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| PCB Material: | RT/duroid 6035HTC - 0.508 Mm (20mil) | Layer Count: | 2-layer |
|---|---|---|---|
| PCB Thickness: | 0.6mm | Solder Mask: | No |
| Silkscreen: | No | Surface Finish: | Immersion Gold |
| Highlight: | 20mil Immersion Gold Boards,RT duroid 6035HTC PCB,0.6mm Immersion Gold Boards |
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We are proud to introduce our advanced PCB solutions featuring Rogers RT/duroid 6035HTC, a cutting-edge high-frequency circuit material designed for high-power RF and microwave applications. This PCB delivers exceptional thermal performance, reliability, and signal integrity, which are the ultimate choice for demanding applications such as power amplifiers, filters, combiners, and more. Let us help you push the boundaries of innovation with PCBs that perform under pressure.
What Makes RT/duroid 6035HTC a Game-Changer?
Unrivaled Thermal Conductivity: At 1.44 W/m/K at 80°C, RT/duroid 6035HTC dissipates heat 2.4x faster than standard RT/duroid 6000 products. This means cooler operation, longer device life, and fewer failures in high-power applications.
Ultra-Low Signal Loss: With a dielectric constant (Dk) of 3.5 +/- 0.05 at 10 GHz/23°C and a dissipation factor of 0.0013 at 10 GHz/23°C, it ensures minimal signal loss and superior high-frequency performance.
Thermal Stability You Can Trust: A thermal coefficient of dielectric constant of -66 ppm/°C and low moisture absorption (0.06%) ensure consistent performance, even in extreme environments.
Cost-Effective Manufacturing: Unlike traditional alumina-filled laminates, RT/duroid 6035HTC’s advanced filler system improves drillability, reducing production costs without compromising quality.
| RT/duroid 6035HTC Typical Value | |||||
| Property | RT/duorid 6035HTC | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.50±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.6 | Z | 8 GHz - 40 GHz | Differential Phase Length Method | |
| Dissipation Factor | 0.0013 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -66 | Z | ppm/℃ | -50 ℃to 150℃ | mod IPC-TM-650, 2.5.5.5 |
| Volume Resistivity | 108 | MΩ.cm | A | IPC-TM-650, 2.5.17.1 | |
| Surface Resistivity | 108 | MΩ | A | IPC-TM-650, 2.5.17.1 | |
| Dimensional Stability | -0.11 -0.08 | CMD MD | mm/m (mils/inch) | 0.030" 1oz EDC foil Thickness after etch '+E4/105 | IPC-TM-650 2.4.39A |
| Tensile Modulus | 329 244 | MD CMD | kpsi | 40 hrs @23℃/50RH | ASTM D638 |
| Moisure Absorption | 0.06 | % | D24/23 | IPC-TM-650 2.6.2.1 ASTM D570 | |
| Coefficient of Thermal Expansion (-50 ℃to 288 ℃) | 19 19 39 | X Y Z | ppm/℃ | 23℃ / 50% RH | IPC-TM-650 2.4.41 |
| Thermal Conductivity | 1.44 | W/m/k | 80℃ | ASTM C518 | |
| Density | 2.2 | gm/cm3 | 23℃ | ASTM D792 | |
| Copper Peel Stength | 7.9 | pli | 20 sec. @288 ℃ | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-Free Process Compatible | Yes | ||||
Why Choose Our RT/duroid 6035HTC PCBs?
Compact and Robust Construction:
Board Dimensions: 67.02 mm x 45.7 mm (1PCS), with a tight tolerance of +/- 0.15 mm.
Layer Stackup:
Copper Layer 1: 35 μm
RT/duroid 6035HTC Core: 0.508 mm (20 mil)
Copper Layer 2: 35 μm
High-Precision Manufacturing:
Minimum Trace/Space: 5/6 mils for intricate designs.
Minimum Hole Size: 0.3 mm for reliable connections.
Finished Board Thickness: 0.6 mm – robust yet lightweight.
Premium Surface Finish: Immersion Gold for superior solderability and corrosion resistance.
Rigorous Quality Assurance: 100% electrical testing and compliance with IPC-Class-2 standards.
The Benefits You Can’t Ignore
Efficient Heat Dissipation: Keeps your high-power designs running cooler and longer.
Exceptional Signal Integrity: Minimizes insertion loss for superior high-frequency performance.
Reliability in Extreme Conditions: Stable performance across a wide range of temperatures and environments.
Cost Savings: Reduced drilling costs and compatibility with standard manufacturing processes.
Applications That Demand the Best
Our RT/duroid 6035HTC PCBs are trusted in some of the most demanding industries and applications, including:
High-Power RF and Microwave Amplifiers
Power Amplifiers, Couplers, and Filters
Combiners and Power Dividers
Automotive Radar and Communication Systems
Satellite and Aerospace Technology
Avalibility
No matter where you are, we’ve got you covered. With IPC-Class-2 quality standards, you can trust us to deliver PCBs that meet your exact requirements.
If you’re ready to take your high-power RF designs to life. Contact us today to request a quote, discuss your project, or learn more about how we can help you achieve your goals.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
