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3 Layer 13.3mil High TG PCB Hybrid RO4350B And 31mil RT Duroid 5880

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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3 Layer 13.3mil High TG PCB Hybrid RO4350B And 31mil RT Duroid 5880

3 Layer 13.3mil High TG PCB Hybrid RO4350B And 31mil RT Duroid 5880
3 Layer 13.3mil High TG PCB Hybrid RO4350B And 31mil RT Duroid 5880 3 Layer 13.3mil High TG PCB Hybrid RO4350B And 31mil RT Duroid 5880 3 Layer 13.3mil High TG PCB Hybrid RO4350B And 31mil RT Duroid 5880 3 Layer 13.3mil High TG PCB Hybrid RO4350B And 31mil RT Duroid 5880 3 Layer 13.3mil High TG PCB Hybrid RO4350B And 31mil RT Duroid 5880 3 Layer 13.3mil High TG PCB Hybrid RO4350B And 31mil RT Duroid 5880

Large Image :  3 Layer 13.3mil High TG PCB Hybrid RO4350B And 31mil RT Duroid 5880

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-073.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: RO4350B 13.3mil (0.338mm) + RT/duroid 5880 31 Mil (0.787mm) Layer Count: 3 Layers
PCB Thickness: 1.3mm PCB Size: 160mm X 90mm = 1 Type = 1 Piece
Solder Mask: Green Silkscreen: White
Copper Weight: Outer Layer 35μm | Inner Layer 35μm Surface Finish: Immersion Gold
High Light:

Hybrid High TG PCB

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13.3mil High TG PCB

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13.3mil 3 Layer PCB Board

 

3 Layer Hybrid PCB Board Made On 13.3mil RO4350B and 31mil RT/Duroid 5880 for Multicoupler Antenna

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

The hybrid PCB can be a mixture of FR-4 and high frequency material, and a mixture of high frequency material with different dielectric constant (DK), for example RT/duroid 5880 and RO4350B etc.

 

Today we’ll talk about a type of mixed high frequency PCB made on 13.3mil (0.338mm) RO4350B and 31mil (0.787mm) RT/duroid 5880. It’s for the application of multi-coupler antenna.

 

3 Layer 13.3mil High TG PCB Hybrid RO4350B And 31mil RT Duroid 5880 0

 

This is a 3-layer board that one layer is etched off. The basic specifications are as follows:

Base material: RO4350B 13.3mil (0.338mm) + RT/duroid 5880 31 mil (0.787mm)

Dielectric constant: 3.48+/-0.05

Layer count: 3 layers

Via type: Through holes, blind vias

Format: 160mm x 90mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35μm | Inner layer 35μm

Solder mask / Legend: Green / White

Final PCB height: 1.3 mm

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 20 working days

Shelf life: 6 months


Features and benefits

1) Lowest electrical loss for reinforeced PTFE material

2) Enhanced electrical performance;

3) 16000 square meter workshop;

4) 30000 square meter month capability;

5) 8000 types of PCB's per month;

6) More than 17 years of PCB experience;

 

Applications

Point to Point Digital Radio Antennas, WiFi Amplifier, Tower-mounted Booster, Power Amplifier, RF Module

 

3 Layer 13.3mil High TG PCB Hybrid RO4350B And 31mil RT Duroid 5880 1

 

Properties of RT/duroid 5880

RT/duroid 5880 Typical Value
Property RT/duroid 5880 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.20
2.20±0.02 spec.
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign 2.2 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0004
0.0009
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε -125 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
(cal/g/c)
N/A Calculated
Tensile Modulus Test at 23℃ Test at 100℃ N/A MPa(kpsi) A ASTM D 638
1070(156) 450(65) X
860(125) 380(55) Y
Ultimate Stress 29(4.2) 20(2.9) X
27(3.9) 18(2.6) Y
Ultimate Strain 6 7.2 X %
4.9 5.8 Y
Compressive Modulus 710(103) 500(73) X MPa(kpsi) A ASTM D 695
710(103) 500(73) Y
940(136) 670(97) Z
Ultimate Stress 27(3.9) 22(3.2) X
29(5.3) 21(3.1) Y
52(7.5) 43(6.3) Z
Ultimate Strain 8.5 8.4 X %
7.7 7.8 Y
12.5 17.6 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.2 Z W/m/k 80℃ ASTM C 518
Coefficient of Thermal Expansion 31
48
237
X
Y
Z
ppm/℃ 0-100℃ IPC-TM-650 2.4.41
Td 500 N/A ℃ TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel 31.2(5.5) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float
IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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