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RO4835 Rogers RF PCB Board 30mil ED Copper Multilayer PCB
  • name
  • name

RO4835 Rogers RF PCB Board 30mil ED Copper Multilayer PCB

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-199.V1.0
Base Material:
Hydrocarbon Ceramic Laminates
Layer Count:
Double Sided PCB, Multilayer PCB, Hybrid PCB
PCB Thickness:
4mil (0.102mm), 7.3mil (0.186mm), 10.7mil (0.272mm), 20.7mil (0.526mm), 30.7mil (0.780mm), 60.7mil (1.542mm)
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish:
Bare Copper, HASL, ENIG, Immersion Silver, Immersion Tin, OSP, Pure Gold Plated Etc..
Highlight:

RO4835 RF Circuit Board

,

30mil Multilayer RF PCB

,

ED Copper RF Printed Circuit Board

Product Description

 

Rogers RO4835 High Frequency PCB 10mil 20mil 30mil ED Copper 10.7mil 20.7mil 30.7mil LoPro Copper

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

Rogers RO4835 substrates are hydrocarbon ceramic laminates, a type of antioxidative high frequency materials for applications demanding greater stability at elevated temperatures. It is significantly more resistant to oxidation than other hydrocarbon based materials. RO4835 laminates are designed to offer superior high frequency performance and low cost circuit fabrication. Moreover, RO4835 material provides nearly identical electrical and mechanical properties to RO4350B laminates, which customers have used successfully for many years.

 

Oxidation affects all thermoset laminate materials over time and temperature. In the long term, oxidation can lead to small increases in dielectric constant and dissipation factor of the circuit substrate.

 

RO4835 Rogers RF PCB Board 30mil ED Copper Multilayer PCB 0

 

Features and Benefits

1. Significantly improved oxidation resistance compared to typical thermoset microwave materials, which are designed for performance sensitive, high volume applications.

2. Low loss exhibits excellent electrical performance allowing application with higher operating frequencies, especially ideal for automotive applications.

3. Tight dielectric constant tolerance results in controlled impedance transmission lines

4. Lead-free process compatible results in no blistering or delamination

5. Low Z-axis expansion results in reliable plated through holes

6. Low in-plane expansion coefficient remains stable over an entire range of circuit processing temperatures

7. CAF resistant

 

Our PCB Capability (RO4835)

PCB Material: Hydrocarbon Ceramic Laminates
Designation: RO4835
Dielectric constant: 3.48 (10 GHz)
Dissipation Factor 0.0037 (10 GHz)
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (ED copper) 6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
Dielectric thickness (LoPro copper) 4mil (0.102mm), 7.3mil (0.186mm), 10.7mil (0.272mm), 20.7mil (0.526mm), 30.7mil (0.780mm), 60.7mil (1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

The typical Applications for RO4835 PCB include automotive radar and sensors, point-to-point microwave, power amplifiers, phased - array radar, RF components.

 

Appendix: Typical Values of RO4835

Property RO4835 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.48±0.05 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.66 Z - 8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0037 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +50 Z ppm/℃ -100℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 5 x 108   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 7 x108   MΩ COND A IPC-TM-650 2.5.17.1
Electrical Strength 30.2(755) Z Kv/mm(v/mil)   IPC-TM-650 2.5.6.2
Tensile Modulus 7780(1128) Y MPa(ksi) RT ASTM D 638
Tensile Strength 136(19.7) Y MPa(ksi) RT ASTM D 638
Flexural Strength 186 (27)   Mpa (kpsi)   IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m
(mils/inch)		 after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 10
12
31		 X
Y
Z		 ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 390   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.66   W/m/oK 80℃ ASTM C518
Moisture Absorption 0.05   % 48hrs immersion 0.060"
sample Temperature 50℃		 ASTM D 570
Density 1.92   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 0.88 (5.0)   N/mm (pli) after solder float 1 oz.
EDC Foil		 IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

RO4835 Rogers RF PCB Board 30mil ED Copper Multilayer PCB 1

 

Tags: 

