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RT/duroid 6006 PCB 2-Layer 10mil Rogers Laminate with Immersion Silver
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RT/duroid 6006 PCB 2-Layer 10mil Rogers Laminate with Immersion Silver
  • name

RT/duroid 6006 PCB 2-Layer 10mil Rogers Laminate with Immersion Silver

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
PCB Material:
RT/duroid 6006
PCB Thickness:
0.4mm
Layer Count:
2 Layers
PCB Size:
134.8mm × 78.65mm (2 Types, 2PCS)
Copper Weight:
1oz (1.4 Mils) Outer Copper Layers
Surface Finish:
Immersion Silver
Highlight:

high frequency copper laminate sheet

,

F4BM220 copper clad laminate

,

copper clad laminate sheet

Product Description

This rigid 2-layer RF PCB utilizes Rogers RT/duroid 6006, a premium ceramic-PTFE composite engineered for microwave and high-frequency circuitry. Built with Immersion Silver surface finish and manufactured to IPC-Class-2 criteria, this board delivers stable electrical performance and minimal signal loss. Boasting a high dielectric constant for circuit miniaturization, tight dimensional tolerances, and repeatable RF characteristics, it is an ideal solution for patch antennas, satellite communication modules, and aerospace radar systems.

 

PCB Specifications

Construction Item Details
Base Material RT/duroid 6006 – High-Dk ceramic-PTFE composite laminate optimized for microwave circuits
Layer Count 2 layers – Rigid microwave PCB structure tailored for compact high-frequency circuit designs
Board Dimensions 134.8mm × 78.65mm (2 Types, 2PCS), with a tight tolerance of +/- 0.15mm for consistent assembly accuracy
Trace & Space Minimum 5/6 mils, enabling compact circuit routing while retaining superior signal integrity
Minimum Hole Size 0.3mm, designed for high-precision through-hole component mounting in microwave applications
Vias No blind vias, simplifying fabrication and ensuring dependable interlayer electrical connectivity
Finished Board Thickness 0.4mm, ultra-thin profile suitable for space-constrained microwave and aerospace equipment
Copper Weight 1oz (1.4 mils) outer copper layers, delivering stable conductivity for microwave signal transmission
Via Plating Thickness 20μm, compliant with IPC-Class-2 standards to guarantee durable via conductivity
Surface Finish Immersion Silver, featuring high conductivity, low high-frequency loss and excellent solderability
Silkscreen & Solder Mask Top Silkscreen: None; Bottom Silkscreen: None; Top Solder Mask: None; Bottom Solder Mask: None — Fully exposed copper minimizes high-frequency signal loss
Quality Testing 100% electrical testing performed prior to shipment to ensure flawless circuit performance

 

PCB Stack-up Configuration

Stack-up Component Specifications & Description
Copper Layer 1 35μm – High-purity copper layer for low-resistance microwave signal conduction
RT/duroid 6006 Core 0.254 mm (10mil) – High-Dk ceramic-PTFE substrate enabling compact microwave circuit layouts
Copper Layer 2 35μm – Symmetrical copper structure to sustain consistent high-frequency electrical performance

 

RT/duroid 6006 PCB 2-Layer 10mil Rogers Laminate with Immersion Silver 0

 

Artwork Format & Compliance Standard

Artwork Format: Supplied in Gerber RS-274-X, the universal industrial format for accurate PCB fabrication and data compatibility.

 

Accepted Standard: IPC-Class-2, guaranteeing reliable performance for commercial and industrial high-frequency electronic products.

 

Availability: Worldwide shipping available to support global engineering procurement and projects.

 

Introduction of RT/duroid 6006 Substrate

Rogers RT/duroid 6006 is an advanced ceramic-PTFE composite engineered explicitly for high-frequency and microwave circuits. Its high dielectric constant enables significant circuit miniaturization, making it ideal for compact antenna designs and microwave systems. Featuring low loss tangent and stringent dielectric tolerance control, this substrate delivers consistent and repeatable electrical performance, particularly for X-band and lower-frequency applications. Its chemically stable composition ensures dependable operation in aerospace, satellite, and radar systems.

