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40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish

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Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

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Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

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40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish

Large Image : 40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish

Product Details:

Place of Origin:	CHINA
Brand Name:	Bicheng
Certification:	UL, ISO9001, IATF16949
Model Number:	BIC-164.V1.0

Payment & Shipping Terms:

Minimum Order Quantity:	1PCS
Packaging Details:	Vacuum bags+Cartons
Delivery Time:	8-9 working days
Payment Terms:	T/T
Supply Ability:	5000PCS per month

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Detailed Product Description

Base Material:	Glass Reinforced Hydrocarbon Ceramic	Layer Count:	Double Layer, Multilayer, Hybrid PCB
PCB Thickness:	20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm)	PCB Size:	≤400mm X 500mm
Solder Mask:	Green, Black, Blue, Yellow, Red Etc.	Copper Weight:	0.5oz (17 µm), 1oz (35µm)
Surface Finish:	Bare Copper, HASL, ENIG, OSP Etc..
High Light:	1.016mm Rogers Pcb Circuit Board , 40mil Rogers Pcb Circuit Board , OSP Surface Finish Pcb Circuit Board

Rogers High Frequency PCB Built on Kappa 438 40mil 1.016mm DK 4.38 with Immersion Gold for Distributed Antenna Systems

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers Kappa 438 laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. Kappa 438 laminates also have the UL 94 V-0 flame retardant rating and are lead free solder process compatible.

Kappa 438 laminates offer dielectric constants (Dk) tailored to FR-4 industry standard norms which facilities ease of converting existing FR-4 designs where better electrical performance is needed.

Features

1. Glass reinforced hydrocarbon thermoset platform

2. Tighter Dk and thickness tolerance than FR-4

3. Low Z Axis CTE of 42 ppm/°C

40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish 0

Benefits

1. Design Dk enables ease of converting existing FR-4 designs needing better electrical performance

2. Improved design flexibility and plated through-hole reliability

3. Automated assembly compatible

Typical Applications:

1. Carrier Grade WiFi/Licensed Assisted Access (LAA)

2. Small Cell and Distributed Antenna Systems (DAS)

3. Vehicle to Vehicle/Vehicle to Infrastructure Communications (V2X)

Segments: Smart Home and Wireless Meters

40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish 1

40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish 2

Our PCB Capability (Kappa 438)

PCB Material:	Glass Reinforced Hydrocarbon Ceramic
Designation:	Kappa 438
Dielectric constant:	4.38
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm)
PCB thickness:	20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm)
PCB thickness:
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP etc..

Data Sheet of Kappa 438 Laminate

Property	Typical Value Kappa 438	Direction	Units	Condition	Test Method
Dielectric Constant, er Design	4.38	Z	-	2.5 GHz	Differential Phase Length Method
Dissipation Factor tan, d	0.005	Z	-	10 GHz/23°C	IPC-TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant e	-21	-	ppm/°C	10 GHz (-50 to 150°C)	Modified IPC-TM-650 2.5.5.5
Volume Resistivity	2.9 x 10⁹	-	MΩ•cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	6.2 x 10⁷	-	MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	675	Z	V/mil	-	IPC-TM-650 2.5.6.2
Tensile Strength	16 12	MD CMD	kpsi	-	ASTM D3039/D3039-14
Flexural Strength	25 19	MD CMD	kpsi	-	IPC-TM-650 2.4.4
Dimensional Stability	-0.48 -0.59	MD CMD	mm/m	-	IPC-TM-650 2.4.39a
Coefficient of Thermal Expansion	13	X	ppm/°C	-55 to 288°C	IPC-TM-650 2.4.41
	16	Y
	42	Z
Thermal Conductivity	0.64	Z	W/(m.K)	80°C	ASTM D5470
Time to Delamination (T288)	>60	-	minutes	288°C	IPC-TM-650 2.4.24.1
Tg	>280	-	°C TMA	-	IPC-TM-650 2.4.24.3
Td	414	-	°C	-	IPC-TM-650 2.3.40
Moisture Absorption	0.07	-	%	24/23	IPC-TM-650 2.6.2.1
Young’s Modulus	2264 2098	MD CMD	kpsi	-	ASTM D3039/D3039-14
Flex Modulus	2337 2123	MD CMD	kpsi	-	IPC-TM-650 2.4.4
Bow	0.03	-	%	-	IPC-TM-650 2.4.22C
Twist	0.08	-	%	-	IPC-TM-650 2.4.22C
Copper Peel Strength After Thermal Stress	5.8	-	lbs/in	1 oz (35 µm) foil	IPC-TM-650 2.4.8
Flammability	V-0	-	-	-	UL 94
Specific Gravity	1.99	-	g/cm³	-	ASTM D792
Lead-Free Process Compatible	Yes	-	-	-