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PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet
  • name

PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
TLY-3
Laminate Thickness:
0.0035inch; 0.0050inch; 0.0075inch; 0.0100inch
Laminate Size:
12 X 18inch (305 X 457mm); 16 X 36inch (406 X 914mm); 16 X 18inch (406 X 457mm); 24 X 36inch (610 X 914mm); 18 X 24inch (457 X 610mm); 18 X 48inch (457 X 1220mm)
Copper Weight:
1/2 Oz. ED Copper；1 Oz. CL1 Copper；1 Oz. C1 Coppe
Highlight:

PCB material TLY-3 laminate

,

high frequency copper clad sheet

,

TLY-3 copper clad laminate

Product Description

TLY-3 laminates are fabricated using ultra-lightweight woven fiberglass, offering significantly greater dimensional stability compared to chopped fiber-reinforced PTFE composites. The woven fiberglass matrix delivers a mechanically robust laminate ideal for high-volume production. Featuring an extremely low dissipation factor, TLY-3 performs reliably in 77 GHz automotive radar systems and other millimeter-wave antenna designs.

 

Comparative OEM testing at 77 GHz between low-reinforcement TLY-3 and its nearest chopped fiber-reinforced competitor demonstrated comparable “drop-in” insertion loss and dielectric performance, with the key advantage of drastically improved manufacturing yields. The dielectric constant (Dk) ranges from 2.17 to 2.40. For most thicknesses, Dk can be specified at any value within this range with a tight tolerance of ±0.02. At 10 GHz, the typical dissipation factor (Df) in the low-Dk region is approximately 0.0009.

 

Typical applications include satellite communications, automotive radar, filters, couplers, avionics, and phased-array antennas.

 

PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet 0

 

Properties Conditions Typical Value Unit Test Method

Electrical Properties

 

 Dielectric Constant @ 10 GHz 2.33 ± 0.02 - IPC-650 2.5.5.5
Dissipation Factor @ 10 GHz 0.0012 - IPC-650 2.5.5.5
Volume Resistivity (after elevated temp.) 10¹⁰ Mohms/cm IPC-650 2.5.17.1
Volume Resistivity (after humidity) 10¹⁰ Mohms/cm IPC-650 2.5.17.1
Surface Resistivity (after elevated temp.) 10⁸ Mohms IPC-650 2.5.17.1
Surface Resistivity (after humidity) 10⁸ Mohms IPC-650 2.5.17.1
Thermal Properties Thermal Conductivity 0.22 W/M*K ASTM F 433
CTE (25-260°C) - X 26 ppm/°C ASTM D 3386 (TMA)
CTE (25-260°C) - Y 15 ppm/°C ASTM D 3386 (TMA)
CTE (25-260°C) - Z 217 ppm/°C ASTM D 3386 (TMA)
Mechanical Properties Peel Strength - 1/2 oz. ED copper 1.96 (11) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength - 1 oz. CL1 copper 2.86 (16) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength - 1 oz. C1 copper 3.04 (17) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength (at elevated temp.) 2.32 (13) N/mm (Ibs/in) IPC-650 2.4.8
Flexural Strength - MD 96.91 (14,057) N/mm² (psi) IPC-650 2.4.4
Flexural Strength - CD 89.32 (12,955) N/mm² (psi) IPC-650 2.4.4
Young’s Modulus - MD 9.65 X 10³ (1.4 X 10⁶) N/mm² (psi) ASTM D 3039 / IPC-650 2.4.19
Poisson’s Ratio - MD 0.21 - ASTM D 3039 / IPC-650 2.4.19
Mechanical Properties Density Specific Gravity 2.19 g/cm³ ASTM D 792
Mechanical Properties Dimensional Stability - MD, 10 mil -0.038 mm/M (mils/in) IPC-650 2.4.39
Mechanical Properties Dimensional Stability - CD, 10 mil (avg. after bake & thermal stress) -0.038 mm/M (mils/in) -
Chemical / Physical Properties Moisture Absorption 0.02 % IPC-650 2.6.2.1
NASA Outgassing - TML 0.01 % -
NASA Outgassing - CVCM 0.01 % -
NASA Outgassing - WVR 0.01 % -
UL-94 Flammability Rating V-0 - UL-94

 

Key Benefits

  • Excellent dimensional stability
  • Ultra-low dissipation factor (Df)
  • High peel strength
  • Low moisture absorption
  • Consistent, uniform dielectric constant (Dk)
  • Laser-ablatable

 

Target Applications

  • Automotive radar
  • Satellite and cellular communications
  • Power amplifiers
  • LNBs, LNAs, and LNCs
  • Aerospace systems
  • Ka-band, E-band, and W-band applications
Tags: 

0.1mm Copper Clad Laminate,  

BME217 Copper Clad Laminate,  

12mm Copper Clad Laminate

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products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

