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Precision Double Sided PCB Material Rogers RO4003C

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Precision Double Sided PCB Material Rogers RO4003C

Detailed Product Description
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Double Sided RF PCB Material


RO4003C PCB Board


Precision PCB Material

Introducing our newly shipped PCB. This high-quality PCB is designed with the latest technology and premium materials to ensure optimal performance and durability.


The PCB is made of Rogers RO4003C material, which is known for its excellent electrical and mechanical properties. It has a lead-free process and can operate in a wide temperature range of -40℃ to +85℃, making it suitable for a variety of applications.


The double-sided PCB has a base copper of 35um and features RO4003C dielectric with a thickness of 32mil (0.813mm). The finished board thickness is 0.98mm, with a finished copper weight of 1 oz (1.4 mils) on all layers. The PCB has a surface finish of Electroless Nickle and Immersion Gold (ENIG), which offers excellent corrosion resistance and solderability.


The PCB has a board dimension of 42mm x 65mm and a minimum trace/space of 12/14 mils. It has a minimum hole size of 16 mils, with no blind or buried vias. The via plating thickness is 1 mil, and the 0.5mm via is filled by resin and capped. The top solder mask is green, while the bottom solder mask is also green. The PCB has no top or bottom silkscreen.


The PCB has 18 components, 27 total pads, and 59 vias. It has 19 thru-hole pads, 8 top SMT pads, and 0 bottom SMT pads. It has 8 nets, and a 100% electrical test was used to ensure quality and reliability.


If you have any technical questions about the PCB, please contact Ivy at Trust in the quality and reliability of this newly shipped PCB for your electronic project needs.


Precision Double Sided PCB Material Rogers RO4003C 0


RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
Z   10 GHz/23℃
2.5 GHz/23℃
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650
Surface Resistivity 4.2 x 109   COND A IPC-TM-650
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650
Tensile Modulus 19,650(2,850)
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
MPa(ksi) RT ASTM D 638
Flexural Strength 276
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        


RO4003C PCB Material: A Comprehensive Guide for High-Frequency Applications


If you're working on a high-frequency electronic project, the choice of PCB material can make or break its performance and reliability. Among the most popular materials for such applications is RO4003C PCB material. In this comprehensive guide, we'll delve into this material, exploring its properties, benefits, and applications.


Introducing RO4003C PCB Material

RO4003C PCB material is a high-performance laminate material that's widely used in high-frequency applications. It's made of woven glass fabric impregnated with a thermoset resin system and reinforced with ceramic filler. This unique combination of materials gives RO4003C PCB material its exceptional electrical and mechanical properties.


Properties of RO4003C PCB Material

RO4003C PCB material boasts a dielectric constant of 3.38±0.05 (process) and 3.55 (design), making it ideal for high-frequency applications that call for low signal loss and distortion. It also has a low dissipation factor (tan,δ) of 0.0027 (10 GHz/23℃) and 0.0021 (2.5 GHz/23℃), ensuring minimum signal attenuation and low insertion loss.


RO4003C PCB material has impressive thermal stability, with a thermal coefficient of ε of +40 ppm/℃ (-50℃ to 150℃). It also has high volume resistivity (1.7 x 1010 MΩ.cm) and surface resistivity (4.2 x 109 MΩ), guaranteeing a reliable performance even in harsh environments.


Benefits of RO4003C PCB Material

RO4003C PCB material offers numerous advantages over other PCB materials for high-frequency applications. Its low dielectric constant and low dissipation factor ensure minimal signal loss and distortion, while its excellent thermal stability ensures a reliable performance even in high-temperature environments. Additionally, RO4003C PCB material is easy to machine, drill, and plate, making it a versatile material for a wide range of applications.


Applications of RO4003C PCB Material

RO4003C PCB material is extensively used in high-frequency applications such as wireless communications, automotive radar, satellite communications, and military electronics. Its outstanding electrical and mechanical properties make it perfect for applications where signal integrity and reliability are critical.


Design Considerations for RO4003C PCB Material

When designing a circuit using RO4003C PCB material, it's crucial to consider the material's properties and limitations. For example, its low dielectric constant may require wider trace widths and larger via sizes compared to other PCB materials. It's also essential to ensure proper grounding and shielding to minimize electromagnetic interference.


Fabrication of RO4003C PCB Material

RO4003C PCB material can be fabricated using standard PCB manufacturing processes such as drilling, routing, and plating. However, its high ceramic content requires special care during processing to prevent delamination or cracking.


Testing and Quality Control of RO4003C PCB Material

To ensure the quality and reliability of RO4003C PCB material, rigorous testing and quality control procedures are necessary. These may include electrical testing, thermal testing, and mechanical testing to ensure that the material meets its specifications and performs as expected.


Comparison with Other PCB Materials

Compared to other PCB materials such as FR-4 or polyimide, RO4003C PCB material offers superior electrical performance at high frequencies. However, it may have higher cost and more limited availability compared to other materials.


Future Developments in RO4003C PCB Material

As high-frequency applications continue to evolve and become more demanding, the development of new and improved PCB materials is ongoing. One area of focus for RO4003C PCB material is the development of thinner and more flexible versions that can meet the demands of next-generation electronic devices.


In conclusion, RO4003C PCB material is a high-performance material that offers exceptional electrical and mechanical properties for high-frequency applications. Its low dielectric constant, low dissipation factor, and excellent thermal stability make it a top choice for applications where signal integrity and reliability are critical. When designing circuits using RO4003C PCB material, it's crucial to consider its unique properties and limitations and to ensure rigorous testing and quality control to ensure its performance and reliability.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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