Payment & Shipping Terms:
|Base Material:||DiClad 0.508mm||Layer Count:||2 Layers|
|PCB Thickness:||0.6 Mm ±0.1||PCB Size:||68 X 86mm=1up|
|Copper Weight:||1oz||Surface Finish:||Immersion Gold|
880 High Frequency PCB Material,
High Frequency PCB Double Layer,
60mil PCB Material
Rogers DiClad 880 High Frequency PCB Double Layer 60mil With Immersion Gold
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers DiClad 880 laminates are made of woven fiberglass reinforced, PTFE-based composites that offer lower dielectric constant (Dk) and dissipation factors (Df). These laminates are commonly used in filter, coupler, and low noise amplifier applications, as well as power dividers and combiners, where dielectric constant uniformity and low loss are important.
Let's take a closer look at the properties of DiClad 880. This material is woven fiberglass reinforced and PTFE-based, without any ceramic filler. Its dielectric constant is carefully adjusted through a precise mixing ratio of PTFE and fiberglass, resulting in a lower DK value of 2.17 or 2.2 at 10 GHz and a lower dissipation factor of 0.0009 @ 10 GHz. However, it is important to note that this material may have less dimensional stability than high DK materials.
In terms of thermal properties, the thermal coefficient of dielectric constant (TCDk) of DiClad 880 is relatively poor at -160 ppm/°C due to the absence of any ceramic fillers. Furthermore, the coefficient of thermal expansion (CTE) in the Z-axis becomes higher at 252 ppm/°C, resulting in weaker thermal conductivity of 0.26 W/mK.
DiClad 880 has a strong adhesion to copper, as shown by its peel strength of 14 lbs/inch after thermal stress. Additionally, both the volume resistivity and surface resistivity are good, measuring at 1.4 x 10^9 MΩ-cm and 2.9 x 10^6 MΩ, respectively. The material also has an arc resistance of greater than 180 seconds.
DiClad 880 performs exceptionally well in terms of tensile modulus, tensile strength, compressive modulus, and flexural modulus. It has a dielectric breakdown value greater than 45 kilo voltage and a material density of 2.23 g/cm³. It meets the requirements of UL94-V0 flammability standards and has low water absorption of 0.02%.
DiClad 880 also has impressive outgassing properties, with a low total mass loss of 0.01% and a collected volatile condensable material limit of 0.10%. It has a water vapor regain rate of 0.01%, indicating resistance to water vapor absorption, and no visible condensate is present during use. These parameters demonstrate that DiClad 880 is highly stable and reliable.
DiClad 880 PCBs are available in various layer counts, including single-sided, double-sided, multilayer, and hybrid PCBs, and come in different dielectric thicknesses of 20mil (0.508mm), 30mil (0.762mm), and 60mil (1.524mm). They are also available in copper weights of 1oz (35µm) and 2oz (70µm), allowing for flexibility in design.
The PCB size is limited to 400mm by 500mm but can be manufactured to fit various applications. The solder mask comes in a range of colors, including green, black, blue, yellow, and red.
The surface finish of the DiClad 880 PCB is customizable and available in different options, including immersion gold, hot air soldering level (HASL), immersion silver, immersion tin, bare copper, OSP, and pure gold plated, among others.
DiClad880 PCBs are versatile and find utility in a variety of applications, including radar feed networks, commercial phased array networks, low loss base station antennas, and guidance systems.
Finally, DiClad 880 material is compatible with both traditional electroless copper and direct deposit metallization processes, making the fabrication process simple and convenient. Most surface finishes, such as HASL, tin, silver, nickel/gold, and OSP, have been applied to DiClad 880 without any issues or special concerns.
|PCB SIZE||68 x 86mm=1up|
|BOARD TYPE||Double sided PCB|
|Number of Layers||2 layers|
|Surface Mount Components||YES|
|Through Hole Components||NO|
|LAYER STACKUP||copper ------- 17um(0.5 oz)+plate TOP layer|
|copper ------- 17um(0.5 oz) + plate BOT Layer|
|Minimum Trace and Space:||10 mil / 10 mil|
|Minimum / Maximum Holes:||0.5 mm / 1.0 mm|
|Number of Different Holes:||4|
|Number of Drill Holes:||12|
|Number of Milled Slots:||0|
|Number of Internal Cutouts:||2|
|Number of Gold finger:||0|
|Glass Epoxy:||DiClad880 0.508mm|
|Final foil external:||1.0 oz|
|Final foil internal:||N/A|
|Final height of PCB:||0.6 mm ±0.1|
|PLATING AND COATING|
|Surface Finish||Immersion Gold, 88.2%|
|Solder Mask Apply To:||N/A|
|Solder Mask Color:||N/A|
|Solder Mask Type:||N/A|
|Side of Component Legend||N/A|
|Colour of Component Legend||N/A|
|Manufacturer Name or Logo:||N/A|
|VIA||Plated through hole(PTH), minimum size 0.5mm.|
|TEST||100% Electrical Test prior shipment|
|TYPE OF ARTWORK TO BE SUPPLIED||email file, Gerber RS-274-X, PCBDOC etc|
|SERVICE AREA||Worldwide, Globally.|
Contact Person: Ms. Ivy Deng