Today, we are delighted to introduce our newly shipped PCB, which has been made with high-quality Rogers RO3010 material and has been processed using a lead-free method, making it suitable for operation in temperatures ranging from -40℃ to +85℃.
The stack-up comprises base copper of 17um, RO3003 dielectric of 25mil, and another base copper of 17um.
With board dimensions of 80 x 60 mm and a tolerance of +/- 0.15mm, the minimum trace/space is 7/7 mils, and the minimum hole size is 15 mils. There are no blind or buried vias, and the finished board thickness is 0.8 mm. The finished Cu weight is 1 oz (1.4 mils) for all layers, and the via plating thickness is 1 mil.
The surface finish, consisting of Electroless Nickel and Immersion Gold (ENIG), features a white top silkscreen and a green top solder mask. There is no bottom silkscreen or bottom solder mask, and no silkscreen on solder pads. The board undergoes a 100% electrical test.
Impedance matching is not included, and a solder paste stencil is supplied for the top side.
The PCB has 19 components, 38 total pads, 21 thru hole pads, 17 top SMT pads, 0 bottom SMT pads, 35 vias, and 15 nets.
For any technical questions, please contact Ivy at sales10@bichengpcb.com.
RO3010: The material you need for reliable performance in harsh environments
The high-frequency PCB market is continuously expanding, and RO3010 is the leading material for designing high-performance PCBs. RO3010 boasts a dielectric constant of 10.2±0.5, making it the ideal choice for high-frequency applications. Additionally, its low dissipation factor (tanδ) of 0.0027 and thermal coefficient of ε at 10 GHz 23℃ make it a reliable material for PCB design.
RO3010 is known for its dimensional stability and surface resistivity, ensuring that it can withstand harsh environments while maintaining optimal performance over time. Its tensile modulus and water absorption rates also make it an excellent choice for high-density PCBs.
Designers must consider RO3010's thermal conductivity and coefficient of thermal expansion when designing PCBs with this material to ensure optimal performance. RO3010's copper peel strength, which measures 11 pli, makes it the perfect choice for high-density PCBs.
RO3010 is a safe and sustainable choice for PCB design since it is lead-free process compatible and meets industry standards for flammability.
In conclusion, RO3010 is an excellent choice for high-frequency PCB design. Its dielectric constant, thermal coefficient, surface resistivity, dimensional stability, thermal conductivity, copper peel strength, lead-free process compatibility, and flammability make it a reliable and high-performance material for high-density PCBs. With RO3010, designers can create PCBs that meet even the most demanding requirements and push the limits of what is possible in PCB design.
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