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Product Details:
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| Base Material: | Woven Fiberglass Reinforced, PTFE-based Composites | Layer Count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
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| PCB Thickness: | Double Sided PCB, Multilayer PCB, Hybrid PCB | PCB Size: | ≤400mm X 500mm |
| Solder Mask: | Green, Black, Blue, Yellow, Red Etc. | Copper Weight: | 1oz (35µm), 2oz (70µm) |
| Surface Finish: | Bare Copper, HASL, ENIG, Immersion Silver, Immersion Tin, OSP, Pure Gold Plated Etc.. | ||
| High Light: | 30mil Rogers Printed Circuit Board,High Frequency Double Sided PCB,Immersion Tin Rogers PCB Board |
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Rogers DiClad 880 High Frequency PCB 20mil 30mil 60mil with Gold, Tin and Silver
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Brief Introduction
Rogers DiClad 880 PCBs are woven fiberglass reinforced, PTFE-based composites (without ceramic fillers) that offer lower dielectric constant and dissipation factors by using fewer plies of woven fiberglass and a higher ratio of PTFE content. Their DK and DF value are similar to RT/duroid 5880.
The dielectric constant of the circuit boards is adjusted by the precise control of the woven fiberglass and PTFE mixed ratio. The more the fiberglass, the larger the dielectric constant, however, the size stability is better. The woven fiberglass in the boards is stacked in the same direction to keep the performance of the XY direction consistent. Because of the use of woven fiberglass reinforcement, the size stability is better than RT/duroid 5880 and RT/duroid 5870 in the XY direction, but their thermal expansion coefficient in the Z-axis direction is larger.
Typical Properties of DiClad 880
| Property | Test Method | Condition | DiClad 880 |
| Dielectric Constant @ 10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 2.17, 2.20 |
| Dielectric Constant @ 1 MHz | IPC TM-650 2.5.5.3 | C23/50 | 2.17, 2.20 |
| Dissipation Factor @ 10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 0.0009 |
| Dissipation Factor @ 1 MHz | IPC TM-650 2.5.5.3 | C23/50 | 0.0008 |
| Thermal Coefficient of Er (ppm/°C) | IPC TM-650 2.5.5.5 Adapted |
-10°C to +140°C | -160 |
| Peel Strength (lbs.per inch) | IPC TM-650 2.4.8 | After Thermal Stress | 14 |
| Volume Resistivity (MΩ-cm) | IPC TM-650 2.5.17.1 | C96/35/90 | 1.4 x 10 9 |
| Surface Resistivity (MΩ) | IPC TM-650 2.5.17.1 | C96/35/90 | 2.9 x 10 6 |
| Arc Resistance | ASTM D-495 | D48/50 | >180 |
| Tensile Modulus (kpsi) | ASTM D-638 | A, 23°C | 267, 202 |
| Tensile Strength (kpsi) | ASTM D-882 | A, 23°C | 8.1, 7.5 |
| Compressive Modulus (kpsi) | ASTM D-695 | A, 23°C | 237 |
| Flexural Modulus (kpsi) | ASTM D-790 | A, 23°C | 357 |
| Dielectric Breakdown (kV) | ASTM D-149 | D48/50 | >45 |
| Density (g/cm3) | ASTM D-792 Method A | A, 23°C | 2.23 |
| Water Absorption (%) | MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2 |
E1/105 + D24/23 | 0.02 |
| Coefficient of Thermal | IPC TM-650 2.4.24 | 0°C to 100°C | |
| Expansion (ppm/°C) | Mettler 3000 | ||
| X Axis | Thermomechanical | 25 | |
| Y Axis | Analyzer | 34 | |
| Z Axis | 252 | ||
| Thermal Conductivity (W/mK) | ASTM E-1225 | 100°C | 0.261 |
| Outgassing | NASA SP-R-0022A | 125°C, ≤ 10-6 torr | |
| Total Mass Loss (%) | Maximum 1.00% | 0.01 | |
| Collected Volatile | Maximum 0.10% | 0.01 | |
| Condensable Material (%) | |||
| Water Vapor Regain (%) | 0.01 | ||
| Visible Condensate (±) | NO | ||
| Flammability UL File E 80166 | UL 94 Vertical Burn IPC TM-650 2.3.10 | C48/23/50, E24/125 | Meets requirements of UL94-V0 |
Features:
1. Extremely Low Loss Tangent at 0.0009
2. Excellent Dimensional Stability
3. Product Performance Uniformity
Benefits:
1. Electrical Properties are Highly Uniform Across Frequency
2. Consistent Mechanical Performance
3. Excellent Chemical Resistance
Typical Applications:
1. Commercial Phased Array Networks
2. Digital Radio Antennas
3. Filters, Couplers, LNAs
4. Low Loss Base Station Antennas
5. Military Radar Feed Networks
6. Missile Guidance Systems
Our PCB Capability (DiClad 880)
| PCB Material: | Woven Fiberglass Reinforced, PTFE-based Composites |
| Designation: | DiClad 880 |
| Dielectric constant: | 2.20 (10 GHz) |
| Dissipation factor | 0.0009 (10 GHz) |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
Our Advantages
1. Engineering design prevents problems from occurring in pre-production;
2. ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;
3. AOI inspection;
4. Powerful PCB capabilities support your research and development, sales and marketing;
5. Delivery on time higher than 98% on-time-delivery rate;
6. Any Layer HDI PCBs;
7. 16000㎡ workshop; 30000㎡ output capability per month; 8000 types of PCB's per month;
8. Quick CADCAM checking and free PCB quotation;
9. Diversified shipping method: FedEx, DHL, TNT, EMS;
10. No MOQ, low cost for prototypes and small runs quantity;
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
