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RO4730G3 2 layers 0.6mm Immersion Gold PCB With Green Solder Mask

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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RO4730G3 2 layers 0.6mm Immersion Gold PCB With Green Solder Mask

RO4730G3 2 layers 0.6mm Immersion Gold PCB With Green Solder Mask
RO4730G3 2 layers 0.6mm Immersion Gold PCB With Green Solder Mask RO4730G3 2 layers 0.6mm Immersion Gold PCB With Green Solder Mask

Large Image :  RO4730G3 2 layers 0.6mm Immersion Gold PCB With Green Solder Mask

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-058.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: RO4730G3 20mil Layer Count: 2 Layers
PCB Thickness: 0.6mm PCB Size: 110mm X 50mm = 1 Type = 1 Piece
Solder Mask: Green Silkscreen: White
Copper Weight: Outer Layer 35 μm Surface Finish: Immersion Gold
High Light:

2 Layers Immersion Gold PCB


0.6mm Immersion Gold PCB


IATF16949 0.6 mm PCB


Rogers High Frequency PCB Built On RO4730G3 20mil 0.508mm DK3.0 With Immersion Gold for Cellular Base Station Antenna

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Rogers RO4730G3 antenna grade laminates are reliable, low-cost alternative to the conventional PTFE-based laminates. It has the mechanical and electrical properties that antenna designers need. The materials have a dielectric constant of 3.0 and a loss tangent of 0.0022 measured at 2.5 GHz when using LoPro Reverse Treated EDC foil. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Materials are available with demonstrated low PIM performance, with values better than -160dBc.


RO4730G3 materials are compatible with conventional epoxy and high temperature lead-free solder processing. It does not require the special treatment needed on traditional PTFE-based laminates for plated through holes preparation. Multi-layer can be achieved using RO4450F bondply at 175 ℃. The resin systems of RO4730G3 are designed to provide the properties sought after by antenna designers. The glass transition temperature exceeds 280oC, leading to a low Z-axis CTE, excellent plated through holes reliability, and lead free solder processability.


Typical application is cellular base station antennas.


General description

This is a type of double sided RF PCB built on 0.508mm (20mil) RO4730G3 for the application of Cellular Base Station Antenna PCB.


Basic specifications

Base material: RO4730G3 20mil (0.508mm)

Dielectric constant: 3.0+/-0.5

Layer count: 2 layers

Type: Through holes

Format: 110mm x 50mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm

Solder mask | Legend: Green | White

Final PCB height: 0.60 mm

Standard: IPC 6012 Class 2

Packing: 20 pieces are packed for shipment.

Lead time: 7 working days

Shelf life: 6 months


RO4730G3 2 layers 0.6mm Immersion Gold PCB With Green Solder Mask 0


Data Sheet of Rogers 4730 (RO4730G3)

RO4730G3 Typical Value
Property RO4730G3 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.5 Z   10 GHz 23℃ IPC-TM-650
Dielectric Constant,εDesign 2.98 Z   1.7 GHz to 5 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0028 Z   10 GHz 23℃ IPC-TM-650
  2.5 GHz
Thermal Coefficient of ε +34 Z ppm/℃ -50 ℃to 150℃ IPC-TM-650
Dimensional Stability <0.4 X, Y mm/m after etech +E2/150 ℃ IPC-TM-650 2.4.39A
Volume Resistivity (0.030") 9 X 107   MΩ.cm COND A IPC-TM-650
Surface Resistivity (0.030") 7.2 X 105   COND A IPC-TM-650
PIM -165   dBc 50 ohm 0.060" 43 dBm 1900 MHz
Electrical Strength (0.030") 730 Z V/mil   IPC-TM-650
Flexural Strength MD 181 (26.3)   Mpa (kpsi) RT ASTM D790
CMD 139 (20.2)  
Moisure Absorption 0.093 - % 48/50 IPC-TM-650 ASTM D570
Thermal Conductivity 0.45 Z W/mK 50℃ ASTM D5470
Coefficient of Thermal Expansion 15.9
ppm/℃ -50 ℃to 288℃ IPC-TM-650
Tg >280     IPC-TM-650 2.4.24
Td 411     ASTM D3850
Density 1.58   gm/cm3   ASTM D792
Copper Peel Stength 4.1   pli 1oz,LoPro EDC IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        


Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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