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Rogers RO3210 High Frequency PCB With 25mil Coating Immersion Gold

Rogers RO3210 High Frequency PCB With 25mil Coating Immersion Gold

MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-102.V1.0
Base Material:
RO3210
Layer Count:
2 Layer, Multilayer, Hybrid PCB
PCB Thickness:
25mil (0.635mm), 50mil (1.27mm)
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish:
Bare Copper, HASL, ENIG, OSP Etc..
Highlight:

Rogers RO3210 High Frequency PCB

,

25mil Coating High Frequency PCB

,

Immersion Gold High Frequency PCB

Product Description

 

Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin and Immersion Silver

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Hello Everyone,

Today we’re talking about RO3210 high frequency PCBs.

 

RO3210 high frequency circuit laminates are ceramic-filled laminates reinforced with woven fiberglass. RO3210 material was designed as an extension of the RO3000 series high frequency circuit materials with one distinguishing characteristic-- improved mechanical stability.

 

Rogers RO3210 High Frequency PCB With 25mil Coating Immersion Gold 0

 

Features and benefits are as follows:

1. Woven glass reinforcement, improves rigidity for easier handling.

2, Uniform electrical and mechanical performance, is ideal for complex multi-layer high frequency structure.

3. Low in-plane expansion coefficient matches to copper, which is reliable for surface mounted assemblies; which is suitable for use with epoxy multi-layer board hybrid designs.

4. Excellent dimensional stability, results in high production yields.

5. Surface smoothness, allows for finer line etching tolerance.

 

PCB Capability

PCB Material: Ceramic-filled Laminates
Designation: RO3210
Dielectric constant: 10.2 ±0.5 (process)
10.8 (design)
Layer count: 2 Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 25mil (0.635mm), 50mil (1.27mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..
   

 

Double layer RO3210 high frequency PCBs are available with 0.5oz to 2oz finished copper, 0.7mm and 1.3mm thick, maximum size 400mm by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.

 

Rogers RO3210 High Frequency PCB With 25mil Coating Immersion Gold 1

 

Typical applications are:

1. Base station infrastructure

2. LMDS and wireless broadband

3. Power backplanes

4. Remote meter readers

5. Wireless telecommunications systems

 

Rogers RO3210 High Frequency PCB With 25mil Coating Immersion Gold 2

 

The basic colour of RO3210 PCB is white.

 

The manufacturing process of RO3210 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market.

 

Data sheet of RO3210 high frequency circuit material

RO3210 Typical Value
Property RO3210 Direction Units Condition Test Method
Dielectric Constant, ε Process 10.2±0.5 Z   10 GHz 23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, ε Design 10.8 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor, tanδ 0.0027 Z   10 GHz 23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -459 Z ppm/℃ 10 GHz 0℃to 100℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.8 X, Y mm/m COND A ASTM D257
Volume Resistivity 103   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 103   COND A IPC 2.5.17.1
Tensile Modulus 579
517
MD
CMD
kpsi 23℃ ASTM D 638
Water Absorption <0.1 - % D24/23 IPC-TM-650 2.6.2.1
Specific Heat 0.79   j/g/k   Calculated
Thermal Conductivity 0.81   W/M/K 80℃ ASTM C518
Coefficient of Thermal Expansion
(-55 to 288℃)
13
34
X,Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   TGA ASTM D3850
Density 3   gm/cm3    
Copper Peel Strength 11   pli 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

products
PRODUCTS DETAILS
Rogers RO3210 High Frequency PCB With 25mil Coating Immersion Gold
MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-102.V1.0
Base Material:
RO3210
Layer Count:
2 Layer, Multilayer, Hybrid PCB
PCB Thickness:
25mil (0.635mm), 50mil (1.27mm)
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish:
Bare Copper, HASL, ENIG, OSP Etc..
Minimum Order Quantity:
1PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Rogers RO3210 High Frequency PCB

,

25mil Coating High Frequency PCB

,

Immersion Gold High Frequency PCB

Product Description

 

Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin and Immersion Silver

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Hello Everyone,

Today we’re talking about RO3210 high frequency PCBs.

 

RO3210 high frequency circuit laminates are ceramic-filled laminates reinforced with woven fiberglass. RO3210 material was designed as an extension of the RO3000 series high frequency circuit materials with one distinguishing characteristic-- improved mechanical stability.

 

Rogers RO3210 High Frequency PCB With 25mil Coating Immersion Gold 0

 

Features and benefits are as follows:

1. Woven glass reinforcement, improves rigidity for easier handling.

2, Uniform electrical and mechanical performance, is ideal for complex multi-layer high frequency structure.

3. Low in-plane expansion coefficient matches to copper, which is reliable for surface mounted assemblies; which is suitable for use with epoxy multi-layer board hybrid designs.

4. Excellent dimensional stability, results in high production yields.

5. Surface smoothness, allows for finer line etching tolerance.

 

PCB Capability

PCB Material: Ceramic-filled Laminates
Designation: RO3210
Dielectric constant: 10.2 ±0.5 (process)
10.8 (design)
Layer count: 2 Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 25mil (0.635mm), 50mil (1.27mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..
   

 

Double layer RO3210 high frequency PCBs are available with 0.5oz to 2oz finished copper, 0.7mm and 1.3mm thick, maximum size 400mm by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.

 

Rogers RO3210 High Frequency PCB With 25mil Coating Immersion Gold 1

 

Typical applications are:

1. Base station infrastructure

2. LMDS and wireless broadband

3. Power backplanes

4. Remote meter readers

5. Wireless telecommunications systems

 

Rogers RO3210 High Frequency PCB With 25mil Coating Immersion Gold 2

 

The basic colour of RO3210 PCB is white.

 

The manufacturing process of RO3210 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market.

 

Data sheet of RO3210 high frequency circuit material

RO3210 Typical Value
Property RO3210 Direction Units Condition Test Method
Dielectric Constant, ε Process 10.2±0.5 Z   10 GHz 23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, ε Design 10.8 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor, tanδ 0.0027 Z   10 GHz 23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -459 Z ppm/℃ 10 GHz 0℃to 100℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.8 X, Y mm/m COND A ASTM D257
Volume Resistivity 103   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 103   COND A IPC 2.5.17.1
Tensile Modulus 579
517
MD
CMD
kpsi 23℃ ASTM D 638
Water Absorption <0.1 - % D24/23 IPC-TM-650 2.6.2.1
Specific Heat 0.79   j/g/k   Calculated
Thermal Conductivity 0.81   W/M/K 80℃ ASTM C518
Coefficient of Thermal Expansion
(-55 to 288℃)
13
34
X,Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   TGA ASTM D3850
Density 3   gm/cm3    
Copper Peel Strength 11   pli 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

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