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20mil Kappa 438 Glass Reinforced Hydrocarbon Ceramic Rogers PCB Board Flame Retardant

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Ms. Ivy Deng

sales10@bichengpcb.com

86-755-27374847

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20mil Kappa 438 Glass Reinforced Hydrocarbon Ceramic Rogers PCB Board Flame Retardant

MOQ:	1PCS
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Details Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-162.V1.0

Base Material:

Glass Reinforced Hydrocarbon Ceramic

Layer Count:

Double Layer, Multilayer, Hybrid PCB

PCB Thicknes:

20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm)

PCB Size:

≤400mm X 500mm

Solder Mask:

Green, Black, Blue, Yellow, Red Etc.

Copper Weight:

0.5oz (17 µm), 1oz (35µm)

Surface Finish:

Bare Copper, HASL, ENIG, OSP Etc..

Highlight:

Hydrocarbon Ceramic Rogers PCB Board

Glass Reinforced Rogers PCB Board

Flame Retardant Rogers PCB Board

Product Description

Rogers PCB Built on Kappa 438 20mil 0.508mm DK 4.38 with Immersion Gold for Carrier Grade WiFi

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers Kappa 438 laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. Kappa 438 laminates also have the UL 94 V-0 flame retardant rating and are lead free solder process compatible.

Kappa 438 laminates offer dielectric constants (Dk) tailored to FR-4 industry standard norms which facilities ease of converting existing FR-4 designs where better electrical performance is needed.

Features

1. Dk of 4.38 is tailored to FR-4 industry standard norms

2. Tighter Dk and thickness tolerance than FR-4

3. High Tg of > 280°C TMA

Benefits

1. Ease of PCB manufacturing and assembly in Line with FR-4

2. Design Dk enables ease of converting existing FR-4 designs needing better electrical performance

3. Consistent circuit performance

4. Improved design flexibility and plated through-hole reliability

5. Automated assembly compatible

Typical Applications:

1. Carrier Grade WiFi/Licensed Assisted Access (LAA)

2. Small Cell and Distributed Antenna Systems (DAS)

3. Vehicle to Vehicle/Vehicle to Infrastructure Communications (V2X)

4. Internet of Things (IoT)

Segments: Smart Home and Wireless Meters

20mil Kappa 438 Glass Reinforced Hydrocarbon Ceramic Rogers PCB Board Flame Retardant 0

Our PCB Capability (Kappa 438)

PCB Material:	Glass Reinforced Hydrocarbon Ceramic
Designation:	Kappa 438
Dielectric constant:	4.38
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm)
PCB thickness:	20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm)
PCB thickness:
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP etc..

20mil Kappa 438 Glass Reinforced Hydrocarbon Ceramic Rogers PCB Board Flame Retardant 2

Data Sheet of Kappa 438 Laminate

Property	Typical Value Kappa 438	Direction	Units	Condition	Test Method
Dielectric Constant, er Design	4.38	Z	-	2.5 GHz	Differential Phase Length Method
Dissipation Factor tan, d	0.005	Z	-	10 GHz/23°C	IPC-TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant e	-21	-	ppm/°C	10 GHz (-50 to 150°C)	Modified IPC-TM-650 2.5.5.5
Volume Resistivity	2.9 x 10⁹	-	MΩ•cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	6.2 x 10⁷	-	MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	675	Z	V/mil	-	IPC-TM-650 2.5.6.2
Tensile Strength	16 12	MD CMD	kpsi	-	ASTM D3039/D3039-14
Flexural Strength	25 19	MD CMD	kpsi	-	IPC-TM-650 2.4.4
Dimensional Stability	-0.48-0.59	MD CMD	mm/m	-	IPC-TM-650 2.4.39a
Coefficient of Thermal Expansion	13	X	ppm/°C	-55 to 288°C	IPC-TM-650 2.4.41
	16	Y
	42	Z
Thermal Conductivity	0.64	Z	W/(m.K)	80°C	ASTM D5470
Time to Delamination (T288)	>60	-	minutes	288°C	IPC-TM-650 2.4.24.1
Tg	>280	-	°C TMA	-	IPC-TM-650 2.4.24.3
Td	414	-	°C	-	IPC-TM-650 2.3.40
Moisture Absorption	0.07	-	%	24/23	IPC-TM-650 2.6.2.1
Young’s Modulus	2264 2098	MD CMD	kpsi	-	ASTM D3039/D3039-14
Flex Modulus	2337 2123	MD CMD	kpsi	-	IPC-TM-650 2.4.4
Bow	0.03	-	%	-	IPC-TM-650 2.4.22C
Twist	0.08	-	%	-	IPC-TM-650 2.4.22C
Copper Peel Strength After Thermal Stress	5.8	-	lbs/in	1 oz (35 µm) foil	IPC-TM-650 2.4.8
Flammability	V-0	-	-	-	UL 94
Specific Gravity	1.99	-	g/cm³	-	ASTM D792
Lead-Free Process Compatible	Yes	-	-	-

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20mil Kappa 438 Glass Reinforced Hydrocarbon Ceramic Rogers PCB Board Flame Retardant

MOQ:	1PCS
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Detail Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-162.V1.0

Base Material:

Glass Reinforced Hydrocarbon Ceramic

Layer Count:

Double Layer, Multilayer, Hybrid PCB

PCB Thicknes:

20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm)

PCB Size:

≤400mm X 500mm

Solder Mask:

Green, Black, Blue, Yellow, Red Etc.

