60 Mil RO4003C Low Dissipation Factor PCB Material With Immersion Gold Plating

We are glad to introduce our latest PCB made of RO4003C substrate which is provide tight control on dielectric constant and low dissipation factor.

Our newly shipped PCB is made from high-quality Rogers RO4003C material, ensuring reliable and efficient performance. It is designed to operate in a wide temperature range of -40℃ to +85℃ and utilizes a lead-free process.

The PCB's construction details include a dielectric thickness of 60mil, a base copper thickness of 17um, and another base copper thickness of 17um. The board dimensions are 32.00 x 54.00 mm with a tolerance of +/-0.15mm. The minimum trace/space and minimum hole size are 6/8 mils and 17 mils, respectively. This PCB does not have any blind or buried vias and has a finished thickness of 1.7 mm.

The finished Copper weight for all layers is 1 oz (1.4 mils), and the via plating thickness is 1 mil. The PCB's surface finish is immersion gold (ENIG), with a green top solder mask and no bottom solder mask. There is no silkscreen on the solder pads. A 100% electrical test has been conducted on the board to ensure its quality.

A panelized solder paste stencil is supplied for the top side of the PCB, making assembly easier. The PCB contains a total of 19 components, 24 pads, 9 thru-hole pads, 17 top SMT pads, 8 bottom SMT pads, 98 vias, and 115 nets.

Please note that impedance matching, +/- 10%, is not included in this PCB. If you have any technical questions or concerns, Ivy at sales10@bichengpcb.com can provide assistance.

Overall, this PCB offers high quality, reliability, and efficiency for a wide range of applications. Its precise and high-performance design ensures that it meets your needs.

Introduction of RO4003C

RO4003C is a high-frequency laminate material that is ideal for use in PCB fabrication. It has several advantages that make it a great choice for your next PCB project. In this article, we will explore the benefits of using RO4003C in your newly shipped PCB and the properties that make it stand out from other materials.

The properties of RO4003C

RO4003C is a woven glass reinforced hydrocarbon/ceramic composite that has a dielectric constant of 3.38±0.05 and a dissipation factor of 0.0027. These properties make it a reliable material for PCB fabrication. RO4003C also has a thermal coefficient of ε of +40 ppm/℃ and a volume resistivity of 1.7 x 1010 MΩ.cm, which are essential for high-frequency applications.

Advantages of Using RO4003C in PCB Fabrication

RO4003C has several advantages that make it an ideal material for PCB fabrication. Its excellent electrical properties make it perfect for high-frequency applications. Additionally, RO4003C is compatible with lead-free processes, making it an environmentally friendly option. Its low moisture absorption rate of 0.06% ensures the reliability of your PCB.

Understanding the Dielectric Constant and Dissipation Factor of RO4003C

The dielectric constant and dissipation factor are crucial properties of RO4003C. The dielectric constant determines the material's ability to store electrical energy, while the dissipation factor represents the amount of energy lost as heat. RO4003C has a dielectric constant of 3.38±0.05 and a dissipation factorof 0.0027, making it an ideal material for high-frequency applications that require reliable electrical performance.

Thermal Properties of RO4003C and Its Impact on PCB Design

RO4003C's thermal coefficient of ε of +40 ppm/℃ means that its dielectric constant changes with temperature. This property can impact your PCB's performance, especially in high-temperature environments. Therefore, it is crucial to consider the thermal properties of RO4003C when designing your PCB.

Electrical Properties of RO4003C for High-Frequency PCB Applications

RO4003C has excellent electrical properties, including a low dielectric loss and a high dielectric strength. These properties make it ideal for high-frequency applications that require reliable electrical performance. Additionally, RO4003C's low loss tangent reduces the likelihood of producing electromagnetic interference (EMI).

RO4003C's Compatibility with Lead-Free Processes

RO4003C is compatible with lead-free processes, making it an environmentally friendly option for PCB fabrication. With lead-free processes becoming increasingly popular due to environmental concerns and regulations, using RO4003C ensures that your PCB meets these requirements.

How RO4003C Improves PCB Performance and Reliability

RO4003C's exceptional electrical and thermal properties make it an ideal material for improving PCB performance and reliability. Its low moisture absorption rate and compatibility with lead-free processes ensure that your PCB is reliable in the long run. Additionally, RO4003C's dimensional stability and coefficient of thermal expansion make it a stable material that can withstand temperature changes and mechanical stress.

Testing Methods for RO4003C and PCB Manufacturing

Various testing methods ensure the quality and reliability of RO4003C and PCB manufacturing. These testing methods ensure that the RO4003C used in your PCB meets industry standards and performs reliably.

Why RO4003C is the Ideal Material for Your Next PCB Project

In conclusion, RO4003C is an exceptional material that offers unparalleled benefits for PCB fabrication. Its outstanding electrical, thermal, and dimensional properties make it an ideal choice for high-frequency applications. Furthermore, RO4003C is compatible with lead-free processes, ensuring that your PCB meets environmental standards. By utilizing RO4003C in your next PCB project, you can optimize your PCB's performance and reliability, making it a wise and practical investment. With its superior properties, RO4003C is the future of PCB materials and a game-changer in the electronics industry.