Introducing our high-performance 2-layer PCB, meticulously designed for reliability and efficiency in various applications. Constructed with Rogers RO4360G2 material, this PCB offers an optimal blend of performance, cost-effectiveness, and ease of processing. With a focus on advanced technology, this product is ideal for base station power amplifiers and small cell transceivers.
Material Excellence: Rogers RO4360G2
At the core of our PCB is Rogers RO4360G2, a low-loss, glass-reinforced, hydrocarbon ceramic-filled thermoset laminate. This material is designed to provide exceptional performance while being processable in a manner similar to traditional FR-4 materials. Key features of RO4360G2 include:
- Dielectric Constant: 6.15 ± 0.15 at 10 GHz, ensuring minimal signal loss.
- Dissipation Factor: 0.0038 at 10 GHz, allowing for high-frequency applications.
- Thermal Properties: High Tg (> 280 °C) and thermal conductivity of 0.75 W/mK, suitable for demanding thermal environments.
- Environmental Compliance: Lead-free process capability, promoting environmentally friendly manufacturing practices.
| Property |
RO4360G2 |
Direction |
Units |
Condition |
Test Method |
| Dielectric Constant,εProcess |
6.15±0.15 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
| 2.5 GHz/23℃ |
| Dissipation Factor,tanδ |
0.0038 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
| Thermal Conductivity |
0.75 |
|
W/mK |
50℃ |
ASTM D-5470 |
| Volume Resistivity |
4.0 X 1013 |
|
Ω.cm |
Elevated T |
IPC-TM-650 2.5.17.1 |
| Surface Resistivity |
9.0 X 1012 |
|
Ω |
Elevated T |
IPC-TM-650 2.5.17.1 |
| Electrical Strength |
784 |
Z |
V/mil |
|
IPC-TM-650 2.5.6.2 |
| Tensile Strength |
131 (19) 97(14) |
X Y |
MPa (kpsi) |
40 hrs 50%RH/23 |
ASTM D638 |
| Flexural Strength |
213(31) 145(21) |
X Y |
Mpa (kpsi) |
40 hrs 50%RH/23 |
IPC-TM-650, 2.4.4 |
| Coefficient of Thermal Expansion |
13 14 28 |
X Y Z |
ppm/℃ |
-50 ℃to 288℃ After Replicated Heat Cycle |
IPC-TM-650, 2.1.41 |
| Tg |
>280 |
|
℃ TMA |
|
IPC-TM-650 2.4.24.3 |
| Td |
407 |
|
℃ |
|
ASTM D3850 using TGA |
| T288 |
>30 |
Z |
min |
30 min / 125℃ Prebake |
IPC-TM-650 2.2.24.1 |
| Moisure Absorption |
0.08 |
|
% |
50℃/48hr |
IPC-TM-650 2.6.2.1 ASTM D570 |
| Thermal Coefficient of er |
-131 @10 GHz |
Z |
ppm/℃ |
-50℃ to 150 ℃ |
IPC-TM-650, 2.5.5.5 |
| Density |
2.16 |
|
gm/cm3 |
RT |
ASTM D792 |
| Copper Peel Stength |
5.2 (0.91) |
|
pli (N/mm) |
Condtion B |
IPC-TM-650 2.4.8 |
| Flammability |
V-0 |
|
|
|
UL 94 File QMTS2. E102765 |
Technical Specifications
This 2-layer PCB features:
- Dimensions: 76.32mm x 67.51mm, optimized for compact applications.
- Layer Count: 2 layers, balancing complexity with efficiency.
- Minimum Trace/Space: 4/6 mils, accommodating modern design requirements.
- Finished Board Thickness: 0.3mm, ensuring a slim profile.
- Copper Weight: 1 oz (1.4 mils) on outer layers, providing reliable conductivity.
- Surface Finish: Electroless Nickel Immersion Gold (ENIG), enhancing solderability and corrosion resistance.
Quality Assurance
Each PCB undergoes rigorous 100% electrical testing prior to shipment, ensuring that every unit meets our high-quality standards and performs reliably in its intended application.
Benefits of RO4360G2 PCB
Design Flexibility
The design capabilities offered by our PCB allow engineers to create compact, efficient layouts without compromising performance. The combination of fine trace and space specifications, along with a low profile, makes it suitable for a variety of applications.
Reliability and Durability
With a robust construction that includes plated through-holes and a durable surface finish, this PCB is designed for longevity. The use of RO4360G2 materials enhances the board's rigidity and thermal performance, making it an excellent choice for high-power applications.
Automated Assembly Compatibility
This PCB is compatible with automated assembly processes, reducing manufacturing time and costs. This efficiency is crucial for companies looking to streamline production while maintaining high quality.
Environmentally Friendly
The lead-free process compatibility of this PCB aligns with global sustainability efforts, making it an environmentally responsible choice for manufacturers.
Typical Applications
This 2-layer PCB is suitable for a wide range of applications, particularly in telecommunications and industrial sectors:
- Base Station Power Amplifiers: The high-frequency performance and reliability of this PCB make it ideal for power amplifiers used in base stations.
- Small Cell Transceivers: Compact size and excellent thermal management capabilities are perfect for small cell transceiver applications, supporting the growing demand for mobile connectivity.
Conclusion
This newly shipped 2-layer PCB, constructed with Rogers RO4360G2, represents a significant advancement in PCB technology. With its high performance, reliability, and environmental compliance, it stands out in the competitive landscape of electronic components. We are committed to providing our customers with the best solutions tailored to their needs, ensuring that our products not only meet but exceed expectations. For inquiries or further information, please feel free to reach out—we're here to assist in your next project!
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