logo
English
Home ProductsRF PCB Board

TLX-8 PCB 50mil Double-Layer Immersion Gold 1OZ RF Circuit

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

I'm Online Chat Now

TLX-8 PCB 50mil Double-Layer Immersion Gold 1OZ RF Circuit

TLX-8 PCB 50mil Double-Layer Immersion Gold 1OZ RF Circuit
TLX-8 PCB 50mil Double-Layer Immersion Gold 1OZ RF Circuit TLX-8 PCB 50mil Double-Layer Immersion Gold 1OZ RF Circuit TLX-8 PCB 50mil Double-Layer Immersion Gold 1OZ RF Circuit

Large Image :  TLX-8 PCB 50mil Double-Layer Immersion Gold 1OZ RF Circuit

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: TLX-8 Layer Count: 2-layer
PCB Size: 130mm X 75 Mm=1PCS, +/- 0.15mm PCB Thickness: 50mil
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: Immersion Gold
Highlight:

1OZ RF Circuit PCB

,

TLX-8 PCB

,

50mil Double-Layer Immersion Gold PCB

TLX-8 PCB is a specialized printed circuit board made from high-performance PTFE fiberglass laminates, designed for reliability in a wide variety of RF applications. This versatile material is ideal for low layer count microwave designs, providing mechanical reinforcement in severe environments such as space launches, high-temperature engine modules, and maritime applications.

 

Key Features
- Excellent PIM Values: Achieving values lower than -160 dBc for enhanced performance.
- Mechanical & Thermal Properties: Exceptional resilience in extreme conditions.
- Low & Stable Dielectric Constant (Dk): Ensures consistent performance.
- Dimensionally Stable: Maintains integrity under varying conditions.
- Low Moisture Absorption: Minimizes the risk of performance degradation.
- UL 94 V0 Rating: Compliant with stringent flammability standards.

Electrical Properties
- Dielectric Constant @ 10 GHz: 2.55 ± 0.04
- Dissipation Factor @ 10 GHz: 0.0018
- Surface Resistivity: 6.605 x 10^8 Mohm (elevated temp), 3.550 x 10^6 Mohm (humidity)
- Volume Resistivity: 1.110 x 10^10 Mohm/cm (elevated temp), 1.046 x 10^10 Mohm/cm (humidity)

 

TLX-8 TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK @10 GHz IPC-650 2.5.5.3   2.55   2.55
Df @1.9 GHz IPC-650 2.5.5.5.1   0.0012   0.0012
Df @10 GHz IPC-650 2.5.5.5.1   0.0017   0.0017
Dielectric Breakdown IPC-650 2.5.6 kV >45 kV >45
Moisture Absorption IPC-650 2.6.2.1 % 0.02 % 0.02
Flexural Strength(MD) ASTM D 709 psi 28,900 N/mm2  
Flexural Strength(CD) ASTM D 709 psi 20,600 N/mm2  
Tensile Strength(MD) ASTM D 902 psi 35,600 N/mm2  
Tensile Strength(CD) ASTM D 902 psi 27,500 N/mm2  
Elongation at Break(MD) ASTM D 902 % 3.94 % 3.94
Elongation at Break(CD) ASTM D 902 % 3.92 % 3.92
Young's Modulus(MD) ASTM D 902 kpsi 980 N/mm2  
Young's Modulus(CD) ASTM D 902 kpsi 1,200 N/mm2  
Young's Modulus(MD) ASTM D 3039 kpsi 1,630 N/mm2  
Poisson's Ratio ASTM D 3039   0.135 N/mm  
Peel Stength(1 oz.ed) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 15 N/mm  
Peel Stength(1 oz.RTF) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 17 N/mm  
Peel Stength(½ oz.ed) IPC-650 2.4.8.3(Elevated Temp.) Ibs./linear inch 14 N/mm  
Peel Stength(½ oz.ed) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 11 N/mm  
Peel Stength(1 oz.rolled) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 13 N/mm 2.1
Thermal Conductivity ASTM F433/ASTM 1530-06 W/M*K 0.19 W/M*K 0.19
Dimensional Stability(MD) IPC-650 2.4.39 Sec.5.5(After Bake.) mils/in. 0.06 mm/M  
Dimensional Stability(CD) IPC-650 2.4.39 Sec.5.4(After Bake.) mils/in. 0.08 mm/M  
Dimensional Stability(MD) IPC-650 2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.09 mm/M  
Dimensional Stability(CD) IPC-650 2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.1 mm/M  
Surface Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) Mohm 6.605 x 108 Mohm 6.605 x 108
Surface Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) Mohm 3.550 x 106 Mohm 3.550 x 106
Volume Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) Mohm/cm 1.110 x 1010 Mohm/cm 1.110 x 1010
Volume Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) Mohm/cm 1.046 x 1010 Mohm/cm 1.046 x 1010
CTE(X axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 21 ppm/ 21
CTE(Y axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 23 ppm/ 23
CTE(Z axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 215 ppm/ 215
Density(Specific Gravity) ASTM D 792 g/cm3 2.25 g/cm3 2.25
Td(2% Weight Loss) IPC-650 2.4.24.6(TGA) 535  
Td(5% Weight Loss) IPC-650 2.4.24.6(TGA) 553  
Flammability Rating UL-94   V-0   V-0

 

TLX-8 PCB 50mil Double-Layer Immersion Gold 1OZ RF Circuit 0

 

The construction of this PCB includes a 2-layer rigid stackup, featuring 35 μm copper layers on both sides and a 1.27 mm (50 mil) Taconic TLX-8 core. The board dimensions are 130 mm x 75 mm (± 0.15 mm), with a finished thickness of 1.3 mm. It supports minimum trace and space requirements of 7/6 mils and a minimum hole size of 0.35 mm. Each board is finished with an immersion gold surface finish and a green top solder mask, with 100% electrical testing conducted prior to shipment to ensure reliability.

 

It is supplied with artwork in the Gerber RS-274-X format and complies with IPC-Class-2 quality standards. This PCB is available for worldwide, making it accessible to engineers globally.

 

Typical applications for TLX-8 PCB include radar systems, mobile communications, microwave test equipment, microwave transmission devices, and various coupling, splitting, combining, amplifying, and antenna solutions. With its advanced features and reliable performance, the TLX-8 PCB is an excellent choice for modern RF and microwave applications.

 

TLX-8 PCB 50mil Double-Layer Immersion Gold 1OZ RF Circuit 1

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)