Product Details:
Payment & Shipping Terms:
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Based Material: | CLTE-XT 1.016mm | Layer Count: | 2 Layers |
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PCB Size: | 65mm X 150mm=1 Piece | PCB Thickness: | 1.2 Mm ±0.12 |
Copper Weight: | 1oz | Surface Finish: | Immersion Gold |
High Light: | Woven Glass Reinforced PTFE Circuit Boards,25mil Rogers PCB Board,Ceramic Filled PTFE Circuit Boards |
Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil ceramic filled woven glass reinforced PTFE Circuit Boards
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
The CLTE-XT laminates are composites of PTFE, woven fiberglass reinforcement, and micro-dispersed ceramic filler that are intended to increase loss tangent while preserving good dimensional stability and offering excellent thermal reliability and electrical performance.
Features and Benefits
1. Copper matched CTE in X and Y axis
2. Low Z-direction CTE of 20 ppm /°C
3. Low dissipation factor of 0.0010 at 10 GHz reduced circuit losses without sacrificing dimensional stability
4. Tightest dielectric constant tolerance(+/- .03) and DK stability with temperature change
5. High reliability on plated through holes
6. 0.02% low moisture absorption
7. Great number of NASA outgassing values.
8. High thermal conductivity of 0.56 W/m/K
Our PCB Capability (CLTE-XT laminates)
Parameter | Value |
Layer Counts | 1-32 |
Substrate Materials | RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; RT/duroid 5880LZ; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; DiClad 880, DiClad 870, DiClad 527; IsoClad 917; CLTE, CLTE-XT, CLTE-AT, CLTE-MW; Nelco N4000, N9350, N9240; SCGA-500 GF220, SCGA-500 GF255, SCGA-500 GF265, SCGA-500 GF300; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc. |
Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
Board Outline Tolerance | ±0.0059" (0.15mm) |
PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
Thickness Tolerance(T≥0.8mm) | ±8% |
Thickness Tolerance(t<0.8mm) | ±10% |
Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
Minimum Track | 0.003" (0.075mm) |
Minimum Space | 0.003" (0.075mm) |
Outer Copper Thickness | 35µm--350µm (1oz-10oz) |
Inner Copper Thickness | 17µm--350µm (0.5oz - 10oz) |
Drill Hole(Mechanical) | 0.0079" - 0.25" (0.2mm--6.35mm) |
Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
Registration (Mechanical) | 0.00197" (0.05mm) |
Aspect Ratio | 12:1 |
Solder Mask Type | LPI |
Min Soldermask Bridge | 0.00315" (0.08mm) |
Min Soldermask Clearance | 0.00197" (0.05mm) |
Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
Impedance Control Tolerance | ±10% |
Surface Finish | HASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger, Pure gold plated etc. |
The majority of final finishes, including HASL, Sn, Ag, Ni/Au, OSP, etc., have been applied to CLTE-XT materials without incident or cause for concern. Individual circuit board can be routed, punched, or laser cut depending on preference, tolerances, and edge quality requirements.
Typical Applications
1. Advanced Driver Assistance Systems (ADAS)
2. CNI (communication, navigation and identification) Applications
3. Defense Microwave/RF Applications
4. Microwave Feed Networks
5. Phased Array Antennas
6. Power Amplifiers
7. Patch Antennas
8. Radar Manifolds
9. Satellite & Space Electronics
Data Sheet (CLTE-XT laminates)
PCB SIZE | 65mm x 150mm=1 piece |
BOARD TYPE | High Frequency PCB |
Number of Layers | 2 layers |
Surface Mount Components | YES |
Through Hole Components | N/A |
LAYER STACKUP | copper ------- 17um(0.5 oz)+plate top layer |
CLTE-XT 1.016mm | |
copper ------- 17um(0.5 oz)+plate bot layer | |
TECHNOLOGY | |
Minimum Trace and Space: | 12 mil / 12 mil |
Minimum / Maximum Holes: | 0.4 mm / 4.8 mm |
Number of Different Holes: | 9 |
Number of Drill Holes: | 102 |
Number of Milled Slots: | 1 |
Number of Internal Cutouts: | 1 |
Impedance Control: | no |
Number of Gold finger: | 0 |
BOARD MATERIAL | |
Glass Epoxy: | CLTE-XT 1.016mm |
Final foil external: | 1 oz |
Final foil internal: | 1 oz |
Final height of PCB: | 1.2 mm ±0.12 |
PLATING AND COATING | |
Surface Finish | Immersion Gold, 43.57% |
Solder Mask Apply To: | Both sides |
Solder Mask Color: | Green |
Solder Mask Type: | Glossy |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | Top side |
Colour of Component Legend | White |
Manufacturer Name or Logo: | N/A |
VIA | Plated through hole(PTH), minimum size 0.4mm. |
FLAMIBILITY RATING | 94V-0 |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" |
Board plating: | 0.0029" |
Drill tolerance: | 0.002" |
TEST | 100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848