0.2mm RO4350B LoPro PCB Double-Layer with Blue Solder Mask

In search of a cost-effective 2-layer rigid RF PCB that delivers superior high-frequency performance and signal integrity? This 2-layer rigid RF PCB is constructed with RO4350B Low Profile—a proprietary laminate developed by Rogers—and features an Immersion Gold surface finish. Adhering to IPC-Class 2 quality standards, this PCB delivers consistent, reliable performance for critical applications such as cellular base station antennas, high-speed digital equipment, and satellite LNBs. With a focus on low conductor loss, flexible design capabilities, and cost-efficient manufacturing, it emerges as the optimal choice for engineers and procurement teams seeking a high-performance, easy-to-produce substrate for high-frequency RF and digital projects.

PCB Specifications

PCB Stack-up Configuration

Artwork Format & Availability

Artwork Format: Supplied in Gerber RS-274-X – The industry-standard format for PCB manufacturing, ensuring compatibility and guaranteeing reliable production.

Availability: Worldwide – We provide global shipping to meet the needs of engineers and manufacturers around the world, with delivery times that adhere to industry standards.

RO4350B Low Profile Substrate: The Key to High-Frequency, Cost-Effective Performance

Rogers’ RO4350B Low Profile laminate serves as the cornerstone of the PCB’s exceptional high-frequency performance and cost efficiency, engineered to meet the demands of modern RF and digital applications:

RO4350B low profile laminates leverage a proprietary Rogers technology that allows reverse treated foil to bond with standard RO4350B dielectric. This innovative design creates a laminate with low conductor loss, which improves insertion loss and signal integrity while retaining all the valuable characteristics of the standard RO4350B laminate system. RO4350B hydrocarbon ceramic laminates are specifically engineered to deliver superior high-frequency performance along with cost-efficient circuit manufacturing. The result is a low-loss material that can be produced using standard epoxy/glass (FR-4) processes, removing the need for specialized via preparation such as sodium etch—thus significantly lowering manufacturing costs.

Key Features of RO4350B Low Profile PCB

RO4350B Low Profile offers outstanding electrical and mechanical features tailored specifically for high-frequency, cost-sensitive applications, including:

Dielectric Constant: 3.48 +/- 0.05 at 10 GHz/23°C – Ensures stable signal propagation for high-frequency RF applications

Dissipation Factor: 0.0037 at 10 GHz/23°C – Low dielectric loss, which is critical for preserving signal integrity and reducing insertion loss

High Temperature Performance: Td > 390°C, High Tg greater than 280°C (TMA) – Supports high-temperature processing and reliable operation in harsh environments

High Thermal Conductivity: 0.69 W/mK – Enables efficient heat dissipation, protecting components in high-power applications

Low Z-axis Coefficient of Thermal Expansion: 32 ppm/°C – Enhances dimensional stability and reliability across temperature fluctuations

Copper-Matched Coefficient of Thermal Expansion (-55 to 288°C): X-axis 10 ppm/°C, Y-axis 12 ppm/°C, Z-axis 32 ppm/°C – Reduces thermal stress and improves long-term reliability

UL 94-V0 Flammability – Meets strict fire safety standards for electronic equipment

Lead-Free Process Compatible – Aligns with global environmental regulations and modern manufacturing practices

Key Benefits of RO4350B Low Profile PCB

The RO4350B Low Profile substrate provides numerous advantages for engineers and manufacturers, including:

Lower insertion loss enables higher operating frequency designs (even exceeding 40 GHz) – Expanding the application scope for high-frequency projects

Reduced passive inter-modulation (PIM) for base station antennas – Enhancing signal quality and performance in communication systems

Improved thermal performance due to lower conductor loss – Extending component lifespan and reliability

Multilayer PCB capability – Offering design flexibility for complex, high-density circuits

Design flexibility – Adapting to diverse RF and digital application requirements

High temperature processing – Compatible with rigorous manufacturing and operating conditions

Meets environmental concerns – Compliant with lead-free and safety standards

CAF resistant – Enhancing long-term reliability by preventing the formation of conductive anodic filaments

Applications

RO4350B Low Profile 2-layer RF PCB is specifically engineered for high-frequency, cost-effective applications, including:

• Digital applications such as servers, routers, and high-speed backplanes
• Cellular base station antennas and power amplifiers
• LNB’s (Low Noise Blocks) for direct broadcast satellites
• RF Identification (RFID) Tags