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40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish
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40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish
  • name
  • name

40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish

MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-164.V1.0
Base Material:
Glass Reinforced Hydrocarbon Ceramic
Layer Count:
Double Layer, Multilayer, Hybrid PCB
PCB Thickness:
20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm)
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm)
Surface Finish:
Bare Copper, HASL, ENIG, OSP Etc..
Highlight:

1.016mm Rogers Pcb Circuit Board

,

40mil Rogers Pcb Circuit Board

,

OSP Surface Finish Pcb Circuit Board

Product Description

 

Rogers High Frequency PCB Built on Kappa 438 40mil 1.016mm DK 4.38 with Immersion Gold for Distributed Antenna Systems

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers Kappa 438 laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. Kappa 438 laminates also have the UL 94 V-0 flame retardant rating and are lead free solder process compatible.

 

Kappa 438 laminates offer dielectric constants (Dk) tailored to FR-4 industry standard norms which facilities ease of converting existing FR-4 designs where better electrical performance is needed.

 

Features

1. Glass reinforced hydrocarbon thermoset platform

2. Tighter Dk and thickness tolerance than FR-4

3. Low Z Axis CTE of 42 ppm/°C

 

Benefits

1. Design Dk enables ease of converting existing FR-4 designs needing better electrical performance

2. Improved design flexibility and plated through-hole reliability

3. Automated assembly compatible

 

Typical Applications:

1. Carrier Grade WiFi/Licensed Assisted Access (LAA)

2. Small Cell and Distributed Antenna Systems (DAS)

3. Vehicle to Vehicle/Vehicle to Infrastructure Communications (V2X)

 

Segments: Smart Home and Wireless Meters

 

40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish 0

40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish 1

 

Our PCB Capability (Kappa 438)

PCB Material: Glass Reinforced Hydrocarbon Ceramic
Designation: Kappa 438
Dielectric constant: 4.38
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm)
PCB thickness: 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 

40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish 2

 

Data Sheet of Kappa 438 Laminate

Property Typical Value Kappa 438 Direction Units Condition Test Method
Dielectric Constant, er Design 4.38 Z - 2.5 GHz Differential Phase Length Method
Dissipation Factor tan, d 0.005 Z - 10 GHz/23°C IPC-TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant e -21 - ppm/°C 10 GHz (-50 to 150°C) Modified IPC-TM-650 2.5.5.5
Volume Resistivity 2.9 x 109 - MΩ•cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 6.2 x 107 - MΩ COND A IPC-TM-650 2.5.17.1
Electrical Strength 675 Z V/mil - IPC-TM-650 2.5.6.2
Tensile Strength 16 12 MD CMD kpsi - ASTM D3039/D3039-14
Flexural Strength 25 19 MD CMD kpsi - IPC-TM-650 2.4.4
Dimensional Stability -0.48  -0.59 MD CMD mm/m - IPC-TM-650 2.4.39a
Coefficient of Thermal Expansion 13 X ppm/°C -55 to 288°C IPC-TM-650 2.4.41
16 Y
42 Z
Thermal Conductivity 0.64 Z W/(m.K) 80°C ASTM D5470
Time to Delamination (T288) >60 - minutes 288°C IPC-TM-650 2.4.24.1
Tg >280 - °C TMA - IPC-TM-650 2.4.24.3
Td 414 - °C - IPC-TM-650 2.3.40
Moisture Absorption 0.07 - % 24/23 IPC-TM-650 2.6.2.1
Young’s Modulus 2264 2098 MD CMD kpsi - ASTM D3039/D3039-14
Flex Modulus 2337 2123 MD CMD kpsi - IPC-TM-650 2.4.4
Bow 0.03 - % - IPC-TM-650 2.4.22C
Twist 0.08 - % - IPC-TM-650 2.4.22C
Copper Peel Strength After Thermal Stress 5.8 - lbs/in 1 oz (35 µm) foil IPC-TM-650 2.4.8
Flammability V-0 - - - UL 94
Specific Gravity 1.99 - g/cm3 - ASTM D792
Lead-Free Process Compatible Yes - - -  

 

Tags: 

