| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Standard Packaging: | Vacuum bags+Cartons |
| Delivery Period: | 8-9 working days |
| Payment Method: | T/T |
| Supply Capacity: | 5000PCS per month |
This custom 2-layer rigid high-power RF PCB is fabricated with FSD1020T low-loss hydrocarbon nano-ceramic composite substrate, engineered for high-DK, low-loss and high-current high-frequency circuit applications. The PCB features green solder mask on the top layer with no silkscreen, while the bottom layer is fully mask-free and silkscreen-free. Finished with enhanced ENIG plating, the board adopts resin plugging and capping treatment for 0.4mm holes to ensure superior hole reliability and insulation performance. All finished units undergo strict quality verification to deliver excellent thermal stability, high insulation strength and consistent RF performance for industrial high-power and precision control systems.
PCB Specifications
| Parameter Item | Specification |
| Base Material | FSD1020T hydrocarbon nano-ceramic composite substrate |
| Layer Configuration | 2-layer rigid PCB structure |
| Board Dimension | 96mm × 47mm (1 piece) |
| Substrate Thickness | 0.508mm core dielectric thickness |
| Outer Copper Weight | 1oz outer copper layer |
| Minimum Hole Diameter | 0.4mm |
| Hole Processing | Resin plugging + capping treatment |
| Surface Finishing | ENIG (170% enhanced plating coverage) |
| Top Solder Mask | Green solder mask, no silkscreen |
| Bottom Solder Mask | Solder mask-free, silkscreen-free |
FSD1020T Material Overview
FSD1020T is a high-DK low-loss hydrocarbon nano-ceramic composite dielectric material, specially developed for high-current and high-power RF microwave applications. It delivers precise dielectric constant matching for RF substrates and serves as the optimal solution for hybrid high-frequency and low-loss hydrocarbon circuit designs. Featuring superior mechanical processability, outstanding CAF resistance, high thermal stability and halogen-free environmental performance, this rigid substrate ensures stable electrical insulation and consistent RF characteristics under high-voltage and high-current operating conditions.
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Core Material Features
High-DK Dielectric Property: High and stable dielectric constant suitable for miniaturized high-frequency circuit design
Excellent CAF Resistance: Effectively prevents conductive anodic filament growth, improving long-term service reliability
High Thermal Stability: High Tg of 280°C with outstanding thermal shock resistance
Low-Loss RF Performance: Ultra-low dissipation factor minimizes high-frequency signal attenuation
Superior Insulation Capacity: Reliable high-voltage and high-current dielectric insulation performance
Environmentally Compliant: Halogen-free and fully RoHS compliant
Material Electrical & Mechanical Performance Data
| Test Item | Test Method | Condition | Unit | Typical Value |
| Dielectric Constant (Dk) @ 10GHz | IPC-TM-650 2.5.5.5 | 23°C | - | 10.2±0.2 |
| Dissipation Factor (Df) @ 10GHz | IPC-TM-650 2.5.5.5 | 23°C | - | 0.0038 |
| Peel Strength | IPC-TM-650 2.4.8 | 288°C/10s | N/mm (lb/in) | 0.7 (4) |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | Condition A | MΩ·cm | 2×10⁸ |
| Surface Resistivity | IPC-TM-650 2.5.17.1 | Condition A | MΩ | 4×10⁷ |
| Water Absorption | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.16 |
| 3-Axis CTE (30~260°C) | IPC-TM-650 2.4.24 | TMA Test | ppm/°C | X<19, Y<19, Z<20 |
| Dielectric Breakdown Voltage | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 20 |
| Thermal Stress Resistance | IPC-TM-650 2.4.13.1 | 288°C, 10s | - | Pass visual inspection |
| Flame Resistance | UL94 | C-48/23/50 | Rating | V0 |
Typical Application Fields
With high dielectric constant, low high-frequency loss, excellent insulation performance and superior thermal & structural stability, FSD1020T PCBs are widely deployed in high-power RF and precision industrial control systems:
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| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Standard Packaging: | Vacuum bags+Cartons |
| Delivery Period: | 8-9 working days |
| Payment Method: | T/T |
| Supply Capacity: | 5000PCS per month |
This custom 2-layer rigid high-power RF PCB is fabricated with FSD1020T low-loss hydrocarbon nano-ceramic composite substrate, engineered for high-DK, low-loss and high-current high-frequency circuit applications. The PCB features green solder mask on the top layer with no silkscreen, while the bottom layer is fully mask-free and silkscreen-free. Finished with enhanced ENIG plating, the board adopts resin plugging and capping treatment for 0.4mm holes to ensure superior hole reliability and insulation performance. All finished units undergo strict quality verification to deliver excellent thermal stability, high insulation strength and consistent RF performance for industrial high-power and precision control systems.
