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Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin
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Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin
  • name
  • name

Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-187.V1.0
Base Material:
Ceramic-filled, Glass-reinforced Hydrocarbon
Layer Count:
Double Sided PCB, Multilayer PCB, Hybrid PCB
PCB Thickness:
20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish:
Bare Copper, HASL, ENIG, Immersion Silver, Immersion Tin, OSP, Pure Gold Plated Etc..
Highlight:

Immersion Tin Rogers PCB Board

Product Description

 

Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

RO4534 High Frequency Laminates are ceramic-filled, glass-reinforced hydrocarbon based material which are cost/performance materials from Rogers Corporation, specifically engineered and manufactured to meet the specific demands of the antenna markets. It has a dielectric constant of 3.4 and a loss tangent (Df) of 0.0027 measured at 10 GHz. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Thus, it provides excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.

 

As a cost-effective replacement for more established PTFE antenna technology, it enables our designers to balance the cost and performance of the antennas. The resin systems of RO4534 dielectric materials are created to offer the appropriate antenna performance-related features. In both the X and Y directions, the coefficients of thermal expansion (CTEs) are comparable to those of copper. The printed circuit board antenna is less stressed because to a good CTE fit.

 

Features and Benefits

1. Low Loss 0.0027 , Low Dk 3.4, low PIM response: Wide range of application use

2. Thermoset resin system: Compatible with standard PCB fabrication

3. Excellent dimensional stability: Greater yield on larger panels sizes

4. Uniform mechanical properties: Maintains mechanical form during handling

5. High thermal conductivity: Improved power handling

 

Typical Applications:

1. Cellular infrastructure base station antennas

2. WiMAX antenna networks

 

Our PCB Capability (RO4534)

PCB Material: Ceramic-filled, Glass-reinforced Hydrocarbon
Designation: RO4534
Dielectric constant: 3.4
Dissipation Factor 0.0027 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

RO4534 Typical Values

Property RO4534 Direction Units Condition Test Method
Dielectric Constant, er Process 3.4 ± 0.08 Z - 10 GHz/23℃ 2.5 GHz IPC-TM-650,2.5.5.5
Dissipation Factor 0.0022 Z - 2.5 GHz/23℃ IPC-TM-650, 2.5.5.5
0.0027 10 GHz/23℃
PIM (Typical) -157 - dBc Reflected 43 dBm swept tones Summitek 1900b PIM Analyzer
Dielectric Strength >500 Z V/mil 0.51 mm IPC-TM-650, 2.5.6.2
Dimensional Stability <0.3 X,Y mm/m (mils/inch) after etch IPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion 11 X ppm/℃ -55 to 288℃ IPC-TM-650, 2.4.41
14 Y
46 Z
Thermal Conductivity 0.6 - W/(m.K) 80℃ ASTM C518
Moisture Absorption 0.06 - % D48/50 IPC-TM-650, 2.6.2.1 ASTM D570
Tg >280 - ℃ TMA A IPC-TM-650, 2.4.24.3
Density 1.8 - gm/cm3 - ASTM D792
Copper Peel Strength 6.3 (1.1) - lbs/in (N/mm) 1 oz. EDC post solder float IPC-TM-650, 2.4.8
Flammability NON FR - - - UL 94
Lead-Free Process Compatible Yes - - - -

 

Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin 0

 

Tags: 

RO4003C LoPro Rogers PCB Board,  

8mil Rogers PCB Board,  

0.5oz Rogers PCB Board

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products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin
  • name
  • name
Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-187.V1.0
Base Material:
Ceramic-filled, Glass-reinforced Hydrocarbon
Layer Count:
Double Sided PCB, Multilayer PCB, Hybrid PCB
PCB Thickness:
20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish:
Bare Copper, HASL, ENIG, Immersion Silver, Immersion Tin, OSP, Pure Gold Plated Etc..
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Immersion Tin Rogers PCB Board

Product Description

 

Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

RO4534 High Frequency Laminates are ceramic-filled, glass-reinforced hydrocarbon based material which are cost/performance materials from Rogers Corporation, specifically engineered and manufactured to meet the specific demands of the antenna markets. It has a dielectric constant of 3.4 and a loss tangent (Df) of 0.0027 measured at 10 GHz. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Thus, it provides excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.

 

As a cost-effective replacement for more established PTFE antenna technology, it enables our designers to balance the cost and performance of the antennas. The resin systems of RO4534 dielectric materials are created to offer the appropriate antenna performance-related features. In both the X and Y directions, the coefficients of thermal expansion (CTEs) are comparable to those of copper. The printed circuit board antenna is less stressed because to a good CTE fit.

 

Features and Benefits

1. Low Loss 0.0027 , Low Dk 3.4, low PIM response: Wide range of application use

2. Thermoset resin system: Compatible with standard PCB fabrication

3. Excellent dimensional stability: Greater yield on larger panels sizes

4. Uniform mechanical properties: Maintains mechanical form during handling

5. High thermal conductivity: Improved power handling

 

Typical Applications:

1. Cellular infrastructure base station antennas

2. WiMAX antenna networks

 

Our PCB Capability (RO4534)

PCB Material: Ceramic-filled, Glass-reinforced Hydrocarbon
Designation: RO4534
Dielectric constant: 3.4
Dissipation Factor 0.0027 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

RO4534 Typical Values

Property RO4534 Direction Units Condition Test Method
Dielectric Constant, er Process 3.4 ± 0.08 Z - 10 GHz/23℃ 2.5 GHz IPC-TM-650,2.5.5.5
Dissipation Factor 0.0022 Z - 2.5 GHz/23℃ IPC-TM-650, 2.5.5.5
0.0027 10 GHz/23℃
PIM (Typical) -157 - dBc Reflected 43 dBm swept tones Summitek 1900b PIM Analyzer
Dielectric Strength >500 Z V/mil 0.51 mm IPC-TM-650, 2.5.6.2
Dimensional Stability <0.3 X,Y mm/m (mils/inch) after etch IPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion 11 X ppm/℃ -55 to 288℃ IPC-TM-650, 2.4.41
14 Y
46 Z
Thermal Conductivity 0.6 - W/(m.K) 80℃ ASTM C518
Moisture Absorption 0.06 - % D48/50 IPC-TM-650, 2.6.2.1 ASTM D570
Tg >280 - ℃ TMA A IPC-TM-650, 2.4.24.3
Density 1.8 - gm/cm3 - ASTM D792
Copper Peel Strength 6.3 (1.1) - lbs/in (N/mm) 1 oz. EDC post solder float IPC-TM-650, 2.4.8
Flammability NON FR - - - UL 94
Lead-Free Process Compatible Yes - - - -

 

Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin 0

 

Tags: 

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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