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Product Details:
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| High Light: | DK 6.15 RF PCB Board,50mil Dual Layer RF PCB Board,Copper Finished PCB Material |
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We are happy to share the newly shipped PCB with you.It is composed of RT/duroid 6006 ceramic PTFE composites with a dielectric constant of 6.15, ensuring minimal signal loss and maximum efficiency. Supplied by a lead-free process, it is environmentally friendly and can operate in a temperature range of -40℃ to +85℃.
The PCB has a 2-layer rigid stackup with finished copper of 35um and RT/duroid 6006 dielectric 50 mil (1.27mm) to ensure structural stability.
Construction details include board dimensions of 77mm x 59mm, with two types of PCB produced with a tolerance of +/- 0.15mm. The minimum trace/space is 8/7 mils, and the minimum hole size is 0.5mm. It has no blind or buried vias, a finished board thickness of 1.3mm, and a finished copper weight of 1 oz (1.4 mils) on all layers. Via plating thickness is 1 mil, and the surface finish is immersion gold. There is no top or bottom silkscreen, but the top solder mask is green. There is no silkscreen on solder pads, and 100% electrical testing is used for quality assurance.
PCB statistics include 29 components, 54 total pads, 38 thru hole pads, 16 top SMT pads, and no bottom SMT pads. It has 23 vias and 5 nets.
Gerber RS-274-X is used as our standard artwork, and the PCB meets IPC-Class-2 industry standards for high-quality performance.
Our worldwide service ensures that our customers can get their own unique PCB wherever they are. Technical questions can be addressed by contacting Ivy at sales10@bichengpcb.com.
| PCB Material: | Ceramic-PTFE Composites |
| Designation: | RT/duroid 6006 |
| Dielectric constant: | 6.15 |
| Dissipation Factor | 0.0027 10GHz |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil(0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.905mm), 100mil(2.54mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
RT/duroid 6006: The Optimal Choice for High-Frequency Applications
As technology continues to advance, the demand for high-performance printed circuit boards (PCBs) that can handle high-frequency signals is increasing. RT/duroid 6006, a ceramic PTFE composite material, has emerged as the go-to PCB material for high-frequency applications.
| RT/duroid 6006 Typical Value | |||||
| Property | RT/duroid 6006 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 6.15±0.15 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped stripline | |
| Dielectric Constant,εDesign | 6.45 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0027 | Z | 10 GHz/A | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -410 | Z | ppm/℃ | -50℃-170℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 7 x 107 | Mohm.cm | A | IPC 2.5.17.1 | |
| Surface Resistivity | 2 x 107 | Mohm | A | IPC 2.5.17.1 | |
| Tensile Properties | ASTM D638 (0.1/min. strain rate) | ||||
| Young's Modulus | 627(91) 517(75) | X Y | MPa(kpsi) | A | |
| Ultimate Stress | 20(2.8) 17(2.5) | X Y | MPa(kpsi) | A | |
| Ultimate Strain | 12 to 13 4 to 6 | X Y | % | A | |
| Compressive Properties | ASTM D695 (0.05/min. strain rate) | ||||
| Young's Modulus | 1069 (115) | Z | MPa(kpsi) | A | |
| Ultimate Stress | 54(7.9) | Z | MPa(kpsi) | A | |
| Ultimate Strain | 33 | Z | % | ||
| Flexural Modulus | 2634 (382) 1951 (283) | X | MPa(kpsi) | A | ASTM D790 |
| Ultimate Stress | 38 (5.5) | X Y | MPa(kpsi) | A | |
| Deformation under load | 0.33 2.1 | Z Z | % | 24hr/50℃/7MPa 24hr/150℃/7MPa | ASTM D261 |
| Moisture Absorption | 0.05 | % | D48/50℃ 0.050"(1.27mm) thick | IPC-TM-650 2.6.2.1 | |
| Thermal Conductivity | 0.49 | W/m/k | 80℃ | ASTM C518 | |
| Coefficient of Thermal Expansion | 47 34 117 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |
| Td | 500 | ℃ TGA | ASTM D3850 | ||
| Density | 2.7 | g/cm3 | ASTM D792 | ||
| Specific Heat | 0.97(0.231) | j/g/k (BTU/ib/OF) |
Calculated | ||
| Copper Peel | 14.3 (2.5) | pli (N/mm) | after solder float | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Properties and Applications:
RT/duroid 6006 has a dielectric constant of 6.15±0.15, which ensures minimal signal loss and maximum efficiency. It has a low dissipation factor (tanδ) of 0.0027, making it ideal for high-frequency applications. Its thermal coefficient of ε is -410 ppm/℃, which ensures stability in high-temperature environments. RT/duroid 6006 is also lead-free and environmentally friendly, making it a popular choice among manufacturers.
Advantages of RT/duroid 6006:
RT/duroid 6006 has several advantages over other PCB materials. Its exceptional dielectric constant and low dissipation factor allow for optimal signal integrity, reducing the risk of signal distortion or loss. It is also highly stable in high-temperature environments, making it ideal for use in demanding applications. Additionally, it is compatible with lead-free processes, which is essential for manufacturers looking to meet environmental regulations.
Environmental Benefits:
In addition to its exceptional performance, RT/duroid 6006 is also environmentally friendly. It is lead-free and compatible with lead-free processes, making it an ideal choice for manufacturers looking to meet environmental regulations.
Conclusion:
RT/duroid 6006 has emerged as the go-to PCB material for high-frequency applications. Its exceptional signal integrity, stability, and environmental benefits make it an ideal choice for manufacturers looking to design high-performance PCBs. With its unique properties and rigorous quality control standards, RT/duroid 6006 is revolutionizing high-frequency PCB design and unlocking unmatched performance for various applications.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
