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Material: | Rogers RO3006 | Layer Count: | 2-layer |
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PCB Size: | 51.51mm X 25.5 Mm=1PCS | PCB Thickness: | 0.25 Mm |
Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | Immersion Silver |
Highlight: | 5mil Rogers RO3006 PCB,Double Layer Rogers RO3006 PCB,Immersion Silver Rogers RO3006 PCB |
Rogers RO3006 is a remarkable laminate that sets a new standard in performance for commercial microwave and RF applications. Crafted from ceramic-filled PTFE (Polytetrafluoroethylene) composites, this PCB offers unparalleled stability and reliability, making it an essential choice for engineers and designers.
Key Features of Rogers RO3006 material
The Rogers RO3006 is designed with cutting-edge features that enhance its performance in high-frequency applications. With a dielectric constant (Dk) of 6.15 ± 0.15 at 10 GHz/23°C, this material ensures minimal signal loss, allowing for efficient transmission of high-frequency signals. Furthermore, it boasts a remarkably low dissipation factor of 0.002, which is crucial for maintaining signal integrity in RF applications.
Thermal stability is another standout characteristic of the Rogers RO3006 substrates. With a thermal decomposition temperature (Td) that exceeds 500°C, this laminate can withstand the rigors of high-temperature environments without compromising performance. Additionally, its thermal conductivity of 0.79 W/mK enables efficient heat dissipation, further enhancing the reliability of the circuit.
Property | RO3006 | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 6.15±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
Dielectric Constant,εDesign | 6.5 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor,tanδ | 0.002 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | -262 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
Dimensional Stability | 0.27 0.15 |
X Y |
mm/m | COND A | IPC-TM-650 2.2.4 |
Volume Resistivity | 105 | MΩ.cm | COND A | IPC 2.5.17.1 | |
Surface Resistivity | 105 | MΩ | COND A | IPC 2.5.17.1 | |
Tensile Modulus | 1498 1293 |
X Y |
MPa | 23℃ | ASTM D 638 |
Moisture Absorption | 0.02 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
Specific Heat | 0.86 | j/g/k | Calculated | ||
Thermal Conductivity | 0.79 | W/M/K | 50℃ | ASTM D 5470 | |
Coefficient of Thermal Expansion (-55 to 288℃) |
17 17 24 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
Td | 500 | ℃ TGA | ASTM D 3850 | ||
Density | 2.6 | gm/cm3 | 23℃ | ASTM D 792 | |
Copper Peel Stength | 7.1 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
Flammability | V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |
Benefits of Using Rogers RO3006 PCB
One of the most significant advantages of the Rogers RO3006 is its uniform mechanical properties, which make it ideal for multi-layer board designs. The consistent dielectric constant allows for greater flexibility in design, accommodating a wide range of applications. This feature is particularly beneficial for engineers working on complex projects that require precision and adaptability.
Moreover, the low in-plane expansion coefficient of Rogers RO3006 closely matches that of copper, which is crucial for ensuring the reliability of surface-mounted assemblies. This characteristic is particularly important in applications that are sensitive to temperature variations, as it guarantees excellent dimensional stability during operation. Engineers can trust that their designs will maintain integrity even under fluctuating conditions.
PCB Specifications
The stack-up of this PCB is engineered as a 2-layer rigid construction, structured for optimal performance. The board dimensions measure 51.51 mm x 25.5 mm and include a minimum trace/space of 4/6 mils. With a finished board thickness of 0.25 mm, the specifications ensure that this PCB meets the rigorous standards required in modern electronics. Additionally, the finished copper weight is set at 1 oz (1.4 mils) on the outer layers, providing a solid foundation for effective electrical performance.
Typical Applications of Rogers RO3006 PCB
The versatility of the Rogers RO3006 PCB allows it to be employed in a broad spectrum of applications. Some typical uses include:
- Automotive Radar Systems: Enhancing safety and navigation capabilities.
- Global Positioning Satellite Antennas: Providing reliable connectivity for GPS technologies.
- Cellular Telecommunications: Supporting power amplifiers and antennas for robust communication networks.
- Patch Antennas for Wireless Communications: Ensuring efficient signal transmission in various devices.
- Direct Broadcast Satellites: Facilitating high-quality satellite communication.
- Datalink Cable Systems: Enabling efficient data transfer across industries.
- Remote Meter Reading Devices: Streamlining data collection in utility management.
- Power Backplanes: Supporting power distribution in complex electronic systems.
By integrating the Rogers RO3006 into these applications, companies can revolutionize their RF designs and achieve enhanced performance levels.
PCB Material: | Ceramic-filled PTFE Composites |
Designation: | RO3006 |
Dielectric constant: | 6.15 |
Dissipation Factor | 0.002 10GHz |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Laminate thickness: | 5mil(0.127mm), 10mil(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm ) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
Manufacturing Process and Cost Efficiency
Another critical aspect of the Rogers RO3006 PCB is its cost-effective manufacturing process. Designed for volume production, this laminate offers economical pricing without sacrificing quality. This makes it an attractive option for businesses looking to scale their operations while ensuring high performance in their products.
Conclusion: The Future of High-Frequency PCBs
As the demand for reliable and efficient RF and microwave solutions continues to grow, the Rogers RO3006 PCB stands as a beacon of innovation and excellence. With its exceptional material properties, thermal stability, and cost-effectiveness, it is poised to redefine the landscape of high-frequency PCB design.
For engineers and designers aiming to optimize their projects, the Rogers RO3006 offers an opportunity to elevate their RF applications to new heights.If you have any question or any inquiry about this PCB, you can chat us online or email our sales team at sales10@bichengpcb.com.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848