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2-Layer WL-CT440 Rigid RF PCB Hydrocarbon Ceramic Filled High Frequency Board

2-Layer WL-CT440 Rigid RF PCB Hydrocarbon Ceramic Filled High Frequency Board

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
PCB Material:
WL-CT440
Layer Count:
2-layer
PCB Thickness:
0.8mm
PCB Size:
89mm × 63.5mm (1PCS)
Copper Weight:
1oz (1.4 Mils) Outer Copper Foil
Surface Finish:
Immersion Gold
Highlight:

PCB material TLY-3 laminate

,

high frequency copper clad sheet

,

TLY-3 copper clad laminate

Product Description

This 2-layer rigid WL-CT440 high-frequency RF PCB is fabricated with hydrocarbon ceramic-reinforced fiberglass dielectric laminate, serving as an economical alternative to imported high-frequency substrates. Manufactured to IPC-Class-2 standards and finished with immersion gold plating, this 0.8mm thin circuit board delivers low dielectric loss, exceptional thermal conductivity, high Tg performance, and consistent dielectric stability. Featuring FR4-compatible fabrication processes, WL-CT440 is far easier to process than conventional PTFE materials while maintaining excellent repeatability and circuit reliability. It is commonly deployed in aerospace machinery, phased array antennas, radar hardware, and satellite communication assemblies.

 

PCB Specifications

Construction Item Details
Base Material WL-CT440 – Hydrocarbon ceramic filled fiberglass cloth copper-clad laminate for high-frequency circuits
Layer Count 2 layers – Rigid high-frequency PCB architecture engineered for aerospace and radar electronic systems
Board Dimensions 89mm × 63.5mm (1PCS), with a strict dimensional tolerance of +/- 0.15mm for precise component assembly
Trace & Space Minimum 4/6 mils, supporting compact trace routing and preserving superior high-frequency signal integrity
Minimum Hole Size 0.2mm, fabricated for high-precision through-hole component mounting and insertion
Vias No blind vias, simplifying manufacturing procedures and ensuring consistent interlayer electrical conduction
Finished Board Thickness 0.8mm, lightweight and slim construction ideal for space-restricted aerospace and airborne devices
Copper Weight 1oz (1.4 mils) outer copper foil, providing stable conductivity for microwave signal transmission
Via Plating Thickness 20μm, meeting IPC-Class-2 requirements to ensure robust via conductivity and long-term durability
Surface Finish Immersion Gold, delivering outstanding oxidation resistance and dependable solderability for high-frequency precision circuitry
Silkscreen & Solder Mask Top Silkscreen: None; Bottom Silkscreen: None; Top Solder Mask: None; Bottom Solder Mask: None — Fully exposed copper layout minimizes microwave signal attenuation
Quality Testing 100% continuity testing performed prior to delivery to guarantee flawless electrical performance

 

PCB Stack-up Configuration

Stack-up Component Specifications & Description
Copper Layer 1 35μm – High-purity copper foil for low-resistance microwave signal propagation
WL-CT440 Core 0.762 mm (30mil) – Hydrocarbon ceramic reinforced substrate featuring high thermal conductivity and low dielectric loss
Copper Layer 2 35μm – Symmetrical copper structure to sustain consistent electrical stability

 

2-Layer WL-CT440 Rigid RF PCB Hydrocarbon Ceramic Filled High Frequency Board 0

 

Artwork Format & Compliance Standard

Artwork Format: Provided in Gerber RS-274-X, an industry-standard format that ensures precise PCB fabrication and universal data compatibility.

 

Accepted Standard: IPC-Class-2, ensuring durable and reliable operation for aerospace & military high-frequency electronic devices.

 

Availability: Global shipping is offered to support international engineering procurement and industrial projects.

 

Introduction of WL-CT440 Substrate

WL-CT440 is a thermoset hydrocarbon ceramic fiberglass-reinforced copper-clad laminate engineered for high-frequency microwave applications. Formulated with hydrocarbon resin, composite ceramic filler, and woven fiberglass, this substrate delivers steady low-loss electrical performance for microwave circuit designs. Unlike complex PTFE-based materials, WL-CT440 adopts FR4-matched manufacturing workflows, simplifying PCB processing while maintaining outstanding stability and production repeatability.

 

The synergistic combination of hydrocarbon resin and ceramic additives provides minimal signal attenuation, superior heat resistance, and excellent temperature stability. This material exhibits a stable dielectric temperature coefficient, low thermal expansion rate, and an ultra-high Tg exceeding 280°C. As a cost-effective domestic substitute for imported high-frequency laminates, WL-CT440 is widely adopted for military, aerospace, and commercial radio frequency systems.

