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Microwave RO3010 Rogers PCB Board 50mil 1.270mm DK10.2 For Power Amplifiers

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Microwave RO3010 Rogers PCB Board 50mil 1.270mm DK10.2 For Power Amplifiers

Microwave RO3010 Rogers PCB Board 50mil 1.270mm DK10.2 For Power Amplifiers
Microwave RO3010 Rogers PCB Board 50mil 1.270mm DK10.2 For Power Amplifiers

Large Image :  Microwave RO3010 Rogers PCB Board 50mil 1.270mm DK10.2 For Power Amplifiers

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-050.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: RO3010 Layer Count: 2 Layers
PCB Thickness: 1.4mm PCB Size: 75 X 80 Mm = 1 PCS
Solder Mask: Green Silkscreen: White
Copper Weight: 0.5oz Surface Finish: Immersion Gold
High Light:

Microwave RO3010 Rogers PCB Board


50mil Rogers PCB Board


Power Amplifiers Rogers PCB Board


Rogers Microwave PCB Made on RO3010 50mil 1.270mm DK10.2 With Immersion Gold for Power Amplifiers and Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Rogers RO3010 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3010 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.


The typical applications are cellular telecommunications systems, direct broadcast satellites, patch antenna for wireless communications, power backplanes etc.


PCB Specifications

PCB SIZE 75 x 80 mm = 1 PCS
BOARD TYPE High Frequency PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3010 1.270mm
copper ------- 18um(0.5 oz)+plate BOT Layer
Minimum Trace and Space: 5.8mil/5.4mil
Minimum / Maximum Holes: 0.4mm / 0.6mm
Number of Different Holes: 1
Number of Drill Holes: 4
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
Glass Epoxy: RO3010 1.270mm
Final foil external: 1oz
Final foil internal: 0oz
Final height of PCB: 1.4mm ± 10%
Surface Finish Immersion Gold
Solder Mask Apply To: TOP
Solder Mask Color: Green
Solder Mask Type: N/A
Side of Component Legend TOP
Colour of Component Legend White
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated through hole(PTH)
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


Microwave RO3010 Rogers PCB Board 50mil 1.270mm DK10.2 For Power Amplifiers 0


Data Sheet of Rogers 3010 (RO3010)

RO3010 Typical Value
Property RO3010 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.05 Z   10 GHz/23 IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 11.2 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0022 Z   10 GHz/23 IPC-TM-650
Thermal Coefficient of ε -395 Z ppm/ 10 GHz -50to 150 IPC-TM-650
Dimensional Stability 0.35
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105   MΩ.cm COND A IPC
Surface Resistivity 105   COND A IPC
Tensile Modulus 1902
MPa 23 ASTM D 638
Moisture Absorption 0.05   % D48/50 IPC-TM-650
Specific Heat 0.8   j/g/k   Calculated
Thermal Conductivity 0.95   W/M/K 50 ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288
ppm/ 23/50% RH IPC-TM-650
Td 500   TGA   ASTM D 3850
Density 2.8   gm/cm3 23 ASTM D 792
Copper Peel Stength 9.4   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        


Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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