Payment & Shipping Terms:
|Base Material:||Rogers 4300C||PCB Size:||180 X 156mm=1PCS|
|Copper Weight:||1oz||Surface Finish:||Immersion Gold|
|Layer Count:||2 Layer||PCB Thickness:||32 Mil|
High Frequency PCB 2 Layer,
32 Mil High Frequency PCB,
4003 Rogers PCB Board
The ultimate choice for high-speed digital and RF applications
Today, we are happy to share our newly shipped PCB which is made of high-quality Rogers RO4003C material that ensures reliable performance even in challenging environments. The lead-free process used in its construction makes it an environmentally friendly choice. With a wide operating temperature range of -40℃ to +85℃, this PCB is designed to withstand extreme temperature conditions.
The stack-up of this PCB comprises of base copper of 17um, a dielectric layer of 32mil, and another base copper layer of 17um, providing excellent electrical characteristics and mechanical stability. The PCB dimensions are 180 x 156 mm, with a thickness of 0.98 mm, and a finished copper weight of 1 oz (1.4 mils) across all layers.
The construction details of this PCB include minimum trace/space of 6/6 mils and minimum hole size of 15 mils, making it ideal for complex and high-density applications. It also features plated-through slotted holes and no blind or buried vias, ensuring seamless connectivity and ease of assembly. The surface finish of this PCB is ENIG (Immersion gold), which provides excellent corrosion resistance, and the top solder mask is green.
This PCB comes with a panelized solder paste stencil for the top side, making it easy to assemble components with precision. A total of 210 components, 306 pads, 129 through-hole pads, 90 top SMT pads, 87 bottom SMT pads, 331 vias, and 118 nets are included.
We have conducted a 100% electrical test to ensure the quality and reliability of this PCB. For any technical questions, please contact Ivy at email@example.com. Order our high-quality PCB today and experience outstanding reliability and performance in your electronic applications.
Why RO4003C PCBs are the Top Choice for Advanced Electronic Device
- Advantages of 32 mil RO4003C PCBs for High-Speed Applications
The demand for high-performance electronics is on the rise, and with it, the need for advanced PCBs capable of handling complex and high-speed applications. RO4003C is a high-quality PCB material that has gained popularity in recent years due to its excellent electrical properties and mechanical stability. In this article, we will explore the benefits of 32 mil RO4003C PCBs for high-performance applications.
Introduction to RO4003C PCBs
RO4003C is a high-frequency laminate material made of a woven-glass reinforced hydrocarbon/ceramic composite, which provides low-loss dielectric properties for high-speed digital and RF applications. It features a dielectric constant of 3.38 ± 0.05 and a dissipation factor of 0.0027 at 10 GHz/23℃, making it an ideal choice for high-frequency designs.
Dielectric Constant and Dissipation Factor of RO4003C PCBs
The low-loss dielectric constant of RO4003C PCBs ensures superior signal integrity, reducing signal loss and distortion. The dissipation factor of RO4003C PCBs is also very low, meaning that it can effectively handle high-frequency signals without generating excess heat.
Thermal Properties of RO4003C PCBs
RO4003C PCBs have excellent thermal properties, allowing them to perform reliably in challenging environments. The thermal coefficient of ε is +40 ppm/℃ across a temperature range of -50℃ to 150℃, ensuring that the PCB can withstand extreme temperature conditions.
Electrical Properties of RO4003C PCBs
RO4003C PCBs have high electrical strength, with a value of 31.2 (780) Kv/mm (v/mil) at 0.51mm (0.020") thickness. They also have excellent volume resistivity and surface resistivity, ensuring reliable electrical performance.
Mechanical Properties of RO4003C PCBs
RO4003C PCBs have impressive mechanical properties, including high tensile strength and flexural strength. With a tensile modulus of 19,650 MPa in the X direction and 19,450 MPa in the Y direction, these PCBs can withstand bending and stretching without breaking.
Lead-Free Processing and Environmental Benefits of RO4003C PCBs
RO4003CPCBs are manufactured using a lead-free process, making them an eco-friendly option. This process also ensures that the PCBs meet industry standards for hazardous material restrictions, such as the Restriction of Hazardous Substances (RoHS) directive.
Advantages of 32 mil RO4003C PCBs for High-Speed Applications
The thickness of 32 mil RO4003C PCBs makes them an ideal choice for high-speed digital and RF applications, where signal integrity is critical. The minimum trace/space of 6/6 mils and minimum hole size of 15 mils of these PCBs allow for high-density designs, making them suitable for complex applications.
Design Considerations for RO4003C PCBs
When designing PCBs with RO4003C material, it is essential to consider factors such as impedance control, transmission line design, and signal integrity. The design should also take into account the thermal and mechanical properties of the material to ensure reliable performance.
Manufacturing and Assembly of RO4003C PCBs
RO4003C PCBs are manufactured using a state-of-the-art process that ensures consistent quality and reliability. The surface finish of these PCBs is ENIG (Immersion gold), which provides excellent corrosion resistance, and the top solder mask is green. The PCBs are also panelized with a solder paste stencil for easy and precise assembly.
Applications of RO4003C PCBs in High-Tech Industries
RO4003C PCBs are widely used in high-tech industries such as aerospace, defense, telecommunications, and medical devices. They are also used in high-speed digital and RF applications, such as radar systems, satellite communications, and microwave circuits.
In conclusion, 32 mil RO4003C PCBs offer a range of benefits for high-performance applications. Their low-loss dielectric material, exceptional thermal and mechanical properties, and lead-free processing make them an excellent choice for high-tech industries. With precision design and manufacturing, these PCBs can maximize performance and efficiency in complex and demanding applications.
Contact Person: Ms. Ivy Deng