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2 Layer Rigid Printed RF Microwave PCB RT / Duroid 6035HTC 0.6mm

2 Layer Rigid Printed RF Microwave PCB RT / Duroid 6035HTC 0.6mm

Detail Information
Highlight:

2 Layer RF Microwave PCB

,

0.6mm RF Microwave PCB

,

Rigid Printed RF PCB Board

Product Description

It's happy to introduce our newly shipped 2-layer rigid printed circuit board (PCB) made from RT/duroid 6035HTC PTFE Ceramic, which features top-quality performance. Constructed using a lead-free process, this PCB is capable of operating within a temperature range of -40℃ to +85℃, making it suitable for various applications.

 

The 2-layer rigid PCB has a measurement of 132mm x 101mm with a minimum trace/space of 9/9 mils and a minimum hole size of 0.3mm. The board has no blind or buried vias and has a finished board thickness of 0.6mm with a finished copper weight of 1.5 oz (2.1 mils) all layers. The via plating thickness is 1 mil and the surface finish is immersion silver. The solder pads do not have any silkscreen, and the board has undergone 100% electrical testing.

 

The PCB consists of 35 components, 90 total pads, and 26 thru-hole pads. It also has 64 top SMT pads, 0 bottom SMT pads, 46 vias, and 12 nets.

 

The artwork supplied is Gerber RS-274-X, and technical support is available through contacting Ivy at sales10@bichengpcb.com.

 

2 Layer Rigid Printed RF Microwave PCB RT / Duroid 6035HTC 0.6mm 0


Why should use RT/duroid 6035 HTC PCB?
When it comes to selecting the right PCB material for high-performance applications, RT/duroid 6035HTC PTFE Ceramic is an excellent choice. This hydrocarbon/ceramic-based material boasts outstanding properties and characteristics, making it the ideal choice for high-frequency and high-temperature applications.

 

Property RT/duorid 6035HTC Direction Units Condition Test Method
Dielectric Constant,εProcess 3.50±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.6 Z   8 GHz - 40 GHz Differential Phase Length Method
Dissipation Factor 0.0013 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -66 Z ppm/℃ -50 ℃to 150℃ mod IPC-TM-650, 2.5.5.5
Volume Resistivity 108   MΩ.cm A IPC-TM-650, 2.5.17.1
Surface Resistivity 108   A IPC-TM-650, 2.5.17.1
Dimensional Stability -0.11 -0.08 CMD MD mm/m (mils/inch) 0.030" 1oz EDC foil Thickness after etch '+E4/105 IPC-TM-650 2.4.39A
Tensile Modulus 329 244 MD CMD kpsi 40 hrs @23℃/50RH ASTM D638
Moisure Absorption 0.06   % D24/23 IPC-TM-650 2.6.2.1 ASTM D570
Coefficient of Thermal Expansion (-50 ℃to 288 ℃) 19 19 39 X Y Z ppm/℃ 23℃ / 50% RH IPC-TM-650 2.4.41
Thermal Conductivity 1.44   W/m/k 80℃ ASTM C518
Density 2.2   gm/cm3 23℃ ASTM D792
Copper Peel Stength 7.9   pli 20 sec. @288 ℃ IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-Free Process Compatible Yes        

 

Properties and Characteristics of RT/duroid 6035HTC Material:
RT/duroid 6035HTC material features a dielectric constant of 3.50±0.05 and a low dissipation factor of 0.0013, making it an optimal choice for high-frequency applications. This material also exhibits good thermal conductivity, electrical strength, and mechanical properties, enabling it to withstand high temperatures and harsh environments. Additionally, RT/duroid 6035HTC material is lead-free process compatible, making it a more environmentally friendly option.

 

Advantages of RT/duroid 6035HTC Material in High-Performance Applications:
RT/duroid 6035HTC material offers several advantages for high-performance PCB designs, including improved signal integrity, reduced loss, and enhanced performance. This material also provides greater design flexibility, allowing for a wide range of applications, such as aerospace, telecommunications, and medical devices. Additionally, RT/duroid 6035HTC material is highly resistant to moisture absorption, ensuring long-lasting performance.

