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5mil Rogers RO3006 PCB Double Layer Immersion Silver

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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5mil Rogers RO3006 PCB Double Layer Immersion Silver

5mil Rogers RO3006 PCB Double Layer Immersion Silver
5mil Rogers RO3006 PCB Double Layer Immersion Silver

Large Image :  5mil Rogers RO3006 PCB Double Layer Immersion Silver

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: Rogers RO3006 Layer Count: 2-layer
PCB Size: 51.51mm X 25.5 Mm=1PCS PCB Thickness: 0.25 Mm
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: Immersion Silver
Highlight:

5mil Rogers RO3006 PCB

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Double Layer Rogers RO3006 PCB

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Immersion Silver Rogers RO3006 PCB

Rogers RO3006 is a remarkable laminate that sets a new standard in performance for commercial microwave and RF applications. Crafted from ceramic-filled PTFE (Polytetrafluoroethylene) composites, this PCB offers unparalleled stability and reliability, making it an essential choice for engineers and designers.

 

Key Features of Rogers RO3006 material

The Rogers RO3006 is designed with cutting-edge features that enhance its performance in high-frequency applications. With a dielectric constant (Dk) of 6.15 ± 0.15 at 10 GHz/23°C, this material ensures minimal signal loss, allowing for efficient transmission of high-frequency signals. Furthermore, it boasts a remarkably low dissipation factor of 0.002, which is crucial for maintaining signal integrity in RF applications.

 

Thermal stability is another standout characteristic of the Rogers RO3006 substrates. With a thermal decomposition temperature (Td) that exceeds 500°C, this laminate can withstand the rigors of high-temperature environments without compromising performance. Additionally, its thermal conductivity of 0.79 W/mK enables efficient heat dissipation, further enhancing the reliability of the circuit.

 

Property RO3006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 6.5 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.002 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -262 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.27
0.15
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105   COND A IPC 2.5.17.1
Tensile Modulus 1498
1293
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.02   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.86   j/g/k   Calculated
Thermal Conductivity 0.79   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
17
24
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.6   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 7.1   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Benefits of Using Rogers RO3006 PCB

One of the most significant advantages of the Rogers RO3006 is its uniform mechanical properties, which make it ideal for multi-layer board designs. The consistent dielectric constant allows for greater flexibility in design, accommodating a wide range of applications. This feature is particularly beneficial for engineers working on complex projects that require precision and adaptability.

 

Moreover, the low in-plane expansion coefficient of Rogers RO3006 closely matches that of copper, which is crucial for ensuring the reliability of surface-mounted assemblies. This characteristic is particularly important in applications that are sensitive to temperature variations, as it guarantees excellent dimensional stability during operation. Engineers can trust that their designs will maintain integrity even under fluctuating conditions.

 

5mil Rogers RO3006 PCB Double Layer Immersion Silver 0

 

PCB Specifications

The stack-up of this PCB is engineered as a 2-layer rigid construction, structured for optimal performance. The board dimensions measure 51.51 mm x 25.5 mm and include a minimum trace/space of 4/6 mils. With a finished board thickness of 0.25 mm, the specifications ensure that this PCB meets the rigorous standards required in modern electronics. Additionally, the finished copper weight is set at 1 oz (1.4 mils) on the outer layers, providing a solid foundation for effective electrical performance.

 

Typical Applications of Rogers RO3006 PCB

The versatility of the Rogers RO3006 PCB allows it to be employed in a broad spectrum of applications. Some typical uses include:

 

- Automotive Radar Systems: Enhancing safety and navigation capabilities.
 

- Global Positioning Satellite Antennas: Providing reliable connectivity for GPS technologies.
 

- Cellular Telecommunications: Supporting power amplifiers and antennas for robust communication networks.
 

- Patch Antennas for Wireless Communications: Ensuring efficient signal transmission in various devices.
 

- Direct Broadcast Satellites: Facilitating high-quality satellite communication.
 

- Datalink Cable Systems: Enabling efficient data transfer across industries.
 

- Remote Meter Reading Devices: Streamlining data collection in utility management.
 

- Power Backplanes: Supporting power distribution in complex electronic systems.

 

By integrating the Rogers RO3006 into these applications, companies can revolutionize their RF designs and achieve enhanced performance levels.

 

PCB Material: Ceramic-filled PTFE Composites
Designation: RO3006
Dielectric constant: 6.15
Dissipation Factor 0.002 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Laminate thickness: 5mil(0.127mm), 10mil(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

Manufacturing Process and Cost Efficiency

Another critical aspect of the Rogers RO3006 PCB is its cost-effective manufacturing process. Designed for volume production, this laminate offers economical pricing without sacrificing quality. This makes it an attractive option for businesses looking to scale their operations while ensuring high performance in their products.

 

Conclusion: The Future of High-Frequency PCBs

As the demand for reliable and efficient RF and microwave solutions continues to grow, the Rogers RO3006 PCB stands as a beacon of innovation and excellence. With its exceptional material properties, thermal stability, and cost-effectiveness, it is poised to redefine the landscape of high-frequency PCB design.

 

For engineers and designers aiming to optimize their projects, the Rogers RO3006 offers an opportunity to elevate their RF applications to new heights.If you have any question or any inquiry about this PCB, you can chat us online or email our sales team at sales10@bichengpcb.com.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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