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2-layer FSD1020T PCB High-DK Low-Loss RF Circuit Board

2-layer FSD1020T PCB High-DK Low-Loss RF Circuit Board

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-272.V1.0
Base Material:
FSD1020T Hydrocarbon Nano-ceramic Composite Substrate
Layer Count:
2 Layers
PCB Thickness:
0.508mm Core Dielectric Thickness
PCB Size:
96mm × 47mm (1 Piece)
Solder Mask:
Gren
Silkscreen:
No
Copper Weight:
1oz Outer Copper Layer
Surface Finish:
ENIG (170% Enhanced Plating Coverage)
Highlight:

GPS Navigation Flexible PCB Board

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PI Substrate Flexible PCB Board

,

PI Substrate Flex Printed Circuit Board

Product Description

This custom 2-layer rigid high-power RF PCB is fabricated with FSD1020T low-loss hydrocarbon nano-ceramic composite substrate, engineered for high-DK, low-loss and high-current high-frequency circuit applications. The PCB features green solder mask on the top layer with no silkscreen, while the bottom layer is fully mask-free and silkscreen-free. Finished with enhanced ENIG plating, the board adopts resin plugging and capping treatment for 0.4mm holes to ensure superior hole reliability and insulation performance. All finished units undergo strict quality verification to deliver excellent thermal stability, high insulation strength and consistent RF performance for industrial high-power and precision control systems.

 

PCB Specifications

Parameter Item Specification
Base Material FSD1020T hydrocarbon nano-ceramic composite substrate
Layer Configuration 2-layer rigid PCB structure
Board Dimension 96mm × 47mm (1 piece)
Substrate Thickness 0.508mm core dielectric thickness
Outer Copper Weight 1oz outer copper layer
Minimum Hole Diameter 0.4mm
Hole Processing Resin plugging + capping treatment
Surface Finishing ENIG (170% enhanced plating coverage)
Top Solder Mask Green solder mask, no silkscreen
Bottom Solder Mask Solder mask-free, silkscreen-free

 

FSD1020T Material Overview

FSD1020T is a high-DK low-loss hydrocarbon nano-ceramic composite dielectric material, specially developed for high-current and high-power RF microwave applications. It delivers precise dielectric constant matching for RF substrates and serves as the optimal solution for hybrid high-frequency and low-loss hydrocarbon circuit designs. Featuring superior mechanical processability, outstanding CAF resistance, high thermal stability and halogen-free environmental performance, this rigid substrate ensures stable electrical insulation and consistent RF characteristics under high-voltage and high-current operating conditions.

 

2-layer FSD1020T PCB High-DK Low-Loss RF Circuit Board 0

 

Core Material Features

High-DK Dielectric Property: High and stable dielectric constant suitable for miniaturized high-frequency circuit design

 

Excellent CAF Resistance: Effectively prevents conductive anodic filament growth, improving long-term service reliability

 

High Thermal Stability: High Tg of 280°C with outstanding thermal shock resistance

 

Low-Loss RF Performance: Ultra-low dissipation factor minimizes high-frequency signal attenuation

 

Superior Insulation Capacity: Reliable high-voltage and high-current dielectric insulation performance

 

Environmentally Compliant: Halogen-free and fully RoHS compliant

 

Material Electrical & Mechanical Performance Data

Test Item Test Method Condition Unit Typical Value
Dielectric Constant (Dk) @ 10GHz IPC-TM-650 2.5.5.5 23°C - 10.2±0.2
Dissipation Factor (Df) @ 10GHz IPC-TM-650 2.5.5.5 23°C - 0.0038
Peel Strength IPC-TM-650 2.4.8 288°C/10s N/mm (lb/in) 0.7 (4)
Volume Resistivity IPC-TM-650 2.5.17.1 Condition A MΩ·cm 2×10⁸
Surface Resistivity IPC-TM-650 2.5.17.1 Condition A 4×10⁷
Water Absorption IPC-TM-650 2.6.2.1 D-24/23 % 0.16
3-Axis CTE (30~260°C) IPC-TM-650 2.4.24 TMA Test ppm/°C X<19, Y<19, Z<20
Dielectric Breakdown Voltage IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 20
Thermal Stress Resistance IPC-TM-650 2.4.13.1 288°C, 10s - Pass visual inspection
Flame Resistance UL94 C-48/23/50 Rating V0

 

Typical Application Fields

With high dielectric constant, low high-frequency loss, excellent insulation performance and superior thermal & structural stability, FSD1020T PCBs are widely deployed in high-power RF and precision industrial control systems:

 

  • Surveying and mapping equipment
  • UAV flight control systems
  • Industrial safety monitoring devices
  • Intelligent transportation systems
  • Precision machinery manufacturing equipment
  • Ship-borne navigation systems
  • Vehicle driving test tower equipment

