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TLY-3 lightweight 100x90mm Communication PCB 2 Sided Taconic TLY Laminates

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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TLY-3 lightweight 100x90mm Communication PCB 2 Sided Taconic TLY Laminates

TLY-3 lightweight 100x90mm Communication PCB 2 Sided Taconic TLY Laminates
TLY-3 lightweight 100x90mm Communication PCB 2 Sided Taconic TLY Laminates TLY-3 lightweight 100x90mm Communication PCB 2 Sided Taconic TLY Laminates

Large Image :  TLY-3 lightweight 100x90mm Communication PCB 2 Sided Taconic TLY Laminates

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-036.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: TLY-3 Layer Count: 2 Layers
PCB Size: 100 X 90mm=1PCS PCB Thickness: 0.8mm
Silkscreen: White Copper Weight: 0.5oz
Surface Finish: Immersion Gold
High Light:

Lightweight Communication PCB


100x90mm Communication PCB


100x90mm 2 Sided PCB


Taconic High Frequency PCB Built On TLY-3 30mil 0.762mm With Immersion Gold for Satellite / Cellular Communications

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Taconic TLY laminates are a type of low loss laminates. They are manufactured with very lightweight woven fiberglass and are more dimensionally stable than chopped fiber reinforced PTFE composites. The woven matrix yields a more mechanically stable laminate that is suitable for high volume manufacturing. The low dissipation factor enables successful deployment for automotive radar applications designed at 77 GHz as well as other antennas in millimeter wave frequencies.


The dielectric constant is as low as 2.17-2.20 +/-0.02, and dissipation factor is as low as 0.0009.


Data Sheet of Taconic TLY Material

Property Test Method Unit Value Unit Value
DK at 10 GHz IPC-650   2.2   2.2
Df at 10 GHz IPC-650   0.0009   0.0009
Moisture Absorption IPC-650 % 0.02 % 0.02
Dielectric Breakdown IPC-650 2.5.6 kV >45 kV >45
Dielectric Strength ASTM D 149 V/mil 2,693 V/mil 106,023
Volume Resistivity IPC-650 elevated temp.) Mohms/cm 1010 Mohms/cm 1010
Volume Resistivity IPC-650 humidity) Mohms/cm 1010 Mohms/cm 109
Surface Resistivity IPC-650 elevated temp.) Mohms 108 Mohms 108
Surface Resistivity IPC-650 humidity) Mohms 108 Mohms 108
Flex Strength(MD) IPC-650 2.4.4 psi 14,057 N/mm2 96.91
Flex Strength(CD) IPC-650 2.4.4 psi 12,955 N/mm2 89.32
Peel Stength(½ oz.ed copper) IPC-650 2.4.8 Ibs./inch 11 N/mm 1.96
Peel Stength(1 oz.CL1 copper) IPC-650 2.4.8 Ibs./inch 16 N/mm 2.86
Peel Stength(1 oz..CV1 copper) IPC-650 2.4.8 Ibs./inch 17 N/mm 3.04
Peel Stength IPC-650 2.4.8(after elevated temp.) Ibs./inch 13 N/mm 2.32
Young's Modulus(MD) ASTM D 3039/IPC-650 2.4.19 psi 1.4 x 106 N/mm2 9.65 x 103
Poisson's Ratio(MD) ASTM D 3039/IPC-650 2.4.19   0.21   0.21
Thermal Conductivity ASTM F 433 W/M*K 0.22 W/M*K 0.22
Dimensional Stability(MD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.038   -0.038
Dimensional Stability(CD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.031   -0.031
Density(Specific Gravity) ASTM D 792 g/cm3 2.19 g/cm3 2.19
CTE(X axis)(25-260) ASTM D 3386(TMA) ppm/ 26 ppm/ 26
CTE(Y axis)(25-260) ASTM D 3386(TMA) ppm/ 15 ppm/ 15
CTE(Z axis)(25-260) ASTM D 3386(TMA) ppm/ 217 ppm/ 217
NASA Outgassing(% TML)     0.01   0.01
NASA Outgassing(% CVCM)     0.01   0.01
NASA Outgassing(% WVR)     0.00   0.00
UL-94 Flammability Rating UL-94   V-0   V-0


The use of high-performance materials in electronic devices and systems can significantly improve their functionality and reliability, leading to a range of benefits across various industries. One such material is a dimensionally stable and low-moisture absorption substrate with low dielectric loss and a high copper peel strength. These features make it an ideal choice for applications in automotive radar, satellite/cellular communications, power amplifiers, LNBs, LNAs, LNCs, and aerospace.


In addition, the uniform and consistent dielectric constant of this material allows for accurate and predictable signal performance, which is essential in advanced communication systems. Moreover, its laser ablation capability provides a high degree of precision and flexibility in the manufacturing process, allowing for the creation of complex and intricate circuit designs. Overall, the benefits of using this material extend beyond its technical performance characteristics, as it can also provide significant cost-saving advantages due to its long-term reliability and durability in harsh operating environments.


Furthermore, the use of this material is particularly advantageous in Ka, E, and W band applications, which require high-frequency capabilities and low signal loss. These frequency ranges are used in various communication systems, including satellite and cellular communication, where low loss and high efficiency are crucial for reliable and efficient transmission of data. Additionally, the material's high copper peel strength makes it an excellent choice for power amplifiers, which require high thermal conductivity and robust mechanical properties. The combination of its unique features makes it an ideal choice for a wide range of applications, from consumer electronics to advanced communication systems and aerospace technology.


PCB Specifications

PCB SIZE 100 x 90mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
TLY-3 0.762mm
copper ------- 18um(0.5 oz) + plate BOT Layer
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.4mm
Number of Different Holes: 1
Number of Drill Holes: 1
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
Glass Epoxy: TLY-3 0.762mm
Final foil external: 1oz
Final foil internal: N/A
Final height of PCB: 0.8 mm ±0.1
Surface Finish Immersion gold (31%)
Solder Mask Apply To: NO
Solder Mask Color: N/A
Solder Mask Type: N/A
Side of Component Legend Top Side
Colour of Component Legend white
Manufacturer Name or Logo: Marked on the board in a conductor and legend FREE AREA
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


TLY-3 lightweight 100x90mm Communication PCB 2 Sided Taconic TLY Laminates 0


Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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