Hydrocarbon Ceramic Laminates RF PCB Board,
32mil Rigid PCB,
ENEPIG Rigid PCB
Today, we will discuss construction of a 2-layer rigid PCB using RO4003C hydrocarbon ceramic laminates.
The PCB material used in this project is RO4003C hydrocarbon ceramic laminates. This material is known for its high-frequency performance and low dielectric loss. The use of this material in the PCB ensures optimal signal quality and reduces noise and crosstalk between components. Additionally, the lead-free process used in manufacturing makes it eco-friendly, and it can operate in a wide temperature range of -40℃ to +85℃.
The stackup configuration of the PCB is a 2-layer rigid board with a finished copper weight of 35um on both sides. The dielectric thickness is 32mil, and the stackup has been optimized for high-frequency performance. The use of RO4003C hydrocarbon ceramic laminates as the dielectric material ensures that the PCB has a low dielectric loss, making it suitable for high-frequency applications.
The construction details of the PCB have been carefully selected to ensure optimal performance and reliability. The board dimensions are 40mm x 26mm, with a tolerance of +/- 0.15mm. The minimum trace/space is 5/6 mils, and the minimum hole size is 0.3mm. There are no blind or buried vias. The finished board thickness is 0.9mm, and the finished Cu weight is 1 oz (1.4 mils) for all layers. The via plating thickness is 1 mil, and the surface finish is Electroless Nickle Electroless Palladium and Immersion Gold (ENEPIG). There is no silkscreen on the top or bottom layers, and no solder mask on the top or bottom layers. There is no silkscreen on solder pads, and 100% electrical testing has been performed.
The PCB has a total of 95 components and 112 pads, with 37 thru-hole pads and 75 top SMT pads. There are no bottom SMT pads. There are 68 vias and 15 nets. The type of artwork supplied for this PCB is PCBDOC.
In conclusion,construction of a 2-layer rigid PCB using RO4003C hydrocarbon ceramic laminates is a reliable and efficient solution for modern electronics. Its use of RO4003C hydrocarbon ceramic laminates ensures optimal signal quality and reduces noise and crosstalk between components. Its stackup configuration and construction details are carefully selected to ensure optimal performance and reliability. The PCB has undergone 100% electrical testing to ensure its quality and reliability. The PCB is ideal for high-frequency applications and can operate in a wide temperature range of -40℃ to +85℃. If there are any technical questions, you can contact us at firstname.lastname@example.org.
|Dielectric Constant,εProcess||3.38±0.05||Z||10 GHz/23℃||IPC-TM-650 188.8.131.52 Clamped Stripline|
|Dielectric Constant,εDesign||3.55||Z||8 to 40 GHz||Differential Phase Length Method|
|Thermal Coefficient of ε||+40||Z||ppm/℃||-50℃to 150℃||IPC-TM-650 184.108.40.206|
|Volume Resistivity||1.7 x 1010||MΩ.cm||COND A||IPC-TM-650 220.127.116.11|
|Surface Resistivity||4.2 x 109||MΩ||COND A||IPC-TM-650 18.104.22.168|
|Electrical Strength||31.2(780)||Z||Kv/mm(v/mil)||0.51mm(0.020")||IPC-TM-650 22.214.171.124|
|MPa(ksi)||RT||ASTM D 638|
|MPa(ksi)||RT||ASTM D 638|
|after etch+E2/150℃||IPC-TM-650 2.4.39A|
|Coefficient of Thermal Expansion||11
|Tg||>280||℃ TMA||A||IPC-TM-650 126.96.36.199|
|Td||425||℃ TGA||ASTM D 3850|
|Thermal Conductivity||0.71||W/M/oK||80℃||ASTM C518|
|Moisture Absorption||0.06||%||48hrs immersion 0.060"
sample Temperature 50℃
|ASTM D 570|
|Density||1.79||gm/cm3||23℃||ASTM D 792|
|Copper Peel Stength||1.05
|after solder float 1 oz.
|Lead-free Process Compatible||Yes|
RO4003C Hydrocarbon Ceramic Laminates for High-Performance PCBs
RO4003C is a high-quality hydrocarbon ceramic laminate commonly used in the fabrication of high-frequency printed circuit boards (PCBs). It offers excellent electrical and mechanical properties, making it suitable for applications that require stable and reliable performance in demanding environments. This article will delve into the key features and advantages of RO4003C, as well as its typical properties.
