| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Standard Packaging: | Vacuum bags+Cartons |
| Delivery Period: | 8-9 working days |
| Payment Method: | T/T |
| Supply Capacity: | 5000PCS per month |
This 2-layer rigid WL-CT440 high-frequency RF PCB is fabricated with hydrocarbon ceramic-reinforced fiberglass dielectric laminate, serving as an economical alternative to imported high-frequency substrates. Manufactured to IPC-Class-2 standards and finished with immersion gold plating, this 0.8mm thin circuit board delivers low dielectric loss, exceptional thermal conductivity, high Tg performance, and consistent dielectric stability. Featuring FR4-compatible fabrication processes, WL-CT440 is far easier to process than conventional PTFE materials while maintaining excellent repeatability and circuit reliability. It is commonly deployed in aerospace machinery, phased array antennas, radar hardware, and satellite communication assemblies.
PCB Specifications
| Construction Item | Details |
| Base Material | WL-CT440 – Hydrocarbon ceramic filled fiberglass cloth copper-clad laminate for high-frequency circuits |
| Layer Count | 2 layers – Rigid high-frequency PCB architecture engineered for aerospace and radar electronic systems |
| Board Dimensions | 89mm × 63.5mm (1PCS), with a strict dimensional tolerance of +/- 0.15mm for precise component assembly |
| Trace & Space | Minimum 4/6 mils, supporting compact trace routing and preserving superior high-frequency signal integrity |
| Minimum Hole Size | 0.2mm, fabricated for high-precision through-hole component mounting and insertion |
| Vias | No blind vias, simplifying manufacturing procedures and ensuring consistent interlayer electrical conduction |
| Finished Board Thickness | 0.8mm, lightweight and slim construction ideal for space-restricted aerospace and airborne devices |
| Copper Weight | 1oz (1.4 mils) outer copper foil, providing stable conductivity for microwave signal transmission |
| Via Plating Thickness | 20μm, meeting IPC-Class-2 requirements to ensure robust via conductivity and long-term durability |
| Surface Finish | Immersion Gold, delivering outstanding oxidation resistance and dependable solderability for high-frequency precision circuitry |
| Silkscreen & Solder Mask | Top Silkscreen: None; Bottom Silkscreen: None; Top Solder Mask: None; Bottom Solder Mask: None — Fully exposed copper layout minimizes microwave signal attenuation |
| Quality Testing | 100% continuity testing performed prior to delivery to guarantee flawless electrical performance |
PCB Stack-up Configuration
| Stack-up Component | Specifications & Description |
| Copper Layer 1 | 35μm – High-purity copper foil for low-resistance microwave signal propagation |
| WL-CT440 Core | 0.762 mm (30mil) – Hydrocarbon ceramic reinforced substrate featuring high thermal conductivity and low dielectric loss |
| Copper Layer 2 | 35μm – Symmetrical copper structure to sustain consistent electrical stability |
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Artwork Format & Compliance Standard
Artwork Format: Provided in Gerber RS-274-X, an industry-standard format that ensures precise PCB fabrication and universal data compatibility.
Accepted Standard: IPC-Class-2, ensuring durable and reliable operation for aerospace & military high-frequency electronic devices.
Availability: Global shipping is offered to support international engineering procurement and industrial projects.
Introduction of WL-CT440 Substrate
WL-CT440 is a thermoset hydrocarbon ceramic fiberglass-reinforced copper-clad laminate engineered for high-frequency microwave applications. Formulated with hydrocarbon resin, composite ceramic filler, and woven fiberglass, this substrate delivers steady low-loss electrical performance for microwave circuit designs. Unlike complex PTFE-based materials, WL-CT440 adopts FR4-matched manufacturing workflows, simplifying PCB processing while maintaining outstanding stability and production repeatability.
The synergistic combination of hydrocarbon resin and ceramic additives provides minimal signal attenuation, superior heat resistance, and excellent temperature stability. This material exhibits a stable dielectric temperature coefficient, low thermal expansion rate, and an ultra-high Tg exceeding 280°C. As a cost-effective domestic substitute for imported high-frequency laminates, WL-CT440 is widely adopted for military, aerospace, and commercial radio frequency systems.
