PRODUCTS DETAILS

Home > Products >

6-Layer Rogers PCB Board with 1.6mm Thickness and 100% Electrical Test for High-Frequency Applications

Products

Metal Core PCB

Ms. Ivy Deng

sales10@bichengpcb.com

86-755-27374847

Contact Now

6-Layer Rogers PCB Board with 1.6mm Thickness and 100% Electrical Test for High-Frequency Applications

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Details Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-052.V1.0

Base Material:

Rogers' RO4350B

Layer Count:

6-layer

PCB Thickness:

1.6mm

PCB Size:

110mm × 80mm ±0.15mm

Copper Weight:

1oz (1.4 Mils) For Both Inner And Outer Layers

Surface Finish:

Electroless Nickel Immersion Gold (ENIG)

Highlight:

6-Layer Rogers PCB Board

1.6mm Thickness PCB Board

100% Electrical Test RF PCB

Product Description

Rogers RO4350B 6-Layer PCB: 1.6mm Thickness 100% Electrical Test

This is a 6-layer high-performance PCB constructed with Rogers RO4350B laminate, a woven glass-reinforced hydrocarbon/ceramic composite engineered for high-frequency applications. The PCB integrates advanced material properties with precision manufacturing to deliver exceptional electrical performance, structural stability, and cost-effectiveness for RF and microwave systems.

PCB Specifications

Parameter	Technical Details	Engineering Significance
Base Material	Rogers RO4350B (woven glass reinforced hydrocarbon/ceramic composite)	Combines PTFE-like electrical performance with epoxy/glass manufacturability, ideal for high-frequency applications
Layer Count	6-layer rigid configuration	Supports complex signal routing with dedicated power/ground planes for EMI control
Board Dimensions	110mm × 80mm ±0.15mm	Ensures dimensional stability for automated assembly and enclosure fitting
Minimum Trace/Space	4/4 mils	Enables high-density routing with minimal crosstalk in RF circuits
Minimum Hole Size	0.3mm	Accommodates fine-pitch components while maintaining structural integrity
Vias	455 total; blind vias (L1-L4, L5-L6); 20μm plating thickness	Reduces signal path length and minimizes reflections in high-speed designs
Finished Thickness	1.6mm	Provides optimal balance between structural rigidity and weight
Copper Weight	1oz (35μm) for inner and outer layers	Ensures low resistance while maintaining high-frequency performance
Surface Finish	Electroless Nickel Immersion Gold (ENIG)	Delivers excellent corrosion resistance, solderability, and stable RF contact resistance
Silkscreen	White on both top and bottom layers	Facilitates component identification and assembly verification
Solder Mask	Green on both top and bottom layers	Protects copper traces while providing environmental resistance
Quality Assurance	100% electrical testing (continuity, isolation, and impedance)	Verifies compliance with design specifications prior to deployment

Stack-up Configuration

The 6-layer stack-up is engineered for optimal signal integrity and controlled impedance:

Layer Sequence	Material/Component	Thickness	Function
1	Copper Layer 1	35μm	Primary signal layer for high-frequency traces
2	Rogers RO4350B Core	0.254mm (10mil)	Dielectric layer with controlled Dk for impedance management
3	Copper Layer 2	35μm	Ground plane for Layer 1 signals
4	Prepreg RO4450F (x2)	0.2mm	Bonding layer with compatible dielectric properties
5	Copper Layer 3	35μm	Power distribution layer
6	Rogers RO4350B Core	0.508mm (20mil)	Central dielectric providing isolation between planes
7	Copper Layer 4	35μm	Secondary ground plane
8	Prepreg RO4450F (x2)	0.2mm	Intermediate bonding layer
9	Copper Layer 5	35μm	Secondary signal layer
10	Rogers RO4350B Core	0.254mm (10mil)	Bottom dielectric layer
11	Copper Layer 6	35μm	Auxiliary signal routing layer

RO4350B Material Properties

Rogers RO4350B laminate exhibits key characteristics that enhance PCB performance:

Property	Value	Technical Impact
Dielectric Constant (Dk)	3.48 ±0.05 @ 10GHz/23°C	Ensures consistent signal propagation with minimal variation
Dissipation Factor (Df)	0.0037 @ 10GHz/23°C	Minimizes signal loss in high-frequency applications
Thermal Conductivity	0.69 W/m/°K	Facilitates efficient heat dissipation from active components
CTE (X/Y/Z)	10/12/32 ppm/°C	Matches copper expansion to reduce thermal stress and via fatigue
Glass Transition Temperature (Tg)	>280°C	Maintains stability during high-temperature processing and operation
Water Absorption	0.06%	Prevents performance degradation in humid environments
Flammability Rating	UL 94 V-0	Enables use in applications requiring fire safety compliance

Manufacturing and Quality

Artwork Format: Gerber RS-274-X, ensuring compatibility with standard PCB fabrication processes
Quality Standard: IPC-Class-2 compliance, guaranteeing reliable performance for general electronics applications
Processing Compatibility: Compatible with standard FR-4 manufacturing workflows, eliminating the need for specialized processing required by PTFE-based materials

Application-Specific Advantages

The PCB's design and material selection make it particularly suitable for:

Cellular Base Stations: Low dielectric loss ensures efficient signal transmission in power amplifiers and antenna systems
Automotive Radar: Dimensional stability and thermal performance withstand harsh automotive environments
RF Identification Systems: Controlled impedance characteristics support reliable wireless communication
Satellite LNBs: Tight Dk tolerance enables precise phase matching in frequency conversion circuits

Availability

This PCB is available for worldwide shipping, supporting global project requirements.

Conclusion

This 6-layer RO4350B PCB combines advanced material properties with optimized stack-up construction to deliver exceptional performance in high-frequency applications. Its balance of electrical performance, manufacturability, and cost-effectiveness makes it an ideal solution for demanding RF and microwave systems.

Tags:

Products

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Detail Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-052.V1.0

Base Material:

Rogers' RO4350B

Layer Count:

6-layer

PCB Thickness:

1.6mm

PCB Size:

110mm × 80mm ±0.15mm

Copper Weight:

1oz (1.4 Mils) For Both Inner And Outer Layers

Surface Finish:

Electroless Nickel Immersion Gold (ENIG)

Minimum Order Quantity:

1PCS

Price:

USD9.99-99.99

Packaging Details:

Vacuum bags+Cartons

Delivery Time:

8-9 working days

Payment Terms:

T/T

Supply Ability:

5000PCS per month

Highlight

6-Layer Rogers PCB Board

1.6mm Thickness PCB Board

100% Electrical Test RF PCB

Product Description

Rogers RO4350B 6-Layer PCB: 1.6mm Thickness 100% Electrical Test

PCB Specifications

Parameter	Technical Details	Engineering Significance
Base Material	Rogers RO4350B (woven glass reinforced hydrocarbon/ceramic composite)	Combines PTFE-like electrical performance with epoxy/glass manufacturability, ideal for high-frequency applications
Layer Count	6-layer rigid configuration	Supports complex signal routing with dedicated power/ground planes for EMI control
Board Dimensions	110mm × 80mm ±0.15mm	Ensures dimensional stability for automated assembly and enclosure fitting
Minimum Trace/Space	4/4 mils	Enables high-density routing with minimal crosstalk in RF circuits
Minimum Hole Size	0.3mm	Accommodates fine-pitch components while maintaining structural integrity
Vias	455 total; blind vias (L1-L4, L5-L6); 20μm plating thickness	Reduces signal path length and minimizes reflections in high-speed designs
Finished Thickness	1.6mm	Provides optimal balance between structural rigidity and weight
Copper Weight	1oz (35μm) for inner and outer layers	Ensures low resistance while maintaining high-frequency performance
Surface Finish	Electroless Nickel Immersion Gold (ENIG)	Delivers excellent corrosion resistance, solderability, and stable RF contact resistance
Silkscreen	White on both top and bottom layers	Facilitates component identification and assembly verification
Solder Mask	Green on both top and bottom layers	Protects copper traces while providing environmental resistance
Quality Assurance	100% electrical testing (continuity, isolation, and impedance)	Verifies compliance with design specifications prior to deployment

Stack-up Configuration

The 6-layer stack-up is engineered for optimal signal integrity and controlled impedance:

Layer Sequence	Material/Component	Thickness	Function
1	Copper Layer 1	35μm	Primary signal layer for high-frequency traces
2	Rogers RO4350B Core	0.254mm (10mil)	Dielectric layer with controlled Dk for impedance management
3	Copper Layer 2	35μm	Ground plane for Layer 1 signals
4	Prepreg RO4450F (x2)	0.2mm	Bonding layer with compatible dielectric properties
5	Copper Layer 3	35μm	Power distribution layer
6	Rogers RO4350B Core	0.508mm (20mil)	Central dielectric providing isolation between planes
7	Copper Layer 4	35μm	Secondary ground plane
8	Prepreg RO4450F (x2)	0.2mm	Intermediate bonding layer
9	Copper Layer 5	35μm	Secondary signal layer
10	Rogers RO4350B Core	0.254mm (10mil)	Bottom dielectric layer
11	Copper Layer 6	35μm	Auxiliary signal routing layer

RO4350B Material Properties

Rogers RO4350B laminate exhibits key characteristics that enhance PCB performance:

Property	Value	Technical Impact
Dielectric Constant (Dk)	3.48 ±0.05 @ 10GHz/23°C	Ensures consistent signal propagation with minimal variation
Dissipation Factor (Df)	0.0037 @ 10GHz/23°C	Minimizes signal loss in high-frequency applications
Thermal Conductivity	0.69 W/m/°K	Facilitates efficient heat dissipation from active components
CTE (X/Y/Z)	10/12/32 ppm/°C	Matches copper expansion to reduce thermal stress and via fatigue
Glass Transition Temperature (Tg)	>280°C	Maintains stability during high-temperature processing and operation
Water Absorption	0.06%	Prevents performance degradation in humid environments
Flammability Rating	UL 94 V-0	Enables use in applications requiring fire safety compliance

Manufacturing and Quality

Artwork Format: Gerber RS-274-X, ensuring compatibility with standard PCB fabrication processes
Quality Standard: IPC-Class-2 compliance, guaranteeing reliable performance for general electronics applications
Processing Compatibility: Compatible with standard FR-4 manufacturing workflows, eliminating the need for specialized processing required by PTFE-based materials

Application-Specific Advantages

The PCB's design and material selection make it particularly suitable for:

Cellular Base Stations: Low dielectric loss ensures efficient signal transmission in power amplifiers and antenna systems
Automotive Radar: Dimensional stability and thermal performance withstand harsh automotive environments
RF Identification Systems: Controlled impedance characteristics support reliable wireless communication
Satellite LNBs: Tight Dk tolerance enables precise phase matching in frequency conversion circuits

Availability

This PCB is available for worldwide shipping, supporting global project requirements.

Conclusion

Tags:

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

6-Layer Rogers PCB Board with 1.6mm Thickness and 100% Electrical Test for High-Frequency Applications

6-Layer Rogers PCB Board

1.6mm Thickness PCB Board

100% Electrical Test RF PCB

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

6-Layer Rogers PCB Board

1.6mm Thickness PCB Board

100% Electrical Test RF PCB

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,