 

Applications of RT/duroid 6035HTC PCB Material:
RT/duroid 6035HTC material is widely used in high-performance applications, including power amplifiers, satellite communication systems, and medical devices. Its excellent thermal stability and resistance to moisture absorption make it an ideal choice for high-temperature and harsh environments.

 

Understanding the Dielectric Constant and Dissipation Factor of RT/duroid 6035HTC:
The dielectric constant and dissipation factor are essential properties of RT/duroid 6035HTC material that affect its performance in high-frequency applications. A low dielectric constant and dissipation factor ensure optimal signal transmission and reduced signal loss, making RT/duroid 6035HTC material an ideal choice for high-frequency applications.

 

Thermal Stability and Coefficient of Thermal Expansion of RT/duroid 6035HTC:
RT/duroid 6035HTC material exhibits excellent thermal stability, with a thermal coefficient of ε of -66 ppm/℃. Its low coefficient of thermal expansion of 19 ppm/℃ ensures minimal dimensional changes due to temperature variations. This makes it an ideal choice for high-temperature applications.

 

Copper Peel Strength and Flammability of RT/duroid 6035HTC PCBs:
RT/duroid 6035HTC material exhibits excellent copper peel strength, with a value of 7.9 pli. This ensures reliable and long-lasting performance. Additionally, it has a flammability rating of V-0, making it a safe choice for high-performance applications.

 

Choosing the Right Supplier for Your RT/duroid 6035HTC PCBs:
Selecting the right provider is crucial for designing high-quality PCBs with RT/duroid 6035HTC material. A reliable supplier can provide technical support, offer guidance throughout the design process, and ensure the highest quality and performance of the final product.

 

In conclusion, RT/duroid 6035HTC PTFE Ceramic PCB material offers outstanding properties and characteristics, making it an ideal choice for high-performance applications. Its excellent thermal stability, low moisture absorption, and lead-free process compatibility make it a more environmentally friendly option. By selecting the right supplier and carefully considering design factors, you can unlock the full potential of RT/duroid 6035HTC material and achieve optimal performance in your PCB project.

products
PRODUCTS DETAILS
2 Layer Rigid Printed RF Microwave PCB RT / Duroid 6035HTC 0.6mm
Detail Information
Highlight

2 Layer RF Microwave PCB

,

0.6mm RF Microwave PCB

,

Rigid Printed RF PCB Board

Product Description

It's happy to introduce our newly shipped 2-layer rigid printed circuit board (PCB) made from RT/duroid 6035HTC PTFE Ceramic, which features top-quality performance. Constructed using a lead-free process, this PCB is capable of operating within a temperature range of -40℃ to +85℃, making it suitable for various applications.

 

The 2-layer rigid PCB has a measurement of 132mm x 101mm with a minimum trace/space of 9/9 mils and a minimum hole size of 0.3mm. The board has no blind or buried vias and has a finished board thickness of 0.6mm with a finished copper weight of 1.5 oz (2.1 mils) all layers. The via plating thickness is 1 mil and the surface finish is immersion silver. The solder pads do not have any silkscreen, and the board has undergone 100% electrical testing.

 

The PCB consists of 35 components, 90 total pads, and 26 thru-hole pads. It also has 64 top SMT pads, 0 bottom SMT pads, 46 vias, and 12 nets.

 

The artwork supplied is Gerber RS-274-X, and technical support is available through contacting Ivy at sales10@bichengpcb.com.

 

2 Layer Rigid Printed RF Microwave PCB RT / Duroid 6035HTC 0.6mm 0


Why should use RT/duroid 6035 HTC PCB?
When it comes to selecting the right PCB material for high-performance applications, RT/duroid 6035HTC PTFE Ceramic is an excellent choice. This hydrocarbon/ceramic-based material boasts outstanding properties and characteristics, making it the ideal choice for high-frequency and high-temperature applications.