Copper Weight:

0.5oz (17 µm), 1oz (35µm)

Surface Finish:

Bare Copper, HASL, ENIG, OSP Etc..

Minimum Order Quantity:

1PCS

Packaging Details:

Vacuum bags+Cartons

Delivery Time:

8-9 working days

Payment Terms:

T/T

Supply Ability:

5000PCS per month

Highlight

Hydrocarbon Ceramic Rogers PCB Board

Glass Reinforced Rogers PCB Board

Flame Retardant Rogers PCB Board

Product Description

Rogers PCB Built on Kappa 438 20mil 0.508mm DK 4.38 with Immersion Gold for Carrier Grade WiFi

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Kappa 438 laminates offer dielectric constants (Dk) tailored to FR-4 industry standard norms which facilities ease of converting existing FR-4 designs where better electrical performance is needed.

Features

1. Dk of 4.38 is tailored to FR-4 industry standard norms

2. Tighter Dk and thickness tolerance than FR-4

3. High Tg of > 280°C TMA

Benefits

1. Ease of PCB manufacturing and assembly in Line with FR-4

2. Design Dk enables ease of converting existing FR-4 designs needing better electrical performance

3. Consistent circuit performance

4. Improved design flexibility and plated through-hole reliability

5. Automated assembly compatible

Typical Applications:

1. Carrier Grade WiFi/Licensed Assisted Access (LAA)

2. Small Cell and Distributed Antenna Systems (DAS)

3. Vehicle to Vehicle/Vehicle to Infrastructure Communications (V2X)

4. Internet of Things (IoT)

Segments: Smart Home and Wireless Meters

20mil Kappa 438 Glass Reinforced Hydrocarbon Ceramic Rogers PCB Board Flame Retardant 0

Our PCB Capability (Kappa 438)

PCB Material:	Glass Reinforced Hydrocarbon Ceramic
Designation:	Kappa 438
Dielectric constant:	4.38
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm)
PCB thickness:	20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm)
PCB thickness:
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP etc..

20mil Kappa 438 Glass Reinforced Hydrocarbon Ceramic Rogers PCB Board Flame Retardant 2

Data Sheet of Kappa 438 Laminate

Property	Typical Value Kappa 438	Direction	Units	Condition	Test Method
Dielectric Constant, er Design	4.38	Z	-	2.5 GHz	Differential Phase Length Method
Dissipation Factor tan, d	0.005	Z	-	10 GHz/23°C	IPC-TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant e	-21	-	ppm/°C	10 GHz (-50 to 150°C)	Modified IPC-TM-650 2.5.5.5
Volume Resistivity	2.9 x 10⁹	-	MΩ•cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	6.2 x 10⁷	-	MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	675	Z	V/mil	-	IPC-TM-650 2.5.6.2
Tensile Strength	16 12	MD CMD	kpsi	-	ASTM D3039/D3039-14
Flexural Strength	25 19	MD CMD	kpsi	-	IPC-TM-650 2.4.4
Dimensional Stability	-0.48-0.59	MD CMD	mm/m	-	IPC-TM-650 2.4.39a
Coefficient of Thermal Expansion	13	X	ppm/°C	-55 to 288°C	IPC-TM-650 2.4.41
	16	Y
	42	Z
Thermal Conductivity	0.64	Z	W/(m.K)	80°C	ASTM D5470
Time to Delamination (T288)	>60	-	minutes	288°C	IPC-TM-650 2.4.24.1
Tg	>280	-	°C TMA	-	IPC-TM-650 2.4.24.3
Td	414	-	°C	-	IPC-TM-650 2.3.40
Moisture Absorption	0.07	-	%	24/23	IPC-TM-650 2.6.2.1
Young’s Modulus	2264 2098	MD CMD	kpsi	-	ASTM D3039/D3039-14
Flex Modulus	2337 2123	MD CMD	kpsi	-	IPC-TM-650 2.4.4
Bow	0.03	-	%	-	IPC-TM-650 2.4.22C
Twist	0.08	-	%	-	IPC-TM-650 2.4.22C
Copper Peel Strength After Thermal Stress	5.8	-	lbs/in	1 oz (35 µm) foil	IPC-TM-650 2.4.8
Flammability	V-0	-	-	-	UL 94
Specific Gravity	1.99	-	g/cm³	-	ASTM D792
Lead-Free Process Compatible	Yes	-	-	-

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