 

Key Features

RT/duroid 6006 integrates excellent electrical, thermal and mechanical properties for high-frequency microwave applications:

Parameter Specification & Remarks
Material Type Premium ceramic-PTFE composite laminate
Dielectric Constant 6.15 +/- 0.15 at 10 GHz/23°C, supporting circuit miniaturization
Dissipation Factor 0.0027 at 10 GHz/23°C, achieving ultra-low high-frequency signal attenuation
Thermal Decomposition Temperature (Td) > 500 °C (TGA) for superior thermal stability
Moisture Absorption 0.05%, minimizing performance fluctuation in humid environments
Coefficient of Thermal Expansion X-axis 47 ppm/°C, Y-axis 34 ppm/°C, Z-axis 117 ppm/°C
Copper Cladding Laminated with standard and reverse-treated electrodeposited copper foil for enhanced adhesion strength

 

Key Benefits

RT/duroid 6006 brings prominent technical and manufacturing advantages to microwave circuit designers:

 

High dielectric constant effectively shrinks circuit size for miniaturized antenna development

 

Low-loss characteristics perfectly suit X-band and sub-X-band microwave applications

 

Precise Dk and thickness tolerances ensure consistent performance across production batches

 

Ultra-low moisture absorption maintains electrical stability under harsh atmospheric conditions

 

Superior plated through-hole reliability adapts to multilayer fabrication and long-term service scenarios

 

Typical Applications

This RT/duroid 6006 2-layer RF PCB is widely deployed in high-end microwave and aerospace-related devices:

 

-Patch Antennas

-Satellite Communication Systems

-RF Power Amplifiers

-Aircraft Collision Avoidance Systems

-Ground-Based Radar Warning Systems

 

RT/duroid 6006 PCB 2-Layer 10mil Rogers Laminate with Immersion Silver 1

Tags: 

RO4003C LoPro Rogers PCB Board,  

8mil Rogers PCB Board,  

0.5oz Rogers PCB Board

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Products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

Copper Clad Laminates
RT/duroid 6006 PCB 2-Layer 10mil Rogers Laminate with Immersion Silver
  • name
RT/duroid 6006 PCB 2-Layer 10mil Rogers Laminate with Immersion Silver
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
PCB Material:
RT/duroid 6006
PCB Thickness:
0.4mm
Layer Count:
2 Layers
PCB Size:
134.8mm × 78.65mm (2 Types, 2PCS)
Copper Weight:
1oz (1.4 Mils) Outer Copper Layers
Surface Finish:
Immersion Silver
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

high frequency copper laminate sheet

,

F4BM220 copper clad laminate

,

copper clad laminate sheet

Product Description

This rigid 2-layer RF PCB utilizes Rogers RT/duroid 6006, a premium ceramic-PTFE composite engineered for microwave and high-frequency circuitry. Built with Immersion Silver surface finish and manufactured to IPC-Class-2 criteria, this board delivers stable electrical performance and minimal signal loss. Boasting a high dielectric constant for circuit miniaturization, tight dimensional tolerances, and repeatable RF characteristics, it is an ideal solution for patch antennas, satellite communication modules, and aerospace radar systems.

 