 

Property RT/duorid 6035HTC Direction Units Condition Test Method
Dielectric Constant,εProcess 3.50±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.6 Z   8 GHz - 40 GHz Differential Phase Length Method
Dissipation Factor 0.0013 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -66 Z ppm/℃ -50 ℃to 150℃ mod IPC-TM-650, 2.5.5.5
Volume Resistivity 108   MΩ.cm A IPC-TM-650, 2.5.17.1
Surface Resistivity 108   A IPC-TM-650, 2.5.17.1
Dimensional Stability -0.11 -0.08 CMD MD mm/m (mils/inch) 0.030" 1oz EDC foil Thickness after etch '+E4/105 IPC-TM-650 2.4.39A
Tensile Modulus 329 244 MD CMD kpsi 40 hrs @23℃/50RH ASTM D638
Moisure Absorption 0.06   % D24/23 IPC-TM-650 2.6.2.1 ASTM D570
Coefficient of Thermal Expansion (-50 ℃to 288 ℃) 19 19 39 X Y Z ppm/℃ 23℃ / 50% RH IPC-TM-650 2.4.41
Thermal Conductivity 1.44   W/m/k 80℃ ASTM C518
Density 2.2   gm/cm3 23℃ ASTM D792
Copper Peel Stength 7.9   pli 20 sec. @288 ℃ IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-Free Process Compatible Yes        

 

Properties and Characteristics of RT/duroid 6035HTC Material:
RT/duroid 6035HTC material features a dielectric constant of 3.50±0.05 and a low dissipation factor of 0.0013, making it an optimal choice for high-frequency applications. This material also exhibits good thermal conductivity, electrical strength, and mechanical properties, enabling it to withstand high temperatures and harsh environments. Additionally, RT/duroid 6035HTC material is lead-free process compatible, making it a more environmentally friendly option.

 

Advantages of RT/duroid 6035HTC Material in High-Performance Applications:
RT/duroid 6035HTC material offers several advantages for high-performance PCB designs, including improved signal integrity, reduced loss, and enhanced performance. This material also provides greater design flexibility, allowing for a wide range of applications, such as aerospace, telecommunications, and medical devices. Additionally, RT/duroid 6035HTC material is highly resistant to moisture absorption, ensuring long-lasting performance.

 

Applications of RT/duroid 6035HTC PCB Material:
RT/duroid 6035HTC material is widely used in high-performance applications, including power amplifiers, satellite communication systems, and medical devices. Its excellent thermal stability and resistance to moisture absorption make it an ideal choice for high-temperature and harsh environments.

 

Understanding the Dielectric Constant and Dissipation Factor of RT/duroid 6035HTC:
The dielectric constant and dissipation factor are essential properties of RT/duroid 6035HTC material that affect its performance in high-frequency applications. A low dielectric constant and dissipation factor ensure optimal signal transmission and reduced signal loss, making RT/duroid 6035HTC material an ideal choice for high-frequency applications.

 

Thermal Stability and Coefficient of Thermal Expansion of RT/duroid 6035HTC:
RT/duroid 6035HTC material exhibits excellent thermal stability, with a thermal coefficient of ε of -66 ppm/℃. Its low coefficient of thermal expansion of 19 ppm/℃ ensures minimal dimensional changes due to temperature variations. This makes it an ideal choice for high-temperature applications.

 

Copper Peel Strength and Flammability of RT/duroid 6035HTC PCBs:
RT/duroid 6035HTC material exhibits excellent copper peel strength, with a value of 7.9 pli. This ensures reliable and long-lasting performance. Additionally, it has a flammability rating of V-0, making it a safe choice for high-performance applications.

 

Choosing the Right Supplier for Your RT/duroid 6035HTC PCBs:
Selecting the right provider is crucial for designing high-quality PCBs with RT/duroid 6035HTC material. A reliable supplier can provide technical support, offer guidance throughout the design process, and ensure the highest quality and performance of the final product.

 

In conclusion, RT/duroid 6035HTC PTFE Ceramic PCB material offers outstanding properties and characteristics, making it an ideal choice for high-performance applications. Its excellent thermal stability, low moisture absorption, and lead-free process compatibility make it a more environmentally friendly option. By selecting the right supplier and carefully considering design factors, you can unlock the full potential of RT/duroid 6035HTC material and achieve optimal performance in your PCB project.

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