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Material: | Rogers RO4535 Core - 0.508 Mm (20mil) | Layer Count: | 2-layer |
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PCB Size: | 53 Mm X 53 Mm=1PCS, +/- 0.15mm | PCB Thickness: | 0.6 Mm |
Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | Immersion Gold |
Highlight: | Antenna Markets Rogers RO4535 PCBs,High-Frequency Rogers RO4535 PCBs,20mil Rogers RO4535 PCBs |
As the demand for high-frequency applications continues to grow, the need for advanced printed circuit board (PCB) technologies has never been more crucial. The RO4535 High-Frequency PCB, an innovative solution from Rogers Corporation designed to meet the specific requirements of the antenna market. This article delves into the features, benefits, construction details, and applications of the RO4535 PCB, providing insights for engineers and designers looking to enhance their projects.
Introduction to RO4535
The RO4535 High-Frequency Laminates are engineered to extend the capabilities of the successful RO4000? product series into antenna applications. This ceramic-filled, glass-reinforced hydrocarbon-based material offers a controlled dielectric constant, low loss performance, and excellent passive intermodulation (PIM) response, making it particularly well-suited for mobile infrastructure microstrip antennas.
One of the standout features of the RO4535 is its compatibility with conventional FR-4 and high-temperature lead-free solder processing. Unlike traditional PTFE-based laminates, RO4535 does not require special treatment for plated through-hole preparation, making it easier to integrate into existing manufacturing processes. This affordability and ease of use allow designers to optimize both price and performance in their antenna designs.
Property | RO4535 | Direction | Units | Condition | Test Method |
Dielectric Constant, er Process | 3.44 ± 0.08 | Z | - | 10 GHz/23℃ 2.5 GHz | IPC-TM-650,2.5.5.5 |
Dissipation Factor | 0.0032 | Z | - | 2.5 GHz/23℃ | IPC-TM-650, 2.5.5.5 |
0.0037 | 10 GHz/23℃ | ||||
PIM (Typical) | -157 | - | dBc | Reflected 43 dBm swept tones | Summitek 1900b PIM Analyzer |
Dielectric Strength | >500 | Z | V/mil | 0.51 mm | IPC-TM-650, 2.5.6.2 |
Dimensional Stability | <0.5 | X,Y | mm/m (mils/inch) | after etch | IPC-TM-650, 2.4.39A |
Coefficient of Thermal Expansion | 16 | X | ppm/℃ | -55 to 288℃ | IPC-TM-650, 2.4.41 |
17 | Y | ||||
50 | Z | ||||
Thermal Conductivity | 0.6 | - | W/(m.K) | 80℃ | ASTM C518 |
Moisture Absorption | 0.09 | - | % | D48/50 | IPC-TM-650, 2.6.2.1 ASTM D570 |
Tg | >280 | - | ℃ TMA | A | IPC-TM-650, 2.4.24.3 |
Density | 1.9 | - | gm/cm3 | - | ASTM D792 |
Copper Peel Strength | 5.1 (0.9) | - | lbs/in (N/mm) | 1 oz. EDC post solder float | IPC-TM-650, 2.4.8 |
Flammability | V-0 | - | - | - | UL 94 |
Lead-Free Process Compatible | Yes | - | - | - | - |
Key Features and Technical Specifications
This PCB is packed with features that enhance its performance in high-frequency applications:
- Dielectric Constant: 3.44 ± 0.08 at 10 GHz/23°C, ensuring predictable signal behavior.
- Dissipation Factor: 0.0037 at 10 GHz/23°C, contributing to minimal signal loss.
- Thermal Conductivity: 0.6 W/m/°K, facilitating effective heat management.
- Coefficient of Thermal Expansion (CTE): X-axis CTE of 16 ppm/°C, Y-axis CTE of 17 ppm/°C, Z-axis CTE of 50 ppm/°C. This closely matches the thermal expansion of copper, reducing stress and improving reliability.
- High Glass Transition Temperature (Tg): Greater than 280 °C, allowing it to withstand high-temperature processing and operating conditions.
- Low Water Absorption: Just 0.09%, enhancing durability and reliability in various environmental conditions.
- UL-94 V-0 Compliance: Available with Rogers’ RoHS-compliant flame-retardant technology, ensuring safety and reliability.
These features make the RO4535 PCB a compelling choice for engineers looking to push the boundaries of antenna technology.
Construction Details
This PCB is designed with precision and manufacturability in mind. Key construction details include:
- Stackup: A 2-layer rigid PCB with:
- Copper Layer 1: 35 μm
- Rogers RO4535 Core: 0.508 mm (20 mil)
- Copper Layer 2: 35 μm
- Board Dimensions: 53 mm x 53 mm, with a tolerance of ± 0.15 mm.
- Minimum Trace/Space: 4/4 mils, allowing for intricate designs.
- Minimum Hole Size: 0.3 mm, with no blind vias.
- Finished Board Thickness: 0.6 mm, providing a sturdy platform for components.
- Finished Copper Weight: 1 oz (1.4 mils) on outer layers, ensuring good conductivity.
- Via Plating Thickness: 20 μm, enhancing connectivity.
- Surface Finish: Immersion Gold for optimal solderability.
- Silkscreen: White on the top; no silkscreen on the bottom.
- Solder Mask: Green on both the top and bottom.
PCB Material: | Ceramic-filled, Glass-reinforced Hydrocarbon |
Designation: | RO4535 |
Dielectric constant: | 3.44 |
Dissipation Factor | 0.0037 10GHz |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Laminate thickness: | 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm ) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
Quality Assurance
Quality is paramount in PCB manufacturing, and the RO4535 is no exception. Each board undergoes rigorous 100% electrical testing prior to shipment, ensuring compliance with IPC-Class-2 quality standards. The Gerber RS-274-X artwork is supplied from our customers,ensuring each PCB are unique for requirement.
Applications of RO4535 PCB
The RO4535 PCB is specifically designed for a range of high-frequency applications, including:
- Cellular Infrastructure Base Station Antennas: As mobile networks evolve, the need for reliable, high-performance antennas is critical.
- WiMAX Antenna Networks: Supporting high-speed wireless communication, the RO4535 is ideal for applications requiring robust signal integrity.
These applications highlight the versatility and effectiveness of the RO4535 PCB in meeting the demands of modern wireless technology.
Conclusion
The RO4535 High-Frequency PCB represents a significant advancement in antenna technology, combining cost-effectiveness with superior performance. Its unique features, ease of use, and reliability make it an excellent choice for engineers and designers looking to optimize their antenna designs without compromising quality.
As the industry continues to embrace high-frequency applications, the RO4535 PCB stands ready to meet the challenges of tomorrow. For more information or to place an order, contact our sales team today and discover how the RO4535 can enhance your next project.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848