Ceramic Filled PTFE PCB Material,
Immersion Gold PCB Blog,
25mil PCB Blog
We are delighted to introduce our newly shipped PCB. Here are the key details of this exceptional product:
1. PCB Material:
- Crafted with RO3006 ceramic-filled PTFE composites for superior reliability.
- Manufactured using a lead-free process, aligning with environmentally conscious practices.
- Supplied for optimal operation within a wide temperature range, from -40℃ to +85℃.
2. Stackup: 2-Layer Rigid PCB
- Features a robust stackup configuration to ensure stability and performance.
- Consists of finished copper layers with a thickness of 35um.
- Incorporates a 25 mil (0.635mm) RO3006 dielectric layer.
- Concludes with an additional finished copper layer of 35um.
3. Construction Details:
- Board dimensions measure 217mm x 102mm, providing ample space for your applications.
- Minimum trace/space of 9/8 mils, allowing for precise circuitry design.
- Supports a minimum hole size of 0.3mm, facilitating efficient connectivity.
- Does not include blind or buried vias, ensuring simplicity and reliability.
- Boasts a finished board thickness of 0.76mm, striking the perfect balance between durability and compactness.
- All layers feature a 1 oz (1.4 mils) finished copper weight, guaranteeing excellent conductivity.
- Via plating thickness of 1 mil, enhancing signal integrity across the board.
- Surface finish is achieved through immersion gold, providing superior corrosion resistance and a smooth contact surface.
- Top silkscreen is elegantly presented in white, aiding component identification.
- Bottom silkscreen is intentionally omitted for a clean aesthetic.
- Top solder mask is applied in a vibrant blue color, protecting the board and enhancing soldering efficiency.
- Bottom solder mask is not included, streamlining the manufacturing process.
- Solder pads are free from silkscreen, ensuring precise and reliable soldering.
- Each board undergoes a rigorous 100% electrical test to guarantee optimal performance.
4. PCB Statistics:
- Accommodates a total of 51 components, enabling versatile applications.
- Boasts 80 pads, ensuring ample connectivity options.
- Includes 59 through-hole pads for secure and robust connections.
- Features 21 top SMT (Surface Mount Technology) pads for surface-mounted components.
- Bottom SMT pads are not present, catering to specific design requirements.
- Contains 75 vias, facilitating efficient signal routing throughout the board.
- Supports 7 nets, allowing for organized and efficient circuitry design.
5. Artwork Format: Gerber RS-274-X
- Supplied in industry-standard Gerber format, ensuring compatibility with various design tools.
6. Accepted Standard: IPC-Class-2
- Manufactured to comply with IPC-Class-2 standards, guaranteeing quality and reliability.
7. Service Area: Worldwide
- Our services are available globally, ensuring accessibility regardless of your location.
8. Contact Info:
- For any technical inquiries or questions, please reach out to Ivy at email@example.com. Our dedicated team is ready to assist you.
|Dielectric Constant,εProcess||6.15±0.05||Z||10 GHz/23℃||IPC-TM-650 18.104.22.168 Clamped Stripline|
|Dielectric Constant,εDesign||6.5||Z||8GHz to 40 GHz||Differential Phase Length Method|
|Dissipation Factor,tanδ||0.002||Z||10 GHz/23℃||IPC-TM-650 22.214.171.124|
|Thermal Coefficient of ε||-262||Z||ppm/℃||10 GHz -50℃to 150℃||IPC-TM-650 126.96.36.199|
|mm/m||COND A||IPC-TM-650 2.2.4|
|Volume Resistivity||105||MΩ.cm||COND A||IPC 188.8.131.52|
|Surface Resistivity||105||MΩ||COND A||IPC 184.108.40.206|
|MPa||23℃||ASTM D 638|
|Moisture Absorption||0.02||%||D48/50||IPC-TM-650 220.127.116.11|
|Thermal Conductivity||0.79||W/M/K||50℃||ASTM D 5470|
|Coefficient of Thermal Expansion
(-55 to 288℃)
|ppm/℃||23℃/50% RH||IPC-TM-650 18.104.22.168|
|Td||500||℃ TGA||ASTM D 3850|
|Density||2.6||gm/cm3||23℃||ASTM D 792|
|Copper Peel Stength||7.1||Ib/in.||1oz,EDC After Solder Float||IPC-TM 2.4.8|
|Lead-free Process Compatible||Yes|
Introducing RO3006: Pioneering a Ceramic-Filled PTFE Composite
RO3006 stands as the epitome of PCB innovation, seamlessly blending ceramic-filled PTFE composites to create a material that surpasses traditional options. Its unique composition ensures exceptional electrical performance and stability, setting it apart from the competition.
Ensuring Quality: Compliant with IPC-Class-2 Standards
Quality reigns supreme, and that's why RO3006 adheres to IPC-Class-2 standards. This unwavering commitment ensures that every PCB meets stringent quality requirements, guaranteeing reliability and consistency across the board.
Global Reach: Seamlessly Serving Customers Worldwide
Wherever you may be, our RO3006 PCBs are readily available to cater to your needs. With a global service area, we remain dedicated to providing exceptional support and delivering the highest quality products to our customers across the globe.
Exploring Key Features: Dielectric Constant, Dissipation Factor, and Thermal Coefficient
RO3006 shines through its exceptional features. Boasting a dielectric constant of 6.15±0.05, it offers unparalleled signal performance. The low dissipation factor of 0.002 ensures minimal signal loss and excellent signal integrity. Additionally, the thermal coefficient of ε, measuring at -262 ppm/℃, guarantees stability and consistent performance across a wide temperature range.
In summary, RO3006 PCBs epitomize a groundbreaking development in the world of electronics. With their extraordinary stability, reliability, and high-performance characteristics, they empower engineers and designers to create cutting-edge solutions. Whether in aerospace, telecommunications, or other industries, RO3006 ensures optimal performance even in extreme conditions. With global availability and compliance with IPC-Class-2 standards, RO3006 is poised to revolutionize your designs and spearhead future innovations. Embrace the power of RO3006 and unlock a new realm of possibilities in PCB technology.
Contact Person: Ms. Ivy Deng