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Tg170 FR4 Multi Layer Printed Circuit Board 8 Layer PCB Board

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Tg170 FR4 Multi Layer Printed Circuit Board 8 Layer PCB Board

Tg170 FR4 Multi Layer Printed Circuit Board 8 Layer PCB Board
Tg170 FR4 Multi Layer Printed Circuit Board 8 Layer PCB Board Tg170 FR4 Multi Layer Printed Circuit Board 8 Layer PCB Board Tg170 FR4 Multi Layer Printed Circuit Board 8 Layer PCB Board Tg170 FR4 Multi Layer Printed Circuit Board 8 Layer PCB Board Tg170 FR4 Multi Layer Printed Circuit Board 8 Layer PCB Board

Large Image :  Tg170 FR4 Multi Layer Printed Circuit Board 8 Layer PCB Board

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-481.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: FR-4 Layer Count: 8 Layers
PCB Thickness: 1.6mm ±0.16 PCB Size: 210.72 X 212.42mm=1UP
Solder Mask: Green Silkscreen: White
Copper Weight: 1oz Surface Finish: Immersion Gold
High Light:

Tg170 FR4 Multi layer Printed Circuit Board

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Tg170 Multi layer Printed Circuit Board

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Tg170 FR4 8 Layer PCB Board

 
Multi-layer Printed Circuit Board 8 Layer PCB Board Built on Tg170 FR-4 With Immersion Gold for Wireless Communication.
 
 
1.1 General description
This is a type of 8 layer printed circuit board built on FR-4 Tg170 substrate for the application of Wireless Communication. It's 1.6 mm thick with white silkscreen on green solder mask and immersion gold on pads. The base material is from ITEQ supply 1 up board per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panels are packed for shipment.
 
1.2 Features and benifits
Industrial standard material with high Tg (175℃ by DSC) and excellent thermal reliability.
High solderability, no stressing of circuit boards and less contamination of PCB surface.
Electrical test and high voltage test
Quick and on-time delivery
Money-saving, Worry-saving and Labor-saving
Free-of-charge PCB prototype test
 
1.3 Applications
Video Surveillance
Converters
Electrical Converter
Embedded System Applications
 
Tg170 FR4 Multi Layer Printed Circuit Board 8 Layer PCB Board 0
 
1.4 Parameter and data sheet
Number of Layers 8
Board Type Multilayer PCB
Board size 210.72 x 212.42mm=1UP
Board Thickness 1.60 mm +/-0.16
Board Material FR-4
Board Material Supplier ITEQ
Tg Value of Board Material 170℃
 
PTH Cu thickness ≥20 um
Inner Iayer Cu thicknes 35 um (1oz)
Surface Cu thickness 35 um (1oz)
 
Solder Mask Type and Model No. LPSM, PSR-2000GT600D
Solder Mask Supplier TAIYO
Solder Mask Colour Green
Number of Solder Masks 2
Thickness of Solder Mask 14 um
 
Type of Silkscreen Ink IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 1
 
Mininum Trace (mil) 5.8 mil
Minimum Gap(mil) 5.4 mil
 
Surface Finish Immersion Gold
RoHS Required Yes
Warpage 0.25%
Thermal Shock Test Pass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Solderablity Test Pass, 255±5℃,5 seconds Wetting Area Least 95%
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6012C Class 2
Drill table (mm)  
T1 0.450
T2 0.600
T3 0.800
T4 0.900
T5 0.950
T6 1.000
T7 1.250
T8 1.300
T9 1.400
T10 1.600
T11 1.700
T12 2.000
T13 2.550
T14 3.000
T15 3.250
T16 3.500
 
1.5 Design For Manufacture (5)
Serial NO. Procedure Item Manufacturing capability
Large volume (S<100 m²) Middle volume (S<10 m²) Prototype(S<1m²)
66 Contour process Method of contour process CNC milling, V-CUT, Break-out tap, break-out holes, Punching
67 Minimum router 0.8mm
68 Min.tolerance of contour ±0.15mm ±0.13mm ±0.1mm
69 Min.distance of milling contour(no copper exposure) 12mil 10mil 8mil
70 Angle of V-CUT 20,30,45,60 ±5 degree
71 Degree of symmetry of V-CUT ±6mil ±5mil ±4mil
72 Tolerance of residual thickness of V-CUT ±6mil ±5mil ±4mil
73 Tolerance of Chamfer angle of Gold finger ±5 degree ±5 degree ±5 degree
74 Tolerance of residual thickness of bevel edge of gold finger ±5mil ±5mil ±5mil
75 Min radius of inner corner 0.4mm
76 Min. distance from edge to V-Cut (no copper exposure) 18mil (1.6mm Thick, 20 degree V-groove cutter) 14mil(1.6mm Thick, 20 degree V-groove cutter) 12mil (1.6mm Thick, 20 degree V-groove cutter)
77 20mil (1.6mm Thick, 30 degree V-groove cutter) 18mil (1.6mm Thick, 30 degree V-groove cutter) 16mil (1.6mm Thick, 30 degree V-groove cutter)
78 24mil (1.6mm Thick, 45 degree V-groove cutter) 22mil (1.6mm Thick, 45 degree V-groove cutter) 20mil (1.6mm Thick, 45 degree V-groove cutter)
79 30mil (1.6mm Thick, 60 degree V-groove cutter) 28mil (1.6mm Thick, 60 degree V-groove cutter) 26mil (1.6mm Thick, 60 degree V-groove cutter)

 

Tg170 FR4 Multi Layer Printed Circuit Board 8 Layer PCB Board 1

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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