Payment & Shipping Terms:
Power Amplifiers PCB Board,
RF-35 PCB Material,
PCB Material 60mil
Today, we're delving into the world of Taconic's ORCER family and exploring an exceptional organic-ceramic laminate known as RF-35.
RF-35 laminates belong to the PTFE-based family and are reinforced with woven glass. This remarkable creation is the culmination of Taconic's expertise in coated PTFE fiberglass and ceramic fill technologies. RF-35 boasts a dielectric constant of 3.50 at 1.9 GHz, accompanied by a dissipation factor of 0.0018 at the same frequency.
With a moisture absorption rate of a mere 0.02% at a thickness of .060 inch, RF-35 showcases its impressive resistance to moisture. Additionally, it exhibits a peel strength exceeding 8.0 lbs./linear inch for 1/2 oz. copper and surpassing 10.0 lbs./linear inch for 1 oz. copper, as per the stringent IPC-TM 650 2.4.8 standard.
Moreover, this material demonstrates a dielectric breakdown of 41 kV, a volume resistivity measuring 1.26 x 10^9 Mohm/cm, and a surface resistivity measuring 1.46 x 10^8 Mohm, as determined by the exacting IPC-TM 650 2.5.6 and IPC-TM 650 188.8.131.52 measurements, respectively.
RF-35 boasts an impressive arc resistance, exceeding 180 seconds based on the IPC TM 650 2.5.1 standard. Its flexural strength lengthwise is greater than 22,000 psi, while crosswise it surpasses 18,000 psi, as per ASTM D 790 testing. Tensile strength measurements reveal 27,000 psi (or 187 N/mm^2) lengthwise and 21,000 psi (or 145 N/mm^2) crosswise, according to ASTM D 638 standards.
RF-35 exhibits exceptional dimensional stability, with a lengthwise dimensional stability of 0.00004 in/in and a crosswise dimensional stability of -0.00010 in/in, as measured by IPC-TM 650 2.4.39.
|Dielectric Constant @ 1.9 GHz||IPC-TM 650 2.5.5||3.5||3.5|
|Dissipation Factor @ 1.9 GHz||IPC-TM 650 2.5.5||0.0018||0.0018|
|Moisture Absorption (.060")||IPC-TM 650 184.108.40.206||%||0.02||%||0.02|
|Peel Strength (1/2 oz. copper)||IPC-TM 650 2.4.8||lbs./linear inch||>8.0||N/mm||>1.5|
|Peel Strength (1 oz. copper)||IPC-TM 650 2.4.8||lbs./linear inch||>10.0||N/mm||>1.8|
|Dielectric Breakdown||IPC-TM 650 2.5.6||kV||41||kV||41|
|Volume Resistivity||IPC-TM 650 220.127.116.11||Mohm/cm||1.26 x 109||Mohm/cm||1.26 x 109|
|Surface Resistivity||IPC-TM 650 18.104.22.168||Mohm||1.46 x 108||Mohm||1.46 x 108|
|Arc Resistance||IPC TM 650 2.5.1||seconds||>180||seconds||>180|
|Flexural Strength Lengthwise||ASTM D 790||psi||>22,000||N/mm2||>152|
|Flexural Strength Crosswise||ASTM D 790||psi||>18,000||N/mm2||>124|
|Tensile Strength Lengthwise||ASTM D 638||psi||27,000||N/mm2||187|
|Tensile Strength Crosswise||ASTM D 638||psi||21,000||N/mm2||145|
|Dimensional Stability Lengthwise||IPC-TM 650 2.4.39||in/in||0.00004||mm/mm||0.00004|
|Dimensional Stability Crosswise||IPC-TM 650 2.4.39||in/in||-0.0001||mm/mm||-0.0001|
|Thermal Conductivity||ASTM F 433||W/m/K||0.24||W/m/K||0.24|
|X-Y CTE||ASTM D 3386 (TMA)||ppm/°C||19-24||ppm/°C||19-24|
|Z CTE||ASTM D 3386 (TMA)||ppm/°C||64||ppm/°C||64|
|Hardness||Rockwell M Scale||34||34|
High Tg materials are a specialty of RF-35, with a remarkable value exceeding 315°C.
When it comes to thermal conductivity, RF-35 showcases a figure of 0.24 W/m/K, as determined by ASTM F 433. Its X-Y CTE ranges from 19-24 ppm/°C, while its Z CTE measures 64 ppm/°C, based on ASTM D 3386 (TMA) standards. Additionally, RF-35 holds a V-0 rating for flammability, confirmed by UL-94, and registers a hardness of 34% on the Rockwell M scale.
We offer various options for PCBs, including single layer, double layer, multi-layer, and hybrid configurations. Standard dielectric thicknesses of 10 mils, 20 mils, 30 mils, and 60 mils are readily available. Finished copper thickness options include 1oz and 2oz.
Our capabilities extend to PCBs with a maximum size of 400 mm by 500 mm. These can be individual boards or panels with multiple alternative designs.
We provide a range of solder mask colors, such as green, black, blue, and yellow. We also offer diverse choices for plating pads, including immersion gold, HASL, immersion silver, immersion tin, OSP, pure gold, and bare copper, among others.
|PCB material:||PTFE Ceramic Fiberglass|
|Layer count:||Single layer, Double layer, Multilayer, Hybrid PCB|
|Copper weight:||1oz (35µm), 2oz (70µm)|
|Laminate thickness:||10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)|
|PCB size:||≤400mm X 500mm|
|Solder mask:||Green, Black, Blue, Red, Yellow etc.|
|Surface finish:||Immersion gold, HASL, Immersion silver, Immersion tin, OSP, Pure gold, Bare copper, ENEPIG etc..|
Machining PTFE-based substrates presents unique challenges due to the softness of the PTFE resin system. The quality of routing, including the presence of burrs and fibers, is influenced by the type of fiberglass used in the substrate. Heavier fiberglass weaves pose greater difficulties in cutting.
RF-35 employs a robust heavy weight 7628 glass style, which provides excellent dimensional stability and rigidity. However, it's important to note that drilling or routing this product may present more challenges compared to using a medium weight glass style.
Contact Person: Ms. Ivy Deng