Key Features
| Parameter | Specification & Remarks |
| Dielectric Constant @10GHz | 4.1 at 10 GHz/23°C, delivering stable dielectric performance for general high-frequency circuitry |
| Dissipation Factor @10GHz | 0.004 at 10GHz, maintaining low signal loss during microwave transmission |
| Temperature Coefficient of Dk | -21 ppm/°C, ensuring reliable dielectric stability under fluctuating ambient temperatures |
| Thermal Conductivity | 0.66 W/MK, enabling efficient heat dissipation for high-power RF circuitry |
| Moisture Absorption | 0.12%, retaining consistent electrical properties in humid working environments |
| X-Y Axis CTE | X-axis: 14ppm/°C, Y-axis: 18 ppm/°C, featuring copper-matched thermal expansion |
| Z-axis CTE | 35 ppm/°C, mitigating thermal delamination and board warpage risks |
| Tg Value | ≥280°C, offering exceptional thermal endurance during reflow soldering cycles |
Key Benefits
WL-CT440 offers distinct technical advantages for commercial and military high-frequency circuit designers:
FR4-compatible fabrication simplifies manufacturing and reduces production costs compared with PTFE substrates
Optimized low Dk and low Df values ensure clean, stable signal transmission across microwave frequency bands
Low water absorption prevents electrical performance degradation under humid atmospheric conditions
High thermal conductivity accelerates heat dissipation for high-power amplifier circuits
Copper-synchronized CTE minimizes thermal stress and enhances long-term structural reliability
Superior Tg property strengthens thermal stability during repeated soldering processes
Typical Applications
This WL-CT440 2-layer RF PCB is extensively utilized in military-grade, aerospace, and microwave communication systems:
Aerospace apparatuses, space cabin equipment and airborne electronic modules
-Microwave antennas and phase-sensitive antenna array systems
-Early-warning radar and airborne radar transceiver units
-Phased array antennas and microwave beam-forming networks
-Satellite communication, navigation systems and RF power amplifiers
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| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Standard Packaging: | Vacuum bags+Cartons |
| Delivery Period: | 8-9 working days |
| Payment Method: | T/T |
| Supply Capacity: | 5000PCS per month |
This 2-layer rigid WL-CT440 high-frequency RF PCB is fabricated with hydrocarbon ceramic-reinforced fiberglass dielectric laminate, serving as an economical alternative to imported high-frequency substrates. Manufactured to IPC-Class-2 standards and finished with immersion gold plating, this 0.8mm thin circuit board delivers low dielectric loss, exceptional thermal conductivity, high Tg performance, and consistent dielectric stability. Featuring FR4-compatible fabrication processes, WL-CT440 is far easier to process than conventional PTFE materials while maintaining excellent repeatability and circuit reliability. It is commonly deployed in aerospace machinery, phased array antennas, radar hardware, and satellite communication assemblies.
PCB Specifications
| Construction Item | Details |
| Base Material | WL-CT440 – Hydrocarbon ceramic filled fiberglass cloth copper-clad laminate for high-frequency circuits |
| Layer Count | 2 layers – Rigid high-frequency PCB architecture engineered for aerospace and radar electronic systems |
| Board Dimensions | 89mm × 63.5mm (1PCS), with a strict dimensional tolerance of +/- 0.15mm for precise component assembly |
| Trace & Space | Minimum 4/6 mils, supporting compact trace routing and preserving superior high-frequency signal integrity |
| Minimum Hole Size | 0.2mm, fabricated for high-precision through-hole component mounting and insertion |
| Vias | No blind vias, simplifying manufacturing procedures and ensuring consistent interlayer electrical conduction |
| Finished Board Thickness | 0.8mm, lightweight and slim construction ideal for space-restricted aerospace and airborne devices |
| Copper Weight | 1oz (1.4 mils) outer copper foil, providing stable conductivity for microwave signal transmission |
| Via Plating Thickness | 20μm, meeting IPC-Class-2 requirements to ensure robust via conductivity and long-term durability |
| Surface Finish | Immersion Gold, delivering outstanding oxidation resistance and dependable solderability for high-frequency precision circuitry |
| Silkscreen & Solder Mask | Top Silkscreen: None; Bottom Silkscreen: None; Top Solder Mask: None; Bottom Solder Mask: None — Fully exposed copper layout minimizes microwave signal attenuation |
| Quality Testing | 100% continuity testing performed prior to delivery to guarantee flawless electrical performance |
PCB Stack-up Configuration
| Stack-up Component | Specifications & Description |
| Copper Layer 1 | 35μm – High-purity copper foil for low-resistance microwave signal propagation |
| WL-CT440 Core | 0.762 mm (30mil) – Hydrocarbon ceramic reinforced substrate featuring high thermal conductivity and low dielectric loss |
| Copper Layer 2 | 35μm – Symmetrical copper structure to sustain consistent electrical stability |
![]()
Artwork Format & Compliance Standard
Artwork Format: Provided in Gerber RS-274-X, an industry-standard format that ensures precise PCB fabrication and universal data compatibility.
