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Rogers 3203 Dual Layer Pcb 10mil High Frequency For Direct Broadcast Satellites

Rogers 3203 Dual Layer Pcb 10mil High Frequency For Direct Broadcast Satellites

MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-121.V1.0
Base Material:
Ceramic-filled Laminates Reinforced With Woven Fiberglass
Layer Count:
Double Layer, Multilayer, Hybrid PCB
PCB Thickness:
10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish:
Bare Copper, HASL, ENIG, OSP Etc..
Highlight:

Rogers 3203 Dual Layer Pcb

,

10mil Dual Layer Pcb

,

UL Ceramic Filled Dual Layer Pcb

Product Description

 

Rogers RO3203 Double Sided 10mil High Frequency PCB With immersion Gold For Direct Broadcast Satellites

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RO3203 High Frequency Circuit Materials of Rogers Corporation are ceramic-filled laminates reinforced with woven fiberglass. This material is engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The dielectric constant of RO3203 High Frequency Circuit Materials is 3.02. This, along with a dissipation factor of 0.0016, extends the useful frequency range beyond 40 GHz.

 

RO3203 laminates combine the surface smoothness of a non-woven PTFE laminate, for finer line etching tolerances, with the rigidity of a woven-glass PTFE laminate. These materials can be fabricated into printed circuit boards using standard PTFE circuit board processing techniques. Available cladding options are 0.5, 1 or 2 oz./ft2 (17, 35, 70 micron thick) electrodeposited copper foil. These laminates are manufactured under an ISO 9002 certified quality system.

 

Features:

1. Uniform electrical and mechanical performance is ideal for complex multilayer high frequency structures.

2. Low dielectric loss for high frequency performance can be used in applications exceeding 20 GHz.4. Excellent mechanical properties over a wide range of dielectric constants are ideal for multilayer board designs.

3. Low in-plane expansion coefficient (matched to copper) is suitable for use with epoxy glass multilayer board hybrid designs and reliable surface mounted assemblies.

4. Economically priced for volume manufacturing.

 

Typical Applications:

1. Automotive Global Positioning Satellite Antennas

2. Datalink on Cable Systems

3. Direct Broadcast Satellites

4. Power Backplanes

5. Wireless Telecommunications Systems

 

Rogers 3203 Dual Layer Pcb 10mil High Frequency For Direct Broadcast Satellites 0

 

PCB Capability (RO3203)

PCB Material: Ceramic-filled Laminates Reinforced with Woven Fiberglass
Designation: RO3203
Dielectric constant: 3.02±0.04
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 

Data Sheet of RO3203

RO3203 Typical Value
Property RO3203 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.02±0.04 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Dissipation Factor,tanδ 0.0016 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Conductivity 0.47 (3.2)   W/mK Float 100℃ ASTM C518
Volume Resistivity 107   MΩ.cm A ASTM D257
Surface Resistivity 107   A ASTM D257
Dimensional Stability 0.08 X, Y mm/m +E2/150 after etch IPC-TM-650 2.4.3.9
Tensile Modulus   X Y kpsi RT ASTM D638
Flexural Modulus 400 300 X Y kpsi A ASTM D790
Tensile Strength 12.5 13 X Y kpsi RT ASTM D638
Flexural Strength 9 8 X Y kpsi A ASTM D790
Moisure Absorption <0.1   % D24/23 IPC-TM-650 2.6.2.1
Coefficient of Thermal Expansion 58 13 Z X,Y ppm/℃ -50 ℃to 288℃ ASTM D3386
Td 500   TGA ASTM D3850
Density 2.1   gm/cm3 23℃ ASTM D792
Copper Peel Stength 10 (1.74)   lbs/in (N/mm) After solder IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-Free Process Compatible Yes        

 

products
PRODUCTS DETAILS
Rogers 3203 Dual Layer Pcb 10mil High Frequency For Direct Broadcast Satellites
MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-121.V1.0
Base Material:
Ceramic-filled Laminates Reinforced With Woven Fiberglass
Layer Count:
Double Layer, Multilayer, Hybrid PCB
PCB Thickness:
10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish:
Bare Copper, HASL, ENIG, OSP Etc..
Minimum Order Quantity:
1PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Rogers 3203 Dual Layer Pcb

,

10mil Dual Layer Pcb

,

UL Ceramic Filled Dual Layer Pcb

Product Description

 

Rogers RO3203 Double Sided 10mil High Frequency PCB With immersion Gold For Direct Broadcast Satellites

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RO3203 High Frequency Circuit Materials of Rