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Rogers RO3006 Microwave PCB 2-Layer Rogers 3006 25mil 0.635mm Circuit Board DK6.15 DF 0.002 High Frequency PCB
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Rogers RO3006 Microwave PCB 2-Layer Rogers 3006 25mil 0.635mm Circuit Board DK6.15 DF 0.002 High Frequency PCB
  • name
  • name
  • name

Rogers RO3006 Microwave PCB 2-Layer Rogers 3006 25mil 0.635mm Circuit Board DK6.15 DF 0.002 High Frequency PCB

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-046.V1.0
Base Material:
RO3006
Layer Count:
2 Layers
PCB Thickness:
0.8mm
PCB Size:
70 X 75mm=1PCS
Solder Mask:
Green
Silkscreen:
White
Copper Weight:
0.5oz
Surface Finish:
Immersion Gold
Highlight:

0.635mm RF PCB Board

,

DK6.15 RF PCB Board

,

25mil Immersion Gold PCB

Product Description

 

Rogers RO3006 Microwave PCB 2-Layer Rogers 3006 25mil 0.635mm Circuit Board DK6.15 DF 0.002 High Frequency PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers RO3006 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3006 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.

 

Data Sheet of Rogers 3006 (RO3006)

RO3006 Typical Value
Property RO3006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 6.5 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.002 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -262 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.27
0.15		 X
Y		 mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105   MΩ COND A IPC 2.5.17.1
Tensile Modulus 1498
1293		 X
Y		 MPa 23℃ ASTM D 638
Moisture Absorption 0.02   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.86   j/g/k   Calculated
Thermal Conductivity 0.79   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)		 17
17
24		 X
Y
Z		 ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.6   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 7.1   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Typical applications:

1) Automotive radar

2) Datalink on cable systems

3) Direct broadcast satellites

4) Patch antenna for wireless communications

 

PCB Specifications

PCB SIZE 70 x 75mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3006 0.635mm
copper ------- 18um(0.5 oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.4mm / 1.0mm
Number of Different Holes: n/a
Number of Drill Holes: n/a
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: RO3006 0.635mm
Final foil external: 1 oz
Final foil internal: N/A
Final height of PCB: 0.8 mm ±0.1mm
PLATING AND COATING  
Surface Finish Immersion Gold
Solder Mask Apply To: Bottom, 12micron Minimum
Solder Mask Color: Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend Bottom
Colour of Component Legend White, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA N/A
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Rogers RO3006 Microwave PCB 2-Layer Rogers 3006 25mil 0.635mm Circuit Board DK6.15 DF 0.002 High Frequency PCB 0

 

Tags: 

1oz RF PCB Board,  

1.6mm RF PCB Board,  

0.635mm RF PCB Board

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products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
Rogers RO3006 Microwave PCB 2-Layer Rogers 3006 25mil 0.635mm Circuit Board DK6.15 DF 0.002 High Frequency PCB
  • name
  • name
  • name
Rogers RO3006 Microwave PCB 2-Layer Rogers 3006 25mil 0.635mm Circuit Board DK6.15 DF 0.002 High Frequency PCB
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-046.V1.0
Base Material:
RO3006
Layer Count:
2 Layers
PCB Thickness:
0.8mm
PCB Size:
70 X 75mm=1PCS
Solder Mask:
Green
Silkscreen:
White
Copper Weight:
0.5oz
Surface Finish:
Immersion Gold
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

0.635mm RF PCB Board

,

DK6.15 RF PCB Board

,

25mil Immersion Gold PCB

Product Description

 

Rogers RO3006 Microwave PCB 2-Layer Rogers 3006 25mil 0.635mm Circuit Board DK6.15 DF 0.002 High Frequency PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers RO3006 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3006 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.

 

Data Sheet of Rogers 3006 (RO3006)

RO3006 Typical Value
Property RO3006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 6.5 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.002 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -262 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.27
0.15		 X
Y		 mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105   MΩ COND A IPC 2.5.17.1
Tensile Modulus 1498
1293		 X
Y		 MPa 23℃ ASTM D 638
Moisture Absorption 0.02   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.86   j/g/k   Calculated
Thermal Conductivity 0.79   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)		 17
17
24		 X
Y
Z		 ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.6   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 7.1   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Typical applications:

1) Automotive radar

2) Datalink on cable systems

3) Direct broadcast satellites

4) Patch antenna for wireless communications

 

PCB Specifications

PCB SIZE 70 x 75mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3006 0.635mm
copper ------- 18um(0.5 oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.4mm / 1.0mm
Number of Different Holes: n/a
Number of Drill Holes: n/a
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: RO3006 0.635mm
Final foil external: 1 oz
Final foil internal: N/A
Final height of PCB: 0.8 mm ±0.1mm
PLATING AND COATING  
Surface Finish Immersion Gold
Solder Mask Apply To: Bottom, 12micron Minimum
Solder Mask Color: Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend Bottom
Colour of Component Legend White, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA N/A
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Rogers RO3006 Microwave PCB 2-Layer Rogers 3006 25mil 0.635mm Circuit Board DK6.15 DF 0.002 High Frequency PCB 0

 

Tags: 

1oz RF PCB Board,

1.6mm RF PCB Board,

0.635mm RF PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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