Payment & Shipping Terms:
|Base Material:||RO4003C||PCB Size:||90 X 90 Mm=1PCS|
|Copper Weight:||1oz||Surface Finish:||ENEPIG|
|Layer Count:||3 Layer||PCB Thickness:||20 Mil|
RO4003C Ultimate PCB Material,
High Frequency PCB Material 1oz,
3 Layer RF PCB Board
We are excited to introduce our latest PCB product made with Rogers RO4003C material and a lead-free process. This PCB offers reliable operation in a temperature range of -40℃ to +85℃, making it ideal for various applications.
The PCB stack-up includes base copper of 17um, RO4003C dielectric of 20mil, RO4450F prepreg, base copper of 17um, RO4003C dielectric of 60mil, RO4450F prepreg, RO4003C dielectric of 60mil, RO4450F prepreg, RO4003C dielectric of 20mil, and base copper of 17um. The board dimensions are 90 x 90 mm, with a minimum Trace/Space of 5/5 mils and a minimum Hole Size of 16 mils. The finished board thickness is 4.8 mm, with a finished Cu weight of 1 oz (1.4 mils) all layers and via plating thickness of 1 mil. The surface finish is Immersion Nickle Immersion Palladium and Immersion Gold (ENEPIG), and the top and bottom silkscreen are not included. The top and bottom solder mask is Matt Black, and there is no silkscreen on the solder pads. The PCB has passed a 100% electrical test.
The minimum via needs to be filled with copper paste for better thermal dissipation, and countersunk holes are required to avoid screw protrusion and ensure a flat installation surface. Solder paste stencils are supplied for the top side.
The PCB includes 31 components, with a total of 92 pads, 51 through-hole pads, 15 top SMT pads, 26 bottom SMT pads, 59 vias, and 75 nets.
If you have any technical questions, please feel free to contact Ivy at firstname.lastname@example.org.
Choose RO4003C for superior high integrity and high-frequency applications
In the world of printed circuit boards (PCBs), signal integrity and performance are crucial. The choice of material is essential for any high-frequency application. RO4003C is the ultimate PCB material for such applications. Its exceptional properties and performance characteristics make it the go-to choice for designers looking to optimize their circuits.
Properties and Performance Characteristics of RO4003C
RO4003C is a high-performance PCB material made with ceramic-filled hydrocarbon. This combination provides excellent electrical properties, including a dielectric constant of 3.38±0.05 at 10 GHz and a dissipation factor of 0.0027 at 10 GHz/23℃. These properties ensure optimal signal integrity, making it ideal for high-speed digital and RF circuits.
RO4003C also has a high thermal conductivity of 0.71 W/M/oK at 80℃, which makes it an excellent choice for applications that require efficient heat dissipation. It has a low coefficient of thermal expansion (CTE) of 11 ppm/℃ in the X direction, 14 ppm/℃ in the Y direction, and 46 ppm/℃ in the Z direction, which ensures dimensional stability in extreme temperature environments.
Advantages of RO4003C Over Other PCB Materials
Compared to other PCB materials, RO4003C offers several advantages. It has a lead-free process compatibility, making it an environmentally friendly option. It has a higher thermal conductivity than FR-4, which means it can handle higher power levels without overheating. It also has a lower dielectric loss than other high-frequency materials like PTFE, which translates to better signal integrity and reduced signal loss.
RO4003C PCB Design Considerations for Optimal Performance
Designing with RO4003C requires specific considerations. For example, the thickness of the dielectric layers affects the characteristic impedance, which must be carefully controlled for proper signal propagation. The substrate's surface finish is also critical to ensure reliable soldering and interconnectivity.
Applications of RO4003C PCBs in Various Industries
RO4003C is widely used in various industries, including telecommunications, aerospace and defense, medical, and automotive. Its exceptional performance characteristics make it an ideal choice for high-frequency applications in these industries. For example, it is frequently used in 5G and IoT applications, where signal integrity is critical for reliable communication. It is also used in aerospace and defense applications, where the circuits must withstand extreme temperature and humidity conditions.
RO4003C and the Future of High-Speed Digital Design
As digital design evolves, the demand for materials that can handle higher speeds and frequencies will only increase. RO4003C is well-positioned to meet these demands, thanks to its exceptional performance characteristics. Its low dielectric loss and high thermal conductivity make it an ideal choice for high-speed digital design applications, such as data centers and high-performance computing.
RO4003C PCB Fabrication and Assembly
RO4003C PCBs require specialized fabrication and assembly processes to ensure optimal performance. For example, the minimum via size must be carefully controlled to prevent signal loss, and countersunk holes are required to ensure a flat installation surface. Solder paste stencils are also supplied for the top side to ensure reliable soldering.
Troubleshooting Common Issues with RO4003C PCBs
Despite its exceptional performance characteristics, designers may encounter issues when working with RO4003C PCBs. For example, issues with soldering and interconnectivity can arise if the substrate's surface finish is not properly controlled. Understanding these issues and how to troubleshoot them is critical for ensuring optimal performance.
RO4003C and Lead-Free Process Compatibility
RO4003C is compatible with lead-free processes, making it an environmentally friendly option for designers. This compatibility ensures that designers can meet environmental regulations without sacrificing performance.
RO4003C vs. Other High-Frequency PCB Materials: A Comparative Analysis
While RO4003C offers exceptional performance characteristics, designers may wonder how it compares to other high-frequency PCB materials. A comparative analysis can help designers understand how RO4003C stacks up against other options and make an informed decision when selecting a PCB material.
RO4003C is the ultimate PCB material for high-frequency applications. Its exceptional properties and performance characteristics make it an ideal choice for designers looking to optimize their circuits. From 5G and IoT applications to aerospace and defense, RO4003C is well-positioned to meet the demands of various industries. By understanding its properties, design considerations, and troubleshooting common issues, designers can unlock the full potential of RO4003C for their applications.
Contact Person: Ms. Ivy Deng