4-layer Hybrid PCB on RT duroid 5880 and FR4 material ENIG Finish

This PCB uses RT duroid 5880 high-frequency laminates integrated with High Tg 170°C FR-4 as its material, delivering superior high-frequency signal integrity. It is furnished with an Immersion Gold (ENIG) surface finish and adopts a double-sided configuration free of solder mask and silkscreen. Backed by precise dimensional control and stringent quality assurance protocols, this PCB is specifically engineered to meet the rigorous performance requirements of high-reliability electronic applications.

PCB Details

PCB Stack-up

Artwork Type

To ensure accurate and efficient PCB manufacturing, the artwork supplied for this PCB is in Gerber RS-274-X format, which is the industry-standard file format for PCB fabrication.

Quality Standard

This PCB is manufactured and inspected in strict compliance with the IPC-Class-2 standard, a widely adopted industry standard for printed circuit boards. IPC-Class-2 specifies requirements for general electronic products, ensuring reliable performance in typical applications.

Availability

This PCB is offered globally, with a stable supply capability to accommodate diverse order requirements—ranging from small-batch prototypes to large-scale mass production—backed by efficient logistics solutions to ensure timely global delivery.

Introduction to RT/duroid 5880 Material

RT/duroid 5880 is a high-performance polytetrafluoroethylene (PTFE)-based composite dielectric material developed by Rogers Corporation, specifically engineered for high-frequency, low-loss electronic applications. It features a woven glass reinforcement structure, combining the excellent electrical properties of PTFE with enhanced mechanical robustness, making it suitable for precision high-frequency PCB fabrication.

RT/duroid 5880 laminates offer tight control over dielectric constant (Dk) and maintain ultra-low loss, available at a reasonable cost compared to conventional microwave laminates. Unlike PTFE-based materials, RT/duroid 5880 does not require special through-hole treatments or handling procedures, simplifying manufacturing processes. These materials are UL 94 V-0 rated, making them suitable for active devices and high-power RF designs.

The thermal coefficient of expansion (CTE) of RT/duroid 5880 material provides several key benefits to circuit designers. Its expansion coefficient is well-matched to copper, ensuring excellent dimensional stability—a critical property for multi-layer board constructions. The optimized Z-axis CTE of RT/duroid 5880 laminates ensures reliable plated through-hole quality, even in severe thermal shock applications. As a PTFE-based material, it has no distinct glass transition temperature (Tg), maintaining stable expansion characteristics over the entire range of circuit processing temperatures.

Features of RT/duroid 5880 Material

Typical Applications

-Microwave and millimeter-wave communication systems (up to 60GHz)

-Radar and satellite communication equipment

-RF power amplifiers and filters

-Aerospace and defense electronic systems

-Test and measurement instruments for high-frequency applications

-5G millimeter-wave base stations and terminal devices

Summary

With ultra-low signal loss, excellent dimensional stability and reliable structural performance, this 3-copper-layer PCB is an ideal solution for engineers, electronic product manufacturers and RF system integrators pursuing high reliability and stable high-frequency signal transmission. It effectively meets the high-performance requirements of high-frequency applications including microwave communication, radar systems, aerospace electronic equipment and 5G millimeter-wave devices.

What is Hybrid PCB?

A Hybrid PCB (Hybrid Printed Circuit Board) refers to a specialized PCB that integrates two or more different types of dielectric materials in its structure, rather than using a single uniform material. The core purpose of designing hybrid PCBs is to balance performance, cost, and functional requirements—leveraging the unique advantages of each material to optimize the overall performance of the circuit board.

In practical applications, hybrid PCBs often combine high-performance, high-cost dielectric materials (such as RT/duroid 5880) with cost-effective, structurally robust materials (such as High Tg 170°C FR-4). For example, the PCB specified in this document adopts a hybrid structure of RT/duroid 5880 (for high-frequency, low-loss signal transmission) and High Tg 170°C FR-4 (for structural support and cost control), which is a typical example of a hybrid PCB.

Key characteristics and advantages of hybrid PCBs:

Performance Optimization: Tailor material selection for different functional areas (e.g., high-frequency signal layers use low-Dk/Df materials, while structural layers use high-strength materials).

-Cost-Effectiveness: Reduce overall costs by using high-performance materials only in critical areas, instead of the entire board.

-Functional Versatility: Meet diverse requirements such as high-frequency transmission, mechanical robustness, and thermal management in a single PCB.

-Application Adaptability: Widely used in complex electronic systems such as aerospace, communication, and medical equipment, where multiple performance requirements need to be met simultaneously.