Dielectric Constant and Dissipation Factor:
RO4003C exhibits a low and stable dielectric constant of 3.38±0.05 (process direction) at 10 GHz and 23℃. This property ensures consistent signal integrity and impedance control, making it ideal for high-frequency applications. The dissipation factor (tan δ) of RO4003C is also impressively low, measuring 0.0027 at 10 GHz and 23℃, which contributes to low signal loss and minimal dispersion.
Thermal Stability and Mechanical Strength:
With a thermal coefficient of ε of +40 ppm/℃ and a Tg (glass transition temperature) exceeding 280℃, RO4003C offers excellent dimensional stability and can withstand high-temperature manufacturing processes. It maintains its mechanical strength and electrical properties over a wide temperature range, from -40℃ to +85℃, ensuring reliable operation in various environments. The laminate's tensile modulus and strength provide structural integrity to the PCB, with values of approximately 19,650 MPa and 139 MPa, respectively.
Electrical and Surface Properties:
RO4003C possesses high electrical strength, measuring 31.2 kV/mm (780 V/mil) at a thickness of 0.51 mm (0.020"). This characteristic ensures excellent insulation and prevents electrical breakdown. The volume resistivity of 1.7 x 10^10 xn--M-jlb.cm and surface resistivity of 4.2 x 10^9 MΩ make RO4003C highly suitable for high-frequency and high-speed digital applications.
To dissipate heat effectively, RO4003C offers a thermal conductivity of 0.71 W/M/oK at 80℃. This property helps maintain lower operating temperatures in PCBs, reducing the risk of thermal stress and enhancing overall system reliability.
Lead-Free Process Compatibility:
RO4003C is fully compatible with lead-free PCB assembly processes, making it compliant with environmental regulations and industry standards. This compatibility ensures that electronic products manufactured using RO4003C meet the latest requirements and restrictions related to hazardous substances.
The specified stackup for the 2-layer rigid PCB using RO4003C includes 35 μm finished copper on both sides with a 32 mil RO4003C dielectric layer. The finished board thickness is 0.9 mm, and the finished copper weight is 1 oz (1.4 mils) across all layers. The PCB dimensions are 40 mm x 26 mm, with a tolerance of +/- 0.15 mm. The minimum trace width and spacing are 5/6 mils, and the minimum hole size is 0.3 mm. The board does not have blind or buried vias.
Surface Finish and Masking:
The surface finish chosen for this PCB is Electroless Nickel Electroless Palladium and Immersion Gold (ENEPIG). This finish provides excellent solderability and corrosion resistance, ensuring reliable solder joints. The PCB does not have top or bottom silkscreen or solder mask, and there is no silkscreen on the solder pads.
To ensure the reliability and functionality of the PCB, a 100% electrical test is conducted, verifying the connectivity and proper functioning of the circuit. This comprehensive testing procedure helps identify any potential manufacturing defects and ensures that the final product meets the desired specifications.
RO4003C hydrocarbon ceramic laminates, with their exceptional electrical, thermal, and mechanical properties, are an excellent choice for high-frequency and high-performance PCB applications. Their low dielectric constant, stable signal integrity, and compatibility with lead-free processes make them suitable for a wide range of industries. Whether in telecommunications, aerospace, or automotive electronics, RO4003C enables the development of reliable and efficient electronic products.
For further technical inquiries or to explore the use of RO4003C in your specific PCB project, please contact Ivy at email@example.com.
Contact Person: Ms. Ivy Deng