Copper Clad Laminates
PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet
  • name
PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
TLY-3
Laminate Thickness:
0.0035inch; 0.0050inch; 0.0075inch; 0.0100inch
Laminate Size:
12 X 18inch (305 X 457mm); 16 X 36inch (406 X 914mm); 16 X 18inch (406 X 457mm); 24 X 36inch (610 X 914mm); 18 X 24inch (457 X 610mm); 18 X 48inch (457 X 1220mm)
Copper Weight:
1/2 Oz. ED Copper；1 Oz. CL1 Copper；1 Oz. C1 Coppe
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

PCB material TLY-3 laminate

,

high frequency copper clad sheet

,

TLY-3 copper clad laminate

Product Description

TLY-3 laminates are fabricated using ultra-lightweight woven fiberglass, offering significantly greater dimensional stability compared to chopped fiber-reinforced PTFE composites. The woven fiberglass matrix delivers a mechanically robust laminate ideal for high-volume production. Featuring an extremely low dissipation factor, TLY-3 performs reliably in 77 GHz automotive radar systems and other millimeter-wave antenna designs.

 

Comparative OEM testing at 77 GHz between low-reinforcement TLY-3 and its nearest chopped fiber-reinforced competitor demonstrated comparable “drop-in” insertion loss and dielectric performance, with the key advantage of drastically improved manufacturing yields. The dielectric constant (Dk) ranges from 2.17 to 2.40. For most thicknesses, Dk can be specified at any value within this range with a tight tolerance of ±0.02. At 10 GHz, the typical dissipation factor (Df) in the low-Dk region is approximately 0.0009.

 

Typical applications include satellite communications, automotive radar, filters, couplers, avionics, and phased-array antennas.

 

PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet 0

 

Properties Conditions Typical Value Unit Test Method

Electrical Properties

 

 Dielectric Constant @ 10 GHz 2.33 ± 0.02 - IPC-650 2.5.5.5
Dissipation Factor @ 10 GHz 0.0012 - IPC-650 2.5.5.5
Volume Resistivity (after elevated temp.) 10¹⁰ Mohms/cm IPC-650 2.5.17.1
Volume Resistivity (after humidity) 10¹⁰ Mohms/cm IPC-650 2.5.17.1
Surface Resistivity (after elevated temp.) 10⁸ Mohms IPC-650 2.5.17.1
Surface Resistivity (after humidity) 10⁸ Mohms IPC-650 2.5.17.1
Thermal Properties Thermal Conductivity 0.22 W/M*K ASTM F 433
CTE (25-260°C) - X 26 ppm/°C ASTM D 3386 (TMA)
CTE (25-260°C) - Y 15 ppm/°C ASTM D 3386 (TMA)
CTE (25-260°C) - Z 217 ppm/°C ASTM D 3386 (TMA)
Mechanical Properties Peel Strength - 1/2 oz. ED copper 1.96 (11) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength - 1 oz. CL1 copper 2.86 (16) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength - 1 oz. C1 copper 3.04 (17) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength (at elevated temp.) 2.32 (13) N/mm (Ibs/in) IPC-650 2.4.8
Flexural Strength - MD 96.91 (14,057) N/mm² (psi) IPC-650 2.4.4
Flexural Strength - CD 89.32 (12,955) N/mm² (psi) IPC-650 2.4.4
Young’s Modulus - MD 9.65 X 10³ (1.4 X 10⁶) N/mm² (psi) ASTM D 3039 / IPC-650 2.4.19
Poisson’s Ratio - MD 0.21 - ASTM D 3039 / IPC-650 2.4.19
Mechanical Properties Density Specific Gravity 2.19 g/cm³ ASTM D 792
Mechanical Properties Dimensional Stability - MD, 10 mil -0.038 mm/M (mils/in) IPC-650 2.4.39
Mechanical Properties Dimensional Stability - CD, 10 mil (avg. after bake & thermal stress) -0.038 mm/M (mils/in) -
Chemical / Physical Properties Moisture Absorption 0.02 % IPC-650 2.6.2.1
NASA Outgassing - TML 0.01 % -
NASA Outgassing - CVCM 0.01 % -
NASA Outgassing - WVR 0.01 % -
UL-94 Flammability Rating V-0 - UL-94

 

Key Benefits

  • Excellent dimensional stability
  • Ultra-low dissipation factor (Df)
  • High peel strength
  • Low moisture absorption
  • Consistent, uniform dielectric constant (Dk)
  • Laser-ablatable

 

Target Applications

  • Automotive radar
  • Satellite and cellular communications
  • Power amplifiers
  • LNBs, LNAs, and LNCs
  • Aerospace systems
  • Ka-band, E-band, and W-band applications
Tags: 

0.1mm Copper Clad Laminate,

BME217 Copper Clad Laminate,

12mm Copper Clad Laminate

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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