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Product Details:
Payment & Shipping Terms:
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| Base Material: | Rogers RO4533 1.524mm | Layer Count: | 2 Layers |
|---|---|---|---|
| PCB Thickness: | 1.6 Mm ±0.16 | PCB Size: | 55 X 92mm=1up |
| Copper Weight: | 1oz | Surface Finish: | Immersion Gold |
| High Light: | 60mil Rogers PCB Board,1.6mm Immersion Gold Circuit Board,Double Layer Rogers PCB Board |
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RO4533 Antenna High Frequency PCB 60mil Rogers 4533 Double Layer Immersion Gold Circuit Board
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
This is a type of double sided high frequency PCB built on Rogers RO4533, a type of cost performance and antenna grade laminates. It is on 60mil(1.524mm) core with 1oz copper finished, no solder mask on both sides. Immersion gold is on top layer and bottom layer with vias. The boards are fabricated per IPC 6012 Class 2 using supplied Gerber data. Every 25 boards are packed for shipment.
PCB Specifications
| PCB SIZE | 55 x 92mm=1up |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 17um(0.5 oz)+plate TOP layer |
| Rogers RO4533 1.524mm | |
| copper ------- 17um(0.5 oz) + plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 10 mil / 10 mil |
| Minimum / Maximum Holes: | 0.3 mm / 4.0 mm |
| Number of Different Holes: | 3 |
| Number of Drill Holes: | 159 |
| Number of Milled Slots: | 1 |
| Number of Internal Cutouts: | 2 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | Rogers RO4533 1.524mm |
| Final foil external: | 1.0 oz |
| Final foil internal: | N/A |
| Final height of PCB: | 1.6 mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold, 91% |
| Solder Mask Apply To: | N/A |
| Solder Mask Color: | N/A |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | N/A |
| Colour of Component Legend | N/A |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated through hole(PTH), minimum size 0.3mm. |
| FLAMIBILITY RATING | 94V-0 |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Typical Applications:
1. Cellular infrastructure base station antennas
2. WiMAX antenna networks
Our Advantages
1.ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
2.More than 18+ years’ high frequency PCB experience;
3.Small quantity order is available, no MOQ required;
4.We’re a Team of passion, discipline, responsibility and honesty;
5.Delivery on time: >98%, Customer complaint rate: <1%
6.16000㎡ workshop, 30000㎡ output a month and 8000 types of PCB's a month;
7.Powerful PCB capabilities support your research and development, sales and marketing;
8.IPC Class 2 / IPC Class 3
Typical Values (RO4533, RO4534, RO4535)
| Property | Typical Values | Direction | Units | Condition | Test Method | ||
| RO4533 | RO4534 | RO4535 | |||||
| Dielectric Constant, er Process | 3.3 ± 0.08 | 3.4 ± 0.08 | 3.44 ± 0.08 | Z | - | 10 GHz/23℃ 2.5 GHz | IPC-TM-650,2.5.5.5 |
| Dissipation Factor | 0.002 | 0.0022 | 0.0032 | Z | - | 2.5 GHz/23℃ | IPC-TM-650, 2.5.5.5 |
| 0.0025 | 0.0027 | 0.0037 | 10 GHz/23℃ | ||||
| PIM (Typical) | -157 | -157 | -157 | - | dBc | Reflected 43 dBm swept tones | Summitek 1900b PIM Analyzer |
| Dielectric Strength | >500 | >500 | >500 | Z | V/mil | 0.51 mm | IPC-TM-650, 2.5.6.2 |
| Dimensional Stability | <0.2 | <0.3 | <0.5 | X,Y | mm/m (mils/inch) | after etch | IPC-TM-650, 2.4.39A |
| Coefficient of Thermal Expansion | 13 | 11 | 16 | X | ppm/℃ | -55 to 288℃ | IPC-TM-650, 2.4.41 |
| 11 | 14 | 17 | Y | ||||
| 37 | 46 | 50 | Z | ||||
| Thermal Conductivity | 0.6 | 0.6 | 0.6 | - | W/(m.K) | 80℃ | ASTM C518 |
| Moisture Absorption | 0.02 | 0.06 | 0.09 | - | % | D48/50 | IPC-TM-650, 2.6.2.1 ASTM D570 |
| Tg | >280 | >280 | >280 | - | ℃ TMA | A | IPC-TM-650, 2.4.24.3 |
| Density | 1.8 | 1.8 | 1.9 | - | gm/cm3 | - | ASTM D792 |
| Copper Peel Strength | 6.9 (1.2) | 6.3 (1.1) | 5.1 (0.9) | - | lbs/in (N/mm) | 1 oz. EDC post solder float | IPC-TM-650, 2.4.8 |
| Flammability | NON FR | NON FR | V-0 | - | - | - | UL 94 |
| Lead-Free Process Compatible | Yes | Yes | Yes | - | - | - | - |
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