PCB Specifications

Construction Item Details
Base Material RT/duroid 6006 – High-Dk ceramic-PTFE composite laminate optimized for microwave circuits
Layer Count 2 layers – Rigid microwave PCB structure tailored for compact high-frequency circuit designs
Board Dimensions 134.8mm × 78.65mm (2 Types, 2PCS), with a tight tolerance of +/- 0.15mm for consistent assembly accuracy
Trace & Space Minimum 5/6 mils, enabling compact circuit routing while retaining superior signal integrity
Minimum Hole Size 0.3mm, designed for high-precision through-hole component mounting in microwave applications
Vias No blind vias, simplifying fabrication and ensuring dependable interlayer electrical connectivity
Finished Board Thickness 0.4mm, ultra-thin profile suitable for space-constrained microwave and aerospace equipment
Copper Weight 1oz (1.4 mils) outer copper layers, delivering stable conductivity for microwave signal transmission
Via Plating Thickness 20μm, compliant with IPC-Class-2 standards to guarantee durable via conductivity
Surface Finish Immersion Silver, featuring high conductivity, low high-frequency loss and excellent solderability
Silkscreen & Solder Mask Top Silkscreen: None; Bottom Silkscreen: None; Top Solder Mask: None; Bottom Solder Mask: None — Fully exposed copper minimizes high-frequency signal loss
Quality Testing 100% electrical testing performed prior to shipment to ensure flawless circuit performance

 

PCB Stack-up Configuration

Stack-up Component Specifications & Description
Copper Layer 1 35μm – High-purity copper layer for low-resistance microwave signal conduction
RT/duroid 6006 Core 0.254 mm (10mil) – High-Dk ceramic-PTFE substrate enabling compact microwave circuit layouts
Copper Layer 2 35μm – Symmetrical copper structure to sustain consistent high-frequency electrical performance

 

RT/duroid 6006 PCB 2-Layer 10mil Rogers Laminate with Immersion Silver 0

 

Artwork Format & Compliance Standard

Artwork Format: Supplied in Gerber RS-274-X, the universal industrial format for accurate PCB fabrication and data compatibility.

 

Accepted Standard: IPC-Class-2, guaranteeing reliable performance for commercial and industrial high-frequency electronic products.

 

Availability: Worldwide shipping available to support global engineering procurement and projects.

 

Introduction of RT/duroid 6006 Substrate

Rogers RT/duroid 6006 is an advanced ceramic-PTFE composite engineered explicitly for high-frequency and microwave circuits. Its high dielectric constant enables significant circuit miniaturization, making it ideal for compact antenna designs and microwave systems. Featuring low loss tangent and stringent dielectric tolerance control, this substrate delivers consistent and repeatable electrical performance, particularly for X-band and lower-frequency applications. Its chemically stable composition ensures dependable operation in aerospace, satellite, and radar systems.

 

Key Features

RT/duroid 6006 integrates excellent electrical, thermal and mechanical properties for high-frequency microwave applications:

Parameter Specification & Remarks
Material Type Premium ceramic-PTFE composite laminate
Dielectric Constant 6.15 +/- 0.15 at 10 GHz/23°C, supporting circuit miniaturization
Dissipation Factor 0.0027 at 10 GHz/23°C, achieving ultra-low high-frequency signal attenuation
Thermal Decomposition Temperature (Td) > 500 °C (TGA) for superior thermal stability
Moisture Absorption 0.05%, minimizing performance fluctuation in humid environments
Coefficient of Thermal Expansion X-axis 47 ppm/°C, Y-axis 34 ppm/°C, Z-axis 117 ppm/°C
Copper Cladding Laminated with standard and reverse-treated electrodeposited copper foil for enhanced adhesion strength

 

Key Benefits

RT/duroid 6006 brings prominent technical and manufacturing advantages to microwave circuit designers:

 

High dielectric constant effectively shrinks circuit size for miniaturized antenna development

 

Low-loss characteristics perfectly suit X-band and sub-X-band microwave applications

 

Precise Dk and thickness tolerances ensure consistent performance across production batches

 

Ultra-low moisture absorption maintains electrical stability under harsh atmospheric conditions

 

Superior plated through-hole reliability adapts to multilayer fabrication and long-term service scenarios

 

Typical Applications

This RT/duroid 6006 2-layer RF PCB is widely deployed in high-end microwave and aerospace-related devices:

 

-Patch Antennas

-Satellite Communication Systems

-RF Power Amplifiers

-Aircraft Collision Avoidance Systems

-Ground-Based Radar Warning Systems

 

RT/duroid 6006 PCB 2-Layer 10mil Rogers Laminate with Immersion Silver 1

Tags: 

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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