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Product Details:
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| High Light: | 2 Layer RF Microwave PCB,0.6mm RF Microwave PCB,Rigid Printed RF PCB Board |
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It's happy to introduce our newly shipped 2-layer rigid printed circuit board (PCB) made from RT/duroid 6035HTC PTFE Ceramic, which features top-quality performance. Constructed using a lead-free process, this PCB is capable of operating within a temperature range of -40℃ to +85℃, making it suitable for various applications.
The 2-layer rigid PCB has a measurement of 132mm x 101mm with a minimum trace/space of 9/9 mils and a minimum hole size of 0.3mm. The board has no blind or buried vias and has a finished board thickness of 0.6mm with a finished copper weight of 1.5 oz (2.1 mils) all layers. The via plating thickness is 1 mil and the surface finish is immersion silver. The solder pads do not have any silkscreen, and the board has undergone 100% electrical testing.
The PCB consists of 35 components, 90 total pads, and 26 thru-hole pads. It also has 64 top SMT pads, 0 bottom SMT pads, 46 vias, and 12 nets.
The artwork supplied is Gerber RS-274-X, and technical support is available through contacting Ivy at sales10@bichengpcb.com.
Why should use RT/duroid 6035 HTC PCB?
When it comes to selecting the right PCB material for high-performance applications, RT/duroid 6035HTC PTFE Ceramic is an excellent choice. This hydrocarbon/ceramic-based material boasts outstanding properties and characteristics, making it the ideal choice for high-frequency and high-temperature applications.
| Property | RT/duorid 6035HTC | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.50±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.6 | Z | 8 GHz - 40 GHz | Differential Phase Length Method | |
| Dissipation Factor | 0.0013 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -66 | Z | ppm/℃ | -50 ℃to 150℃ | mod IPC-TM-650, 2.5.5.5 |
| Volume Resistivity | 108 | MΩ.cm | A | IPC-TM-650, 2.5.17.1 | |
| Surface Resistivity | 108 | MΩ | A | IPC-TM-650, 2.5.17.1 | |
| Dimensional Stability | -0.11 -0.08 | CMD MD | mm/m (mils/inch) | 0.030" 1oz EDC foil Thickness after etch '+E4/105 | IPC-TM-650 2.4.39A |
| Tensile Modulus | 329 244 | MD CMD | kpsi | 40 hrs @23℃/50RH | ASTM D638 |
| Moisure Absorption | 0.06 | % | D24/23 | IPC-TM-650 2.6.2.1 ASTM D570 | |
| Coefficient of Thermal Expansion (-50 ℃to 288 ℃) | 19 19 39 | X Y Z | ppm/℃ | 23℃ / 50% RH | IPC-TM-650 2.4.41 |
| Thermal Conductivity | 1.44 | W/m/k | 80℃ | ASTM C518 | |
| Density | 2.2 | gm/cm3 | 23℃ | ASTM D792 | |
| Copper Peel Stength | 7.9 | pli | 20 sec. @288 ℃ | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-Free Process Compatible | Yes |
Properties and Characteristics of RT/duroid 6035HTC Material:
RT/duroid 6035HTC material features a dielectric constant of 3.50±0.05 and a low dissipation factor of 0.0013, making it an optimal choice for high-frequency applications. This material also exhibits good thermal conductivity, electrical strength, and mechanical properties, enabling it to withstand high temperatures and harsh environments. Additionally, RT/duroid 6035HTC material is lead-free process compatible, making it a more environmentally friendly option.
Advantages of RT/duroid 6035HTC Material in High-Performance Applications:
RT/duroid 6035HTC material offers several advantages for high-performance PCB designs, including improved signal integrity, reduced loss, and enhanced performance. This material also provides greater design flexibility, allowing for a wide range of applications, such as aerospace, telecommunications, and medical devices. Additionally, RT/duroid 6035HTC material is highly resistant to moisture absorption, ensuring long-lasting performance.
Applications of RT/duroid 6035HTC PCB Material:
RT/duroid 6035HTC material is widely used in high-performance applications, including power amplifiers, satellite communication systems, and medical devices. Its excellent thermal stability and resistance to moisture absorption make it an ideal choice for high-temperature and harsh environments.
Understanding the Dielectric Constant and Dissipation Factor of RT/duroid 6035HTC:
The dielectric constant and dissipation factor are essential properties of RT/duroid 6035HTC material that affect its performance in high-frequency applications. A low dielectric constant and dissipation factor ensure optimal signal transmission and reduced signal loss, making RT/duroid 6035HTC material an ideal choice for high-frequency applications.
Thermal Stability and Coefficient of Thermal Expansion of RT/duroid 6035HTC:
RT/duroid 6035HTC material exhibits excellent thermal stability, with a thermal coefficient of ε of -66 ppm/℃. Its low coefficient of thermal expansion of 19 ppm/℃ ensures minimal dimensional changes due to temperature variations. This makes it an ideal choice for high-temperature applications.
Copper Peel Strength and Flammability of RT/duroid 6035HTC PCBs:
RT/duroid 6035HTC material exhibits excellent copper peel strength, with a value of 7.9 pli. This ensures reliable and long-lasting performance. Additionally, it has a flammability rating of V-0, making it a safe choice for high-performance applications.
Choosing the Right Supplier for Your RT/duroid 6035HTC PCBs:
Selecting the right provider is crucial for designing high-quality PCBs with RT/duroid 6035HTC material. A reliable supplier can provide technical support, offer guidance throughout the design process, and ensure the highest quality and performance of the final product.
In conclusion, RT/duroid 6035HTC PTFE Ceramic PCB material offers outstanding properties and characteristics, making it an ideal choice for high-performance applications. Its excellent thermal stability, low moisture absorption, and lead-free process compatibility make it a more environmentally friendly option. By selecting the right supplier and carefully considering design factors, you can unlock the full potential of RT/duroid 6035HTC material and achieve optimal performance in your PCB project.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