RO4003C LoPro Rogers PCB Board,  

8mil Rogers PCB Board,  

0.5oz Rogers PCB Board

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products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish
  • name
  • name
40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish
MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-164.V1.0
Base Material:
Glass Reinforced Hydrocarbon Ceramic
Layer Count:
Double Layer, Multilayer, Hybrid PCB
PCB Thickness:
20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm)
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm)
Surface Finish:
Bare Copper, HASL, ENIG, OSP Etc..
Minimum Order Quantity:
1PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

1.016mm Rogers Pcb Circuit Board

,

40mil Rogers Pcb Circuit Board

,

OSP Surface Finish Pcb Circuit Board

Product Description

 

Rogers High Frequency PCB Built on Kappa 438 40mil 1.016mm DK 4.38 with Immersion Gold for Distributed Antenna Systems

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers Kappa 438 laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. Kappa 438 laminates also have the UL 94 V-0 flame retardant rating and are lead free solder process compatible.

 

Kappa 438 laminates offer dielectric constants (Dk) tailored to FR-4 industry standard norms which facilities ease of converting existing FR-4 designs where better electrical performance is needed.

 

Features

1. Glass reinforced hydrocarbon thermoset platform

2. Tighter Dk and thickness tolerance than FR-4

3. Low Z Axis CTE of 42 ppm/°C

 

Benefits

1. Design Dk enables ease of converting existing FR-4 designs needing better electrical performance

2. Improved design flexibility and plated through-hole reliability

3. Automated assembly compatible

 

Typical Applications:

1. Carrier Grade WiFi/Licensed Assisted Access (LAA)

2. Small Cell and Distributed Antenna Systems (DAS)

3. Vehicle to Vehicle/Vehicle to Infrastructure Communications (V2X)

 

Segments: Smart Home and Wireless Meters

 

40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish 0

40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish 1

 

Our PCB Capability (Kappa 438)

PCB Material: Glass Reinforced Hydrocarbon Ceramic
Designation: Kappa 438
Dielectric constant: 4.38
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm)
PCB thickness: 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 

40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish 2

 

Data Sheet of Kappa 438 Laminate

Property Typical Value Kappa 438 Direction Units Condition Test Method
Dielectric Constant, er Design 4.38 Z - 2.5 GHz Differential Phase Length Method
Dissipation Factor tan, d 0.005 Z - 10 GHz/23°C IPC-TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant e -21 - ppm/°C 10 GHz (-50 to 150°C) Modified IPC-TM-650 2.5.5.5
Volume Resistivity 2.9 x 109 - MΩ•cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 6.2 x 107 - MΩ COND A IPC-TM-650 2.5.17.1
Electrical Strength 675 Z V/mil - IPC-TM-650 2.5.6.2
Tensile Strength 16 12 MD CMD kpsi - ASTM D3039/D3039-14
Flexural Strength 25 19 MD CMD kpsi - IPC-TM-650 2.4.4
Dimensional Stability -0.48  -0.59 MD CMD mm/m - IPC-TM-650 2.4.39a
Coefficient of Thermal Expansion 13 X ppm/°C -55 to 288°C IPC-TM-650 2.4.41
16 Y
42 Z
Thermal Conductivity 0.64 Z W/(m.K) 80°C ASTM D5470
Time to Delamination (T288) >60 - minutes 288°C IPC-TM-650 2.4.24.1
Tg >280 - °C TMA - IPC-TM-650 2.4.24.3
Td 414 - °C - IPC-TM-650 2.3.40
Moisture Absorption 0.07 - % 24/23 IPC-TM-650 2.6.2.1
Young’s Modulus 2264 2098 MD CMD kpsi - ASTM D3039/D3039-14
Flex Modulus 2337 2123 MD CMD kpsi - IPC-TM-650 2.4.4
Bow 0.03 - % - IPC-TM-650 2.4.22C
Twist 0.08 - % - IPC-TM-650 2.4.22C
Copper Peel Strength After Thermal Stress 5.8 - lbs/in 1 oz (35 µm) foil IPC-TM-650 2.4.8
Flammability V-0 - - - UL 94
Specific Gravity 1.99 - g/cm3 - ASTM D792
Lead-Free Process Compatible Yes - - -  

 

Tags: 

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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