1oz RF PCB Board,  

1.6mm RF PCB Board,  

0.635mm RF PCB Board

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products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
RO4835 Rogers RF PCB Board 30mil ED Copper Multilayer PCB
  • name
  • name
RO4835 Rogers RF PCB Board 30mil ED Copper Multilayer PCB
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-199.V1.0
Base Material:
Hydrocarbon Ceramic Laminates
Layer Count:
Double Sided PCB, Multilayer PCB, Hybrid PCB
PCB Thickness:
4mil (0.102mm), 7.3mil (0.186mm), 10.7mil (0.272mm), 20.7mil (0.526mm), 30.7mil (0.780mm), 60.7mil (1.542mm)
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish:
Bare Copper, HASL, ENIG, Immersion Silver, Immersion Tin, OSP, Pure Gold Plated Etc..
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

RO4835 RF Circuit Board

,

30mil Multilayer RF PCB

,

ED Copper RF Printed Circuit Board

Product Description

 

Rogers RO4835 High Frequency PCB 10mil 20mil 30mil ED Copper 10.7mil 20.7mil 30.7mil LoPro Copper

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

Rogers RO4835 substrates are hydrocarbon ceramic laminates, a type of antioxidative high frequency materials for applications demanding greater stability at elevated temperatures. It is significantly more resistant to oxidation than other hydrocarbon based materials. RO4835 laminates are designed to offer superior high frequency performance and low cost circuit fabrication. Moreover, RO4835 material provides nearly identical electrical and mechanical properties to RO4350B laminates, which customers have used successfully for many years.

 

Oxidation affects all thermoset laminate materials over time and temperature. In the long term, oxidation can lead to small increases in dielectric constant and dissipation factor of the circuit substrate.

 

RO4835 Rogers RF PCB Board 30mil ED Copper Multilayer PCB 0

 

Features and Benefits

1. Significantly improved oxidation resistance compared to typical thermoset microwave materials, which are designed for performance sensitive, high volume applications.

2. Low loss exhibits excellent electrical performance allowing application with higher operating frequencies, especially ideal for automotive applications.

3. Tight dielectric constant tolerance results in controlled impedance transmission lines

4. Lead-free process compatible results in no blistering or delamination

5. Low Z-axis expansion results in reliable plated through holes

6. Low in-plane expansion coefficient remains stable over an entire range of circuit processing temperatures

7. CAF resistant

 

Our PCB Capability (RO4835)

PCB Material: Hydrocarbon Ceramic Laminates
Designation: RO4835
Dielectric constant: 3.48 (10 GHz)
Dissipation Factor 0.0037 (10 GHz)
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (ED copper) 6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
Dielectric thickness (LoPro copper) 4mil (0.102mm), 7.3mil (0.186mm), 10.7mil (0.272mm), 20.7mil (0.526mm), 30.7mil (0.780mm), 60.7mil (1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

The typical Applications for RO4835 PCB include automotive radar and sensors, point-to-point microwave, power amplifiers, phased - array radar, RF components.

 

Appendix: Typical Values of RO4835

Property RO4835 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.48±0.05 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.66 Z - 8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0037 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +50 Z ppm/℃ -100℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 5 x 108   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 7 x108   MΩ COND A IPC-TM-650 2.5.17.1
Electrical Strength 30.2(755) Z Kv/mm(v/mil)   IPC-TM-650 2.5.6.2
Tensile Modulus 7780(1128) Y MPa(ksi) RT ASTM D 638
Tensile Strength 136(19.7) Y MPa(ksi) RT ASTM D 638
Flexural Strength 186 (27)   Mpa (kpsi)   IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m
(mils/inch)		 after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 10
12
31		 X
Y
Z		 ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 390   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.66   W/m/oK 80℃ ASTM C518
Moisture Absorption 0.05   % 48hrs immersion 0.060"
sample Temperature 50℃		 ASTM D 570
Density 1.92   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 0.88 (5.0)   N/mm (pli) after solder float 1 oz.
EDC Foil		 IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

RO4835 Rogers RF PCB Board 30mil ED Copper Multilayer PCB 1

 

Tags: 

1oz RF PCB Board,

1.6mm RF PCB Board,

0.635mm RF PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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