010 showcases remarkable thermal stability with a thermal coefficient of ε of -395 ppm/℃ from -50℃ to 150℃ at 10 GHz, as assessed by the IPC-TM-650 2.5.5.5 test method. This property ensures that the PCB maintains its electrical performance across a wide temperature range, making it suitable for demanding environments. The material also demonstrates excellent dimensional stability, with dimensional changes of only 0.35 ppm/℃ and 0.31 ppm/℃ in the X and Y directions, respectively, as per the IPC-TM-650 2.2.4 test method.

Reliable Electrical Properties:
RO3010 exhibits impressive volume resistivity and surface resistivity, both measuring 10^5 MΩ.cm and 10^5 MΩ, respectively, under IPC 2.5.17.1 test conditions. These values indicate excellent insulation characteristics, ensuring reliable electrical performance and preventing unwanted current leakage.

Mechanical Strength and Durability:
With a tensile modulus of 1902 MPa in the X direction and 1934 MPa in the Y direction at 23℃, as per ASTM D 638, RO3010 showcases exceptional mechanical strength. This property allows the PCB to withstand various mechanical stresses and ensures the longevity of your electronic designs.

Superior Thermal Performance:
RO3010 exhibits a thermal conductivity of 0.95 W/M/K at 50℃, as per ASTM D 5470, enabling efficient heat dissipation. The material's coefficient of thermal expansion ranges from 11 to 16 ppm/℃ in the X, Y, and Z directions, respectively, from -55℃ to 288℃ at 23℃/50% RH, according to the IPC-TM-650 2.4.4.1 test method. This property minimizes the risk of thermal stress and ensures the stability of your circuits even in challenging thermal environments.

Exceptional Reliability:
RO3010 is designed to withstand demanding conditions, with a decomposition temperature (Td) exceeding 500℃, as per ASTM D 3850. This remarkable property ensures the material's stability and integrity even in high-temperature applications. Additionally, the density of RO3010 is 2.8 gm/cm3 at 23℃, as per ASTM D 792, providing a lightweight yet robust solution for your PCB needs.

Industry Compliance and Lead-Free Compatibility:
RO3010 meets the stringent flammability standards of V-0, as per UL 94, ensuring its safety and reliability. Furthermore, the material is compatible with lead-free processes, making it environmentally friendly and compatible with modern manufacturing requirements.

In summary, RO3010 ceramic-filled PTFE composites offer an unmatched combination of electrical and mechanical properties. With exceptional dielectric performance, minimal signal loss, thermal stability, reliable electrical properties, and mechanical strength, RO3010 is the ideal choice for high-frequency applications where reliability is paramount. Experience the cutting-edge capabilities of RO3010 and take your electronic designs to new heights of performance and durability.