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Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin

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Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

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Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin

Large Image : Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin

Product Details:

Place of Origin:	CHINA
Brand Name:	Bicheng
Certification:	UL, ISO9001, IATF16949
Model Number:	BIC-187.V1.0

Payment & Shipping Terms:

Minimum Order Quantity:	1PCS
Price:	USD9.99-99.99
Packaging Details:	Vacuum bags+Cartons
Delivery Time:	8-9 working days
Payment Terms:	T/T
Supply Ability:	5000PCS per month

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Detailed Product Description

Base Material:	Ceramic-filled, Glass-reinforced Hydrocarbon	Layer Count:	Double Sided PCB, Multilayer PCB, Hybrid PCB
PCB Thickness:	20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )	PCB Size:	≤400mm X 500mm
Solder Mask:	Green, Black, Blue, Yellow, Red Etc.	Copper Weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish:	Bare Copper, HASL, ENIG, Immersion Silver, Immersion Tin, OSP, Pure Gold Plated Etc..

Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

General Description

RO4534 High Frequency Laminates are ceramic-filled, glass-reinforced hydrocarbon based material which are cost/performance materials from Rogers Corporation, specifically engineered and manufactured to meet the specific demands of the antenna markets. It has a dielectric constant of 3.4 and a loss tangent (Df) of 0.0027 measured at 10 GHz. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Thus, it provides excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.

It is an affordable alternative to more conventional PTFE antenna technologies, thus allowing our designers to optimize the price and performance of the antennas. The resin systems of RO4534 dielectric materials are designed to provide the necessary properties for ideal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper. The good CTE match reduces stresses in the printed circuit board antenna.

Features and Benefits

1. Low Loss 0.0027 , Low Dk 3.4, low PIM response: Wide range of application use

2. Thermoset resin system: Compatible with standard PCB fabrication

3. Excellent dimensional stability: Greater yield on larger panels sizes

4. Uniform mechanical properties: Maintains mechanical form during handling

5. High thermal conductivity: Improved power handling

Typical Applications:

1. Cellular infrastructure base station antennas

2. WiMAX antenna networks

Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin 0

Our PCB Capability (RO4534)

PCB Material:	Ceramic-filled, Glass-reinforced Hydrocarbon
Designation:	RO4534
Dielectric constant:	3.4
Dissipation Factor	0.0027 10GHz
Layer count:	Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

RO4534 Typical Values

Property	RO4534	Direction	Units	Condition	Test Method
Dielectric Constant, er Process	3.4 ± 0.08	Z	-	10 GHz/23℃ 2.5 GHz	IPC-TM-650,2.5.5.5
Dissipation Factor	0.0022	Z	-	2.5 GHz/23℃	IPC-TM-650, 2.5.5.5
Dissipation Factor	0.0027	Z	-	10 GHz/23℃	IPC-TM-650, 2.5.5.5
PIM (Typical)	-157	-	dBc	Reflected 43 dBm swept tones	Summitek 1900b PIM Analyzer
Dielectric Strength	>500	Z	V/mil	0.51 mm	IPC-TM-650, 2.5.6.2
Dimensional Stability	<0.3	X,Y	mm/m (mils/inch)	after etch	IPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion	11	X	ppm/℃	-55 to 288℃	IPC-TM-650, 2.4.41
	14	Y
	46	Z
Thermal Conductivity	0.6	-	W/(m.K)	80℃	ASTM C518
Moisture Absorption	0.06	-	%	D48/50	IPC-TM-650, 2.6.2.1 ASTM D570
Tg	>280	-	℃ TMA	A	IPC-TM-650, 2.4.24.3
Density	1.8	-	gm/cm3	-	ASTM D792
Copper Peel Strength	6.3 (1.1)	-	lbs/in (N/mm)	1 oz. EDC post solder float	IPC-TM-650, 2.4.8
Flammability	NON FR	-	-	-	UL 94
Lead-Free Process Compatible	Yes	-	-	-	-