Taconic High Frequency PCB Built on TLX-9 62mil 1.575mm With Immersion Silver for Mixers, Splitters, Filters & Combiners
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
TLX offers reliability in a wide range of RF applications. This material is versatile due to its 2.45 - 2.65 DK range and available thicknesses and copper cladding. It is suitable for low layer count microwave designs.
TLX is PTFE based fiberglass laminate, it is ideal for use in radar systems, mobile communications, microwave test equipment, microwave transmission devices and RF components.
TLX is a workhorse in the RF microwave substrate world where the fiberglass offers mechanical reinforcement wherever a substrate experiences severe environments such as: resistance to creep for PCBs bolted to a housing that encounter high levels of vibration during space launch, high temperature exposure in engine modules, radiation resistance in space, antenna for warships that undergo extreme environments at sea and a substrate for altimeters that see a wide range of temperatures during flight.
There're TLX-0 (dk2.45), TLX-9 (dk2.50), TLX-8 (dk2.55), TLX-7 (dk2.60) and TLX-6 (dk2.65) in the TLX family. Dielectric thickness of TLX-0 ranges from 0.127mm to 6.35mm (5mil-250mil), TLX-9 ranges from 0.05mm to 6.35mm (2mil - 250mil), TLX-8 ranges from 0.064mm to 6.35mm (2.5mil to 250mil), TLX-7 ranges from 0.089mm to 6.35mm (3.5mil - 250mil), TLX-6 ranges from 0.089mm to 6.35mm (3.5mil to 250mil).
Benefits:
Excellent mechanical & thermal properties
Low & stable DK
Dimensionally stable
Low moisture absorption
UL 94 V-O rating
Tightly controlled DK
Low DF
For low layer count microwave designs
Applications:
Antennas
Couplers, Splitters, Combiners,
Amplifiers, Mixers, Filters
Passive components
PCB Specifications
| PCB SIZE |
134 x 59mm=1PCS |
| BOARD TYPE |
Double sided PCB |
| Number of Layers |
2 layers |
| Surface Mount Components |
YES |
| Through Hole Components |
NO |
| LAYER STACKUP |
copper ------- 35um(1 oz)+plate TOP layer |
| TLX-9 1.575mm |
| copper ------- 35um(1oz) + plate BOT Layer |
| TECHNOLOGY |
|
| Minimum Trace and Space: |
15 mil / 15 mil |
| Minimum / Maximum Holes: |
0.4mm/3.5mm |
| Number of Different Holes: |
N/A |
| Number of Drill Holes: |
N/A |
| Number of Milled Slots: |
0 |
| Number of Internal Cutouts: |
0 |
| Impedance Control: |
no |
| Number of Gold finger: |
0 |
| BOARD MATERIAL |
|
| Glass Epoxy: |
TLX-9 1.575mm |
| Final foil external: |
1 oz |
| Final foil internal: |
N/A |
| Final height of PCB: |
1.6 mm ±10% |
| PLATING AND COATING |
|
| Surface Finish |
Immersion Silver |
| Solder Mask Apply To: |
N/A |
| Solder Mask Color: |
N/A |
| Solder Mask Type: |
N/A |
| CONTOUR/CUTTING |
Routing |
| MARKING |
|
| Side of Component Legend |
N/A |
| Colour of Component Legend |
N/A |
| Manufacturer Name or Logo: |
N/A |
| VIA |
N/A |
| FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE |
|
| Outline dimension: |
0.0059" |
| Board plating: |
0.0029" |
| Drill tolerance: |
0.002" |
| TEST |
100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA |
Worldwide, Globally. |
DK TLX-9
| Type |
DK |
| TLY-5A |
2.17 |
| TLY-5 |
2.20 |
| TLY-3 |
2.33 |
| TLT-0 |
TLX-0 |
2.45 |
| TLT-9 |
TLX-9 |
2.50 |
| TLT-8 |
TLX-8 |
2.55 |
| TLT-7 |
TLX-7 |
2.60 |
| TLT-6 |
TLX-6 |
2.65 |
| TLE-95 |
2.95 |
| TLC-27 |
2.75 |
| TLC-30 |
RF-30 |
3.00 |
| TLC-32 |
3.20 |
| TLF-35 |
3.50 |
| TLF-35-xxxx-A |
3.50 |
| RF-35 |
RF-35A2 |
3.50 |
| TRF-41 |
4.10 |
| TRF-43 |
4.30 |
| TRF-45 |
4.50 |
| RF-60A |
6.15 |
| CER-10 |
10 |
TLX-9 Typical Value
| Property |
Test Method |
Units |
Value |
Units |
Value |
| Dielectric Constant @ 10 GHz |
IPC-TM 650 2.5.5.5 |
|
2.5 |
|
2.5 |
| Dissipation Factor @ 10 GHz |
IPC-TM 650 2.5.5.5 |
|
0.0019 |
|
0.0019 |
| Moisture Absorption |
IPC-TM 650 2.6.2.1 |
% |
<0.02 |
% |
<0.02 |
| Dielectric Breakdown |
IPC-TM 650 2.5.6 |
kV |
>60 |
kV |
>60 |
| Volume Resistivity |
IPC-TM 650 2.5.17.1 |
Mohm/cm |
10^7 |
Mohm/cm |
10^7 |
| Surface Resistivity |
IPC-TM 650 2.5.17.1 |
Mohm |
10^7 |
Mohm/cm |
10^7 |
| Arc Resistance |
IPC-TM 650 2.5.1 |
seconds |
>180 |
seconds |
>180 |
| Flexural Strength Lengthwise |
IPC-TM 650 2.4.4 |
lbs./in. |
>23,000 |
N/mm2 |
>159 |
| Flexural Strength Crosswise |
IPC-TM 650 2.4.4 |
lbs./in. |
>19,000 |
N/mm2 |
>131 |
| Peel Strength (1oz copper) |
IPC-TM 650 2.4.8 |
lbs./linear in. |
12 |
N/mm |
2.1 |
| Thermal Conductivity |
ASTM F 433 |
W/m/K |
0.19 |
W/m/K |
0.19 |
| x-y CTE |
ASTM D 3386 (TMA) |
ppm/°C |
9-12 |
ppm/°C |
9-12 |
| z CTE |
ASTM D 3386 (TMA) |
ppm/°C |
130- 145 |
ppm/°C |
130- 145 |
| UL-94 Flammability Rating |
UL-94 |
|
V-0 |
|
V-0 |
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