Accepted Standard: IPC-Class-2, ensuring durable and reliable operation for aerospace & military high-frequency electronic devices.
Availability: Global shipping is offered to support international engineering procurement and industrial projects.
Introduction of WL-CT440 Substrate
WL-CT440 is a thermoset hydrocarbon ceramic fiberglass-reinforced copper-clad laminate engineered for high-frequency microwave applications. Formulated with hydrocarbon resin, composite ceramic filler, and woven fiberglass, this substrate delivers steady low-loss electrical performance for microwave circuit designs. Unlike complex PTFE-based materials, WL-CT440 adopts FR4-matched manufacturing workflows, simplifying PCB processing while maintaining outstanding stability and production repeatability.
The synergistic combination of hydrocarbon resin and ceramic additives provides minimal signal attenuation, superior heat resistance, and excellent temperature stability. This material exhibits a stable dielectric temperature coefficient, low thermal expansion rate, and an ultra-high Tg exceeding 280°C. As a cost-effective domestic substitute for imported high-frequency laminates, WL-CT440 is widely adopted for military, aerospace, and commercial radio frequency systems.
Key Features
| Parameter | Specification & Remarks |
| Dielectric Constant @10GHz | 4.1 at 10 GHz/23°C, delivering stable dielectric performance for general high-frequency circuitry |
| Dissipation Factor @10GHz | 0.004 at 10GHz, maintaining low signal loss during microwave transmission |
| Temperature Coefficient of Dk | -21 ppm/°C, ensuring reliable dielectric stability under fluctuating ambient temperatures |
| Thermal Conductivity | 0.66 W/MK, enabling efficient heat dissipation for high-power RF circuitry |
| Moisture Absorption | 0.12%, retaining consistent electrical properties in humid working environments |
| X-Y Axis CTE | X-axis: 14ppm/°C, Y-axis: 18 ppm/°C, featuring copper-matched thermal expansion |
| Z-axis CTE | 35 ppm/°C, mitigating thermal delamination and board warpage risks |
| Tg Value | ≥280°C, offering exceptional thermal endurance during reflow soldering cycles |
Key Benefits
WL-CT440 offers distinct technical advantages for commercial and military high-frequency circuit designers:
FR4-compatible fabrication simplifies manufacturing and reduces production costs compared with PTFE substrates
Optimized low Dk and low Df values ensure clean, stable signal transmission across microwave frequency bands
Low water absorption prevents electrical performance degradation under humid atmospheric conditions
High thermal conductivity accelerates heat dissipation for high-power amplifier circuits
Copper-synchronized CTE minimizes thermal stress and enhances long-term structural reliability
Superior Tg property strengthens thermal stability during repeated soldering processes
Typical Applications
This WL-CT440 2-layer RF PCB is extensively utilized in military-grade, aerospace, and microwave communication systems:
Aerospace apparatuses, space cabin equipment and airborne electronic modules
-Microwave antennas and phase-sensitive antenna array systems
-Early-warning radar and airborne radar transceiver units
-Phased array antennas and microwave beam-forming networks
-Satellite communication, navigation systems and RF power amplifiers
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