Send Message
Home ProductsPCB Blog

30mil RF-60TC 0.8mm Immersion Gold High Frequency PCB For GPS

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

I'm Online Chat Now

30mil RF-60TC 0.8mm Immersion Gold High Frequency PCB For GPS

30mil RF-60TC 0.8mm Immersion Gold High Frequency PCB For GPS
30mil RF-60TC 0.8mm Immersion Gold High Frequency PCB For GPS 30mil RF-60TC 0.8mm Immersion Gold High Frequency PCB For GPS 30mil RF-60TC 0.8mm Immersion Gold High Frequency PCB For GPS 30mil RF-60TC 0.8mm Immersion Gold High Frequency PCB For GPS

Large Image :  30mil RF-60TC 0.8mm Immersion Gold High Frequency PCB For GPS

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD 9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
High Light:

GPS High Frequency PCB

,

0.8mm Immersion Gold PCB

,

High Frequency PCB Board 30mil

Introducing our newly shipped RF-60TC PCB, a cutting-edge solution provided to meet the demanding requirements of high-frequency applications. With its advanced features and exceptional performance, this PCB is perfect for a wide range of applications, from high power amplifiers to satellite systems.

 

The RF-60TC PCB is constructed using glass reinforced PTFE ceramic composites, offering superior characteristics that ensure reliable and efficient operation. Its dielectric constant (Dk) of 6.15 at 10 GHz and dissipation factor of 0.002 at 10 GHz/23°C provide excellent signal integrity and minimize losses, resulting in improved overall performance. The thermal coefficient of Dk of -3.58 ppm/°C during -50°C to 150°C enables stable performance across varying temperatures.

 

One of the standout benefits of the RF-60TC PCB is its improved loss tangent, which enhances signal transmission and reduces interference. Additionally, the high thermal conductivity ensures efficient heat dissipation, enabling the PCB to withstand demanding operating conditions. The enhanced dimensional stability and low Z-axis coefficient of thermal expansion (CTE) of 40 ppm/°C offer reliability and resistance to mechanical stress.

 

The RF-60TC PCB demonstrates excellent adhesion to metal, providing a robust and reliable connection. Its stable DK over frequency and temperature ensures consistent performance across different environments. Furthermore, the PCB exhibits low moisture absorption, enhancing its durability and longevity.

 

The stackup of the RF-60TC PCB features a 2-layer rigid design, consisting of copper layers with a thickness of 35 μm and a Taconic Core RF-60TC of 0.762 mm (30mil). With a finished board thickness of 0.8mm and a 1 oz (1.4 mils) outer layer copper weight, this PCB strikes the perfect balance between durability and flexibility. The 20 μm via plating thickness and immersion gold surface finish further enhance the PCB's reliability and conductivity.

 

Measuring at 43.88mm x 33.19mm, the RF-60TC PCB offers a compact form factor while maintaining precise dimensions with a tolerance of +/- 0.15mm. The minimum trace/space of 6/7 mils and minimum hole size of 0.40mm enable intricate designs and high-density circuitry. The absence of blind vias simplifies the manufacturing process, allowing for seamless integration into your projects.

 

To ensure the highest quality standards, every RF-60TC PCB undergoes a 100% electrical test prior to shipment. It adheres to the IPC-Class-2 standard, guaranteeing reliability and performance.

 

With 25 components, 68 pads (including 47 thru-hole pads and 21 top SMT pads), 42 vias, and 4 nets, the RF-60TC PCB offers versatility and compatibility with a wide range of electronic systems.

 

The RF-60TC PCB's exceptional performance makes it an ideal choice for various applications, including high power amplifiers, miniaturized antennas, GPS, patch and RFID readers, filters, couplers, dividers, and satellites. Its global availability ensures easy access to this high-quality PCB solution.

 

For any technical inquiries or further information, please contact Ivy at sales10@bichengpcb.com. We are here to assist you in bringing your projects to life with our state-of-the-art RF-60TC PCB.

 

Dk @ 10 GHz IPC-650 2.5.5.5.1 (Modified)   6.15 ± 0.15   6.15 ± 0.15
Df @ 10 GHz IPC-650 2.5.5.5.1 (Modified)   0.002   0.002
TcK   ppm/°C -3.581 ppm/°C -3.581
Dielectric Breakdown IPC-650 2.5.6 kV 55 kV 55
Dielectric Strength IPC-650 2.5.6.2 V/mil 550 V/mm 21,654
Arc Resistance IPC-650 2.5.1 Seconds >180 Seconds >180
Moisture Absorption IPC-650 2.6.2.1 % 0.03 % 0.03
Flexural Strength (MD) IPC-650 2.4.4 psi 10,000 N/mm2 69
Flexural Strength (CD) IPC-650 2.4.4 psi 9,000 N/mm2 62
Tensile Strength (MD) IPC-650 2.4.19 psi 9,000 N/mm2 62
Tensile Strength (CD) IPC-650 2.4.19 psi 7,000 N/mm2 48
Young’s Modulus (MD) ASTM D 3039/IPC-TM-650 2.4.19 kpsi 721 N/mm2 4971
Poisson’s Ratio (MD) ASTM D 3039/IPC-TM-650 2.4.19   0.155   0.155
Peel Strength (1 oz. ED) IPC-650 2.4.8 lbs/in 8 N/mm 1.43
Thermal Conductivity (Unclad) IPC-650 2.4.50 W/M*K 0.9 W/M*K 0.9
Thermal Conductivity (CH/CH) IPC-650 2.4.50 W/M*K 1 W/M*K 1
Thermal Conductivity (C1/C1) IPC-650 2.4.50 W/M*K 1.05 W/M*K 1.05
Dimensional Stability (MD) IPC-650 2.4.39 Sec. 5.4 (After Bake) mils/in 0.01 mm/M 0.01
Dimensional Stability (CD) IPC-650 2.4.39 Sec. 5.4 (After Bake) mils/in 0.69 mm/M 0.69
Dimensional Stability (MD) IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) mils/in 0.06 mm/M 0.06
Dimensional Stability (CD) IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) mils/in 0.8 mm/M 0.8
Surface Resistivity IPC-650 2.5.17.1 (After Humidity) Mohm 1.0 x 108 Mohm 1.0 x 108
Volume Resistivity IPC-650 2.5.17.1 (After Humidity) Mohm/cm 1.0 x 108 Mohm/cm 1.0 x 108
CTE (X, Y axis) IPC-650 2.4.41 (RT- 150 °C) ppm/°C 9.9 ppm/°C 9.9
CTE (Z axis) IPC-650 2.4.41 (RT- 150 °C) ppm/°C 40 ppm/°C 40
Density (Specific Gravity) IPC-650 2.3.5 g/cm3 2.84 g/cm3 2.84
Specific Heat IPC-650 2.4.50 J/gK 0.94 J/gK 0.94
Td (2% Wt. Loss) IPC - 650 2.4.24.6 / TGA °F 930 °C 500
Td (5% Wt. Loss) IPC - 650 2.4.24.6 / TGA °F 960 °C 515
Flammability Rating UL 94   V-0   V-0


