We Are Your RF PCB Solution Provider!
Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB
ISO9001, ISO14001, IATF 16949 certified
We Are Your RF PCB Solution Provider!
Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB
ISO9001, ISO14001, IATF 16949 certified
Product Details:
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Base Material: | Glass Reinforced Hydrocarbon Ceramic | Layer Count: | Double Layer, Multilayer, Hybrid PCB |
---|---|---|---|
PCB Thickness: | 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm) | PCB Size: | ≤400mm X 500mm |
Solder Mask: | Green, Black, Blue, Yellow, Red Etc. | Copper Weight: | 0.5oz (17 µm), 1oz (35µm) |
Surface Finish: | Bare Copper, HASL, ENIG, OSP Etc.. | ||
High Light: | 1.016mm Rogers Pcb Circuit Board,40mil Rogers Pcb Circuit Board,OSP Surface Finish Pcb Circuit Board |
Rogers High Frequency PCB Built on Kappa 438 40mil 1.016mm DK 4.38 with Immersion Gold for Distributed Antenna Systems
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers Kappa 438 laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. Kappa 438 laminates also have the UL 94 V-0 flame retardant rating and are lead free solder process compatible.
Kappa 438 laminates offer dielectric constants (Dk) tailored to FR-4 industry standard norms which facilities ease of converting existing FR-4 designs where better electrical performance is needed.
Features
1. Glass reinforced hydrocarbon thermoset platform
2. Tighter Dk and thickness tolerance than FR-4
3. Low Z Axis CTE of 42 ppm/°C
Benefits
1. Design Dk enables ease of converting existing FR-4 designs needing better electrical performance
2. Improved design flexibility and plated through-hole reliability
3. Automated assembly compatible
Typical Applications:
1. Carrier Grade WiFi/Licensed Assisted Access (LAA)
2. Small Cell and Distributed Antenna Systems (DAS)
3. Vehicle to Vehicle/Vehicle to Infrastructure Communications (V2X)
Segments: Smart Home and Wireless Meters
Our PCB Capability (Kappa 438)
PCB Material: | Glass Reinforced Hydrocarbon Ceramic |
Designation: | Kappa 438 |
Dielectric constant: | 4.38 |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm) |
PCB thickness: | 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
Data Sheet of Kappa 438 Laminate
Property | Typical Value Kappa 438 | Direction | Units | Condition | Test Method |
Dielectric Constant, er Design | 4.38 | Z | - | 2.5 GHz | Differential Phase Length Method |
Dissipation Factor tan, d | 0.005 | Z | - | 10 GHz/23°C | IPC-TM-650 2.5.5.5 |
Thermal Coefficient of Dielectric Constant e | -21 | - | ppm/°C | 10 GHz (-50 to 150°C) | Modified IPC-TM-650 2.5.5.5 |
Volume Resistivity | 2.9 x 109 | - | MΩ•cm | COND A | IPC-TM-650 2.5.17.1 |
Surface Resistivity | 6.2 x 107 | - | MΩ | COND A | IPC-TM-650 2.5.17.1 |
Electrical Strength | 675 | Z | V/mil | - | IPC-TM-650 2.5.6.2 |
Tensile Strength | 16 12 | MD CMD | kpsi | - | ASTM D3039/D3039-14 |
Flexural Strength | 25 19 | MD CMD | kpsi | - | IPC-TM-650 2.4.4 |
Dimensional Stability | -0.48 -0.59 | MD CMD | mm/m | - | IPC-TM-650 2.4.39a |
Coefficient of Thermal Expansion | 13 | X | ppm/°C | -55 to 288°C | IPC-TM-650 2.4.41 |
16 | Y | ||||
42 | Z | ||||
Thermal Conductivity | 0.64 | Z | W/(m.K) | 80°C | ASTM D5470 |
Time to Delamination (T288) | >60 | - | minutes | 288°C | IPC-TM-650 2.4.24.1 |
Tg | >280 | - | °C TMA | - | IPC-TM-650 2.4.24.3 |
Td | 414 | - | °C | - | IPC-TM-650 2.3.40 |
Moisture Absorption | 0.07 | - | % | 24/23 | IPC-TM-650 2.6.2.1 |
Young’s Modulus | 2264 2098 | MD CMD | kpsi | - | ASTM D3039/D3039-14 |
Flex Modulus | 2337 2123 | MD CMD | kpsi | - | IPC-TM-650 2.4.4 |
Bow | 0.03 | - | % | - | IPC-TM-650 2.4.22C |
Twist | 0.08 | - | % | - | IPC-TM-650 2.4.22C |
Copper Peel Strength After Thermal Stress | 5.8 | - | lbs/in | 1 oz (35 µm) foil | IPC-TM-650 2.4.8 |
Flammability | V-0 | - | - | - | UL 94 |
Specific Gravity | 1.99 | - | g/cm3 | - | ASTM D792 |
Lead-Free Process Compatible | Yes | - | - | - |
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