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Product Details:
Payment & Shipping Terms:
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| Base Material: | Polyimide | Layer Count: | 2 Layers |
|---|---|---|---|
| PCB Thickness: | 0.2mm ±0.05 | PCB Size: | 65 X 51mm=1PCS |
| Coverlay: | Yellow | Silkscreen: | N/A |
| Copper Weight: | 1oz | Surface Finish: | Tin Electro-plated |
Tin-plated Flexible Printed Circuit Board FPCB with FR-4 Stiffener for LCD Module
(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)
Specifications
| PCB SIZE | 65 x 51mm=1PCS |
| Base Material: | Polyimide |
| Number of Layers | Double sided PCB |
| SMT | no |
| Through Hole Components | yes |
| LAYER STACKUP | Copper ------- 35um(1oz) |
| Adhesive | |
| Polyimide | |
| Adhesive | |
| Copper ------- 35um(1oz) | |
| Minimum Trace and Space: | 4mil/6mil |
| Minimum / Maximum Holes: | 0.3mm/ 0.9mm |
| Final foil external: | 1oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 0.2mm ±0.05 |
| Surface Finish | Tin electro-plated |
| Solder Mask Apply To: | TOP, Bottom |
| Solder Mask Color: | Yellow Coverlay |
| CONTOUR/CUTTING | Punching |
| Stiffener: | FR-4(0.4mm), Polyimide |
| Side of Component Legend | n/a |
| Colour of Component Legend | n/a |
| VIA | Plated Through Hole(PTH) |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
| Bicheng Flexible Printed Circuit Capability 2020 | ||
| No. | Specifications | Capabilities |
| 1 | Board Type | Single layer, Doulbe layer, Multilayer, Rigid-Flex |
| 2 | Base Material | PI, PET |
| 3 | Copper Weight | 0.5oz, 1oz, 2oz |
| 4 | LED Maximum Size | 250 x 5000mm |
| 5 | General Maximum Size | 250 x 2000mm |
| 6 | Board Thickness | 0.03mm-3.0mm |
| 7 | Thickness Tolerance | ±0.03mm |
| 8 | Mininum Drill Hole | 0.05mm |
| 9 | Maximum Drill Hole | 6.5mm |
| 10 | Tolerance of Drill Hole | ±0.025mm |
| 11 | Thickness of Hole Wall | ≧ 8 um |
| 12 | Minimum Track/Gap of Single Layer Board | 0.025/0.03mm |
| 13 | Minimum Track/Gap of Double Layer and Multilayer Board | 0.03/0.040mm |
| 14 | Etching Tolerance | ±0.02mm |
| 15 | Minimum Width of Silk Legend | ≧ 0.125mm |
| 16 | Minimum Heigh of Silk Legend | ≧0.75mm |
| 17 | Distance from Legend to Pad | ≧0.15mm |
| 18 | Distance from Opening Solder Mask of Drill Coverlay to Track | ≧0.03mm |
| 19 | Distance from Opening Solder Mask of Punching Coverlay to Track | ≧0.03mm |
| 20 | Thickness of Immersion Nickel | 100-300u" |
| 21 | Thickness of Immersion Gold | 1-3u" |
| 22 | Thicnkess of Immersion Tin | 150-400u" |
| 23 | Minimum Electrical Testing Pad | 0.2mm |
| 24 | Minimum Tolerance of Outline(Normal Steel Mould Punch) | ±0.1mm |
| 25 | Minimum Tolerance of Outline (Precision Steel Mould Punch) | ±0.05mm |
| 26 | Mininum Radius of Bevel Angle (Outline) | 0.2mm |
| 27 | Stiffner Material | PI, FR-4, 3M Adhesive, PET, Steel Sheet |
| 28 | RoHs | Yes |
| 29 | Solder Mask Colour | Yellow, White, Black, Green |
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