RF-60TC PCB: Unleashing the Power of High-Frequency Applications

 

Introduction:
In the ever-evolving landscape of technology, high-frequency applications demand cutting-edge solutions that deliver exceptional performance and reliability. Introducing the RF-60TC PCB, the RF-60TC PCB is set to transform the way we approach high-frequency electronics.

 

Unparalleled Performance and Reliability:
The RF-60TC PCB stands out in the market for its unmatched performance and reliability. Constructed using glass reinforced PTFE ceramic composites, this PCB offers exceptional signal integrity and minimizes losses. Its dielectric constant (Dk) of 6.15 at 10 GHz and low dissipation factor (Df) of 0.002 ensure precise and efficient signal transmission. Additionally, the RF-60TC PCB exhibits remarkable dimensional stability and mechanical strength, making it a reliable choice for critical applications.

 

PCB Material: PTFE based, ceramic filled fiberglass
Designation: RF-60TC
Dielectric constant: 6.15
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm)
PCB thickness: 10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

Cutting-Edge Features for High-Frequency Applications:
The RF-60TC PCB incorporates cutting-edge features that make it ideal for high-frequency applications. Its low loss tangent enhances signal integrity, reducing interference and enabling accurate data transmission. The PCB's high thermal conductivity ensures efficient heat dissipation, allowing it to withstand the demanding operating conditions of high-power systems. Furthermore, the RF-60TC PCB demonstrates excellent adhesion to metal, providing a robust and reliable connection.

 

The Science Behind RF-60TC: Properties and Specifications:
To understand the RF-60TC PCB better, let's delve into its properties and specifications. With a dielectric constant of 6.15 ± 0.15 at 10 GHz, the RF-60TC PCB maintains stable performance across different frequencies. Its dissipation factor of 0.002 guarantees minimal signal loss, resulting in optimal performance. The thermal coefficient of Dk of -3.581 ppm/°C ensures consistent performance over a wide temperature range.

 

Enhancing Signal Integrity with Low Loss Tangent:
Signal integrity is crucial in high-frequency applications, and the RF-60TC PCB excels in this aspect. Its low loss tangent minimizes signal attenuation and distortion, allowing for accurate and reliable data transmission. This feature is particularly beneficial in applications such as high power amplifiers, miniaturized antennas, GPS systems, and patch and RFID readers.

 

30mil RF-60TC 0.8mm Immersion Gold High Frequency PCB For GPS 0

 

Optimal Thermal Management for Demanding Environments:
High-frequency applications often generate substantial heat, making thermal management critical. The RF-60TC PCB's high thermal conductivity of 0.9 W/M*K ensures efficient heat dissipation, preventing overheating and maintaining optimal performance. This feature is invaluable in applications where thermal stability is essential, such as satellite systems and high-power amplifiers.

 

Durable and Resilient: Stability and Mechanical Strength:
The RF-60TC PCB is built to withstand challenging conditions. Its exceptional dimensional stability and low Z-axis coefficient of thermal expansion (CTE) of 40 ppm/°C ensure reliable performance under varying temperatures and mechanical stress. With flexural and tensile strength of up to 10,000 psi(continued) and 9,000 psi respectively, the RF-60TC PCB offers remarkable mechanical strength, making it resistant to bending and stretching. These properties make it an ideal choice for applications where stability and durability are paramount.

 

Applications and Industries for RF-60TC PCB:
The RF-60TC PCB finds extensive use in high-frequency applications across various industries. In the telecommunications sector, it enables the development of high-speed data transmission systems and 5G infrastructure. In aerospace applications, the RF-60TC PCB ensures reliable communication and navigation systems. The automotive industry benefits from its use in radar systems, collision avoidance, and advanced driver-assistance systems. Additionally, the RF-60TC PCB finds applications in medical devices, industrial automation, and military equipment, among others.

 

Conclusion: Elevate Your Projects with RF-60TC:
The RF-60TC PCB sets a new standard for high-frequency applications with its exceptional performance, reliability, and advanced features. Whether you're working on telecommunications, aerospace, automotive, or any other high-frequency project, the RF-60TC PCB delivers unmatched signal integrity, thermal management, and mechanical strength. By choosing the RF-60TC PCB, you're investing in a reliable and versatile solution that will elevate your projects to new heights of success.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)