PCB Specifications
| Parameter Item | Specification |
| Base Material | FSD1020T hydrocarbon nano-ceramic composite substrate |
| Layer Configuration | 2-layer rigid PCB structure |
| Board Dimension | 96mm × 47mm (1 piece) |
| Substrate Thickness | 0.508mm core dielectric thickness |
| Outer Copper Weight | 1oz outer copper layer |
| Minimum Hole Diameter | 0.4mm |
| Hole Processing | Resin plugging + capping treatment |
| Surface Finishing | ENIG (170% enhanced plating coverage) |
| Top Solder Mask | Green solder mask, no silkscreen |
| Bottom Solder Mask | Solder mask-free, silkscreen-free |
FSD1020T Material Overview
FSD1020T is a high-DK low-loss hydrocarbon nano-ceramic composite dielectric material, specially developed for high-current and high-power RF microwave applications. It delivers precise dielectric constant matching for RF substrates and serves as the optimal solution for hybrid high-frequency and low-loss hydrocarbon circuit designs. Featuring superior mechanical processability, outstanding CAF resistance, high thermal stability and halogen-free environmental performance, this rigid substrate ensures stable electrical insulation and consistent RF characteristics under high-voltage and high-current operating conditions.
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Core Material Features
High-DK Dielectric Property: High and stable dielectric constant suitable for miniaturized high-frequency circuit design
Excellent CAF Resistance: Effectively prevents conductive anodic filament growth, improving long-term service reliability
High Thermal Stability: High Tg of 280°C with outstanding thermal shock resistance
Low-Loss RF Performance: Ultra-low dissipation factor minimizes high-frequency signal attenuation
Superior Insulation Capacity: Reliable high-voltage and high-current dielectric insulation performance
Environmentally Compliant: Halogen-free and fully RoHS compliant
Material Electrical & Mechanical Performance Data
| Test Item | Test Method | Condition | Unit | Typical Value |
| Dielectric Constant (Dk) @ 10GHz | IPC-TM-650 2.5.5.5 | 23°C | - | 10.2±0.2 |
| Dissipation Factor (Df) @ 10GHz | IPC-TM-650 2.5.5.5 | 23°C | - | 0.0038 |
| Peel Strength | IPC-TM-650 2.4.8 | 288°C/10s | N/mm (lb/in) | 0.7 (4) |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | Condition A | MΩ·cm | 2×10⁸ |
| Surface Resistivity | IPC-TM-650 2.5.17.1 | Condition A | MΩ | 4×10⁷ |
| Water Absorption | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.16 |
| 3-Axis CTE (30~260°C) | IPC-TM-650 2.4.24 | TMA Test | ppm/°C | X<19, Y<19, Z<20 |
| Dielectric Breakdown Voltage | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 20 |
| Thermal Stress Resistance | IPC-TM-650 2.4.13.1 | 288°C, 10s | - | Pass visual inspection |
| Flame Resistance | UL94 | C-48/23/50 | Rating | V0 |
Typical Application Fields
With high dielectric constant, low high-frequency loss, excellent insulation performance and superior thermal & structural stability, FSD1020T PCBs are widely deployed in high-power RF and precision industrial control systems:
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