As the demand for high-performance electronic devices continues to rise, the need for advanced printed circuit board (PCB) materials has become paramount. The newly shipped Rogers RO4360G2 PCB stands out as a revolutionary solution in high-frequency circuit environments.
Introduction to Rogers RO4360G2
The Rogers RO4360G2 is a low-loss, glass-reinforced, hydrocarbon ceramic-filled thermoset laminate. This innovative material is engineered to provide an unparalleled balance between performance and processing capability. Notably, it is the first high dielectric constant (Dk) thermoset laminate that can be processed similarly to traditional FR-4 materials. This advantage allows manufacturers to leverage existing fabrication techniques while benefiting from enhanced performance characteristics.
Engineered for lead-free processes, the RO4360G2 offers improved rigidity, which is essential for the stability and reliability of multi-layer constructions. This laminate not only reduces material and fabrication costs but also integrates seamlessly with Rogers' RO440 series prepreg and lower-Dk RO4000 laminates, making it a versatile option for complex multi-layer designs.
Key Features of the RO4360G2 PCB
1. Dielectric Constant and Dissipation Factor
The RO4360G2 exhibits a dielectric constant of 6.15 ± 0.15 at 10 GHz and a dissipation factor of 0.0038 at the same frequency. These properties are critical for maintaining signal integrity in high-frequency applications, allowing for efficient signal transmission with minimal energy loss.
2. Thermal Stability
With a decomposition temperature (Td) exceeding 407°C and a high glass transition temperature (Tg) greater than 280°C, the RO4360G2 is well-suited for applications that involve high thermal demands. This thermal stability ensures reliable performance in challenging environments where other materials might fail.
3. Thermal Conductivity and Coefficient of Thermal Expansion
The laminate boasts a thermal conductivity of 0.75 W/mK, ensuring effective heat management in high-power applications. Furthermore, the low Z-axis coefficient of thermal expansion at 28 ppm/°C, along with copper-matched coefficients in the X and Y axes (13 ppm/°C and 14 ppm/°C, respectively), facilitates reliable performance in multi-layer board constructions.
4. Environmental Compliance
The RO4360G2 is designed to be environmentally friendly, being fully compatible with lead-free processes. It meets the 94V-0 flammability rating according to UL 94 standards, ensuring safety in various applications.
| Property |
RO4360G2 |
Direction |
Units |
Condition |
Test Method |
| Dielectric Constant,εProcess |
6.15±0.15 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
| 2.5 GHz/23℃ |
| Dissipation Factor,tanδ |
0.0038 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
| Thermal Conductivity |
0.75 |
|
W/mK |
50℃ |
ASTM D-5470 |
| Volume Resistivity |
4.0 X 1013 |
|
Ω.cm |
Elevated T |
IPC-TM-650 2.5.17.1 |
| Surface Resistivity |
9.0 X 1012 |
|
Ω |
Elevated T |
IPC-TM-650 2.5.17.1 |
| Electrical Strength |
784 |
Z |
V/mil |
|
IPC-TM-650 2.5.6.2 |
| Tensile Strength |
131 (19) 97(14) |
X Y |
MPa (kpsi) |
40 hrs 50%RH/23 |
ASTM D638 |
| Flexural Strength |
213(31) 145(21) |
X Y |
Mpa (kpsi) |
40 hrs 50%RH/23 |
IPC-TM-650, 2.4.4 |
| Coefficient of Thermal Expansion |
13 14 28 |
X Y Z |
ppm/℃ |
-50 ℃to 288℃ After Replicated Heat Cycle |
IPC-TM-650, 2.1.41 |
| Tg |
>280 |
|
℃ TMA |
|
IPC-TM-650 2.4.24.3 |
| Td |
407 |
|
℃ |
|
ASTM D3850 using TGA |
| T288 |
>30 |
Z |
min |
30 min / 125℃ Prebake |
IPC-TM-650 2.2.24.1 |
| Moisure Absorption |
0.08 |
|
% |
50℃/48hr |
IPC-TM-650 2.6.2.1 ASTM D570 |
| Thermal Coefficient of er |
-131 @10 GHz |
Z |
ppm/℃ |
-50℃ to 150 ℃ |
IPC-TM-650, 2.5.5.5 |
| Density |
2.16 |
|
gm/cm3 |
RT |
ASTM D792 |
| Copper Peel Stength |
5.2 (0.91) |
|
pli (N/mm) |
Condtion B |
IPC-TM-650 2.4.8 |
| Flammability |
V-0 |
|
|
|
UL 94 File QMTS2. E102765 |
Benefits of Using Rogers RO4360G2
Design Flexibility
The Rogers RO4360G2 PCB allows for a broad range of design possibilities. Its compatibility with existing FR-4 processing techniques enables engineers to innovate without being constrained by material limitations.
Automated Assembly Compatibility
This laminate is engineered to work seamlessly with automated assembly processes, which is crucial for high-volume manufacturing. The reliability of plated through-holes enhances the integrity of connections throughout the PCB.
Cost-Effective Solution
With efficient supply chain management and short lead times, the RO4360G2 presents a cost-effective option for manufacturers. The combination of reduced material costs and the ability to use existing fabrication methods contributes to overall savings.
Environmentally Responsible
As industries increasingly prioritize sustainability, the lead-free compatibility of the RO4360G2 aligns with modern environmental standards, making it a responsible choice for manufacturers.
| PCB Material: |
Hydrocarbon Ceramic-filled Thermoset Materials |
| Designation: |
RO4360G2 |
| Dielectric constant: |
6.15 ±0.15 |
| Layer count: |
Double Layer, Multilayer, Hybrid PCB |
| Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: |
8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm) |
| PCB size: |
≤400mm X 500mm |
| Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
| Surface finish: |
Bare copper, HASL, ENIG, OSP etc.. |
Technical Specifications
The Rogers RO4360G2 PCB features a 2-layer rigid stackup, which includes:
- Copper Layer 1: 35 μm
- RO4360G2 Substrate: 24 mil (0.61 mm)
- Copper Layer 2: 35 μm
Construction Details:
- Board Dimensions: 76.48 mm x 43.52 mm (± 0.15 mm)
- Minimum Trace/Space: 5/5 mils
- Minimum Hole Size: 0.30 mm
- Finished Board Thickness: 0.73 mm
- Finished Copper Weight: 1 oz (1.4 mils) on outer layers
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion tin
- Top Silkscreen: White
- Top Solder Mask: Green
Typical Applications
The Rogers RO4360G2 PCB is ideally suited for a wide range of applications, particularly in the telecommunications and automotive sectors. Some typical applications include:
- Base Station Power Amplifiers: Its low loss and high thermal stability make it an excellent choice for powering base stations, ensuring reliable communication signals.
- Small Cell Transceivers: The laminate supports the compact designs required for small cell technology, facilitating efficient wireless communication in urban environments.
Conclusion
The Rogers RO4360G2 PCB is a groundbreaking solution for high-frequency circuit design, combining advanced material properties with cost-effective processing capabilities. Its unique characteristics make it ideal for a variety of applications, particularly in telecommunications and automotive technologies. For more information or to place an order, please contact our sales team.
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