2-layer FSD1020T PCB High-DK Low-Loss RF Circuit Board 1

Products
PRODUCTS DETAILS
2-layer FSD1020T PCB High-DK Low-Loss RF Circuit Board
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-272.V1.0
Base Material:
FSD1020T Hydrocarbon Nano-ceramic Composite Substrate
Layer Count:
2 Layers
PCB Thickness:
0.508mm Core Dielectric Thickness
PCB Size:
96mm × 47mm (1 Piece)
Solder Mask:
Gren
Silkscreen:
No
Copper Weight:
1oz Outer Copper Layer
Surface Finish:
ENIG (170% Enhanced Plating Coverage)
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

GPS Navigation Flexible PCB Board

,

PI Substrate Flexible PCB Board

,

PI Substrate Flex Printed Circuit Board

Product Description

This custom 2-layer rigid high-power RF PCB is fabricated with FSD1020T low-loss hydrocarbon nano-ceramic composite substrate, engineered for high-DK, low-loss and high-current high-frequency circuit applications. The PCB features green solder mask on the top layer with no silkscreen, while the bottom layer is fully mask-free and silkscreen-free. Finished with enhanced ENIG plating, the board adopts resin plugging and capping treatment for 0.4mm holes to ensure superior hole reliability and insulation performance. All finished units undergo strict quality verification to deliver excellent thermal stability, high insulation strength and consistent RF performance for industrial high-power and precision control systems.

 

PCB Specifications

Parameter Item Specification
Base Material FSD1020T hydrocarbon nano-ceramic composite substrate
Layer Configuration 2-layer rigid PCB structure
Board Dimension 96mm × 47mm (1 piece)
Substrate Thickness 0.508mm core dielectric thickness
Outer Copper Weight 1oz outer copper layer
Minimum Hole Diameter 0.4mm
Hole Processing Resin plugging + capping treatment
Surface Finishing ENIG (170% enhanced plating coverage)
Top Solder Mask Green solder mask, no silkscreen
Bottom Solder Mask Solder mask-free, silkscreen-free

 

FSD1020T Material Overview

FSD1020T is a high-DK low-loss hydrocarbon nano-ceramic composite dielectric material, specially developed for high-current and high-power RF microwave applications. It delivers precise dielectric constant matching for RF substrates and serves as the optimal solution for hybrid high-frequency and low-loss hydrocarbon circuit designs. Featuring superior mechanical processability, outstanding CAF resistance, high thermal stability and halogen-free environmental performance, this rigid substrate ensures stable electrical insulation and consistent RF characteristics under high-voltage and high-current operating conditions.

 

2-layer FSD1020T PCB High-DK Low-Loss RF Circuit Board 0

 

Core Material Features

High-DK Dielectric Property: High and stable dielectric constant suitable for miniaturized high-frequency circuit design

 

Excellent CAF Resistance: Effectively prevents conductive anodic filament growth, improving long-term service reliability

 

High Thermal Stability: High Tg of 280°C with outstanding thermal shock resistance

 

Low-Loss RF Performance: Ultra-low dissipation factor minimizes high-frequency signal attenuation

 

Superior Insulation Capacity: Reliable high-voltage and high-current dielectric insulation performance

 

Environmentally Compliant: Halogen-free and fully RoHS compliant

 

Material Electrical & Mechanical Performance Data

Test Item Test Method Condition Unit Typical Value
Dielectric Constant (Dk) @ 10GHz IPC-TM-650 2.5.5.5 23°C - 10.2±0.2
Dissipation Factor (Df) @ 10GHz IPC-TM-650 2.5.5.5 23°C - 0.0038
Peel Strength IPC-TM-650 2.4.8 288°C/10s N/mm (lb/in) 0.7 (4)
Volume Resistivity IPC-TM-650 2.5.17.1 Condition A MΩ·cm 2×10⁸
Surface Resistivity IPC-TM-650 2.5.17.1 Condition A 4×10⁷
Water Absorption IPC-TM-650 2.6.2.1 D-24/23 % 0.16
3-Axis CTE (30~260°C) IPC-TM-650 2.4.24 TMA Test ppm/°C X<19, Y<19, Z<20
Dielectric Breakdown Voltage IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 20
Thermal Stress Resistance IPC-TM-650 2.4.13.1 288°C, 10s - Pass visual inspection
Flame Resistance UL94 C-48/23/50 Rating V0

 

Typical Application Fields

With high dielectric constant, low high-frequency loss, excellent insulation performance and superior thermal & structural stability, FSD1020T PCBs are widely deployed in high-power RF and precision industrial control systems:

 

  • Surveying and mapping equipment
  • UAV flight control systems
  • Industrial safety monitoring devices
  • Intelligent transportation systems
  • Precision machinery manufacturing equipment
  • Ship-borne navigation systems
  • Vehicle driving test tower equipment

2-layer FSD1020T PCB High-DK Low-Loss RF Circuit Board 1

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