 

Key Features

Parameter Specification & Remarks
Dielectric Constant @10GHz 4.1 at 10 GHz/23°C, delivering stable dielectric performance for general high-frequency circuitry
Dissipation Factor @10GHz 0.004 at 10GHz, maintaining low signal loss during microwave transmission
Temperature Coefficient of Dk -21 ppm/°C, ensuring reliable dielectric stability under fluctuating ambient temperatures
Thermal Conductivity 0.66 W/MK, enabling efficient heat dissipation for high-power RF circuitry
Moisture Absorption 0.12%, retaining consistent electrical properties in humid working environments
X-Y Axis CTE X-axis: 14ppm/°C, Y-axis: 18 ppm/°C, featuring copper-matched thermal expansion
Z-axis CTE 35 ppm/°C, mitigating thermal delamination and board warpage risks
Tg Value ≥280°C, offering exceptional thermal endurance during reflow soldering cycles

 

Key Benefits

WL-CT440 offers distinct technical advantages for commercial and military high-frequency circuit designers:

 

FR4-compatible fabrication simplifies manufacturing and reduces production costs compared with PTFE substrates

 

Optimized low Dk and low Df values ensure clean, stable signal transmission across microwave frequency bands

 

Low water absorption prevents electrical performance degradation under humid atmospheric conditions

 

High thermal conductivity accelerates heat dissipation for high-power amplifier circuits

 

Copper-synchronized CTE minimizes thermal stress and enhances long-term structural reliability

 

Superior Tg property strengthens thermal stability during repeated soldering processes

 

Typical Applications

This WL-CT440 2-layer RF PCB is extensively utilized in military-grade, aerospace, and microwave communication systems:

 

Aerospace apparatuses, space cabin equipment and airborne electronic modules

 

-Microwave antennas and phase-sensitive antenna array systems

-Early-warning radar and airborne radar transceiver units

-Phased array antennas and microwave beam-forming networks

-Satellite communication, navigation systems and RF power amplifiers

 

2-Layer WL-CT440 Rigid RF PCB Hydrocarbon Ceramic Filled High Frequency Board 1

Products
PRODUCTS DETAILS
2-Layer WL-CT440 Rigid RF PCB Hydrocarbon Ceramic Filled High Frequency Board
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
PCB Material:
WL-CT440
Layer Count:
2-layer
PCB Thickness:
0.8mm
PCB Size:
89mm × 63.5mm (1PCS)
Copper Weight:
1oz (1.4 Mils) Outer Copper Foil
Surface Finish:
Immersion Gold
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

PCB material TLY-3 laminate

,

high frequency copper clad sheet

,

TLY-3 copper clad laminate

Product Description

This 2-layer rigid WL-CT440 high-frequency RF PCB is fabricated with hydrocarbon ceramic-reinforced fiberglass dielectric laminate, serving as an economical alternative to imported high-frequency substrates. Manufactured to IPC-Class-2 standards and finished with immersion gold plating, this 0.8mm thin circuit board delivers low dielectric loss, exceptional thermal conductivity, high Tg performance, and consistent dielectric stability. Featuring FR4-compatible fabrication processes, WL-CT440 is far easier to process than conventional PTFE materials while maintaining excellent repeatability and circuit reliability. It is commonly deployed in aerospace machinery, phased array antennas, radar hardware, and satellite communication assemblies.

 

PCB Specifications

Construction Item Details
Base Material WL-CT440 – Hydrocarbon ceramic filled fiberglass cloth copper-clad laminate for high-frequency circuits
Layer Count 2 layers – Rigid high-frequency PCB architecture engineered for aerospace and radar electronic systems
Board Dimensions 89mm × 63.5mm (1PCS), with a strict dimensional tolerance of +/- 0.15mm for precise component assembly
Trace & Space Minimum 4/6 mils, supporting compact trace routing and preserving superior high-frequency signal integrity
Minimum Hole Size 0.2mm, fabricated for high-precision through-hole component mounting and insertion
Vias No blind vias, simplifying manufacturing procedures and ensuring consistent interlayer electrical conduction
Finished Board Thickness 0.8mm, lightweight and slim construction ideal for space-restricted aerospace and airborne devices
Copper Weight 1oz (1.4 mils) outer copper foil, providing stable conductivity for microwave signal transmission
Via Plating Thickness 20μm, meeting IPC-Class-2 requirements to ensure robust via conductivity and long-term durability
Surface Finish Immersion Gold, delivering outstanding oxidation resistance and dependable solderability for high-frequency precision circuitry
Silkscreen & Solder Mask Top Silkscreen: None; Bottom Silkscreen: None; Top Solder Mask: None; Bottom Solder Mask: None — Fully exposed copper layout minimizes microwave signal attenuation
Quality Testing 100% continuity testing performed prior to delivery to guarantee flawless electrical performance

 

PCB Stack-up Configuration

Stack-up Component Specifications & Description
Copper Layer 1 35μm – High-purity copper foil for low-resistance microwave signal propagation
WL-CT440 Core 0.762 mm (30mil) – Hydrocarbon ceramic reinforced substrate featuring high thermal conductivity and low dielectric loss
Copper Layer 2 35μm – Symmetrical copper structure to sustain consistent electrical stability

 

2-Layer WL-CT440 Rigid RF PCB Hydrocarbon Ceramic Filled High Frequency Board 0

 

Artwork Format & Compliance Standard

Artwork Format: Provided in Gerber RS-274-X, an industry-standard format that ensures precise PCB fabrication and universal data compatibility.

 

Accepted Standard: IPC-Class-2, ensuring durable and reliable operation for aerospace & military high-frequency electronic devices.

 

Availability: Global shipping is offered to support international engineering procurement and industrial projects.

 

Introduction of WL-CT440 Substrate

WL-CT440 is a thermoset hydrocarbon ceramic fiberglass-reinforced copper-clad laminate engineered for high-frequency microwave applications. Formulated with hydrocarbon resin, composite ceramic filler, and woven fiberglass, this substrate delivers steady low-loss electrical performance for microwave circuit designs. Unlike complex PTFE-based materials, WL-CT440 adopts FR4-matched manufacturing workflows, simplifying PCB processing while maintaining outstanding stability and production repeatability.

 

The synergistic combination of hydrocarbon resin and ceramic additives provides minimal signal attenuation, superior heat resistance, and excellent temperature stability. This material exhibits a stable dielectric temperature coefficient, low thermal expansion rate, and an ultra-high Tg exceeding 280°C. As a cost-effective domestic substitute for imported high-frequency laminates, WL-CT440 is widely adopted for military, aerospace, and commercial radio frequency systems.

 

Key Features

Parameter Specification & Remarks
Dielectric Constant @10GHz 4.1 at 10 GHz/23°C, delivering stable dielectric performance for general high-frequency circuitry
Dissipation Factor @10GHz 0.004 at 10GHz, maintaining low signal loss during microwave transmission
Temperature Coefficient of Dk -21 ppm/°C, ensuring reliable dielectric stability under fluctuating ambient temperatures
Thermal Conductivity 0.66 W/MK, enabling efficient heat dissipation for high-power RF circuitry
Moisture Absorption 0.12%, retaining consistent electrical properties in humid working environments
X-Y Axis CTE X-axis: 14ppm/°C, Y-axis: 18 ppm/°C, featuring copper-matched thermal expansion
Z-axis CTE 35 ppm/°C, mitigating thermal delamination and board warpage risks
Tg Value ≥280°C, offering exceptional thermal endurance during reflow soldering cycles

 

Key Benefits

WL-CT440 offers distinct technical advantages for commercial and military high-frequency circuit designers:

 

FR4-compatible fabrication simplifies manufacturing and reduces production costs compared with PTFE substrates

 

Optimized low Dk and low Df values ensure clean, stable signal transmission across microwave frequency bands

 

Low water absorption prevents electrical performance degradation under humid atmospheric conditions

 

High thermal conductivity accelerates heat dissipation for high-power amplifier circuits

 

Copper-synchronized CTE minimizes thermal stress and enhances long-term structural reliability

 

Superior Tg property strengthens thermal stability during repeated soldering processes

 

Typical Applications

This WL-CT440 2-layer RF PCB is extensively utilized in military-grade, aerospace, and microwave communication systems:

 

Aerospace apparatuses, space cabin equipment and airborne electronic modules

 

-Microwave antennas and phase-sensitive antenna array systems

-Early-warning radar and airborne radar transceiver units

-Phased array antennas and microwave beam-forming networks

-Satellite communication, navigation systems and RF power amplifiers

 

2-Layer WL-CT440 Rigid RF PCB Hydrocarbon Ceramic Filled High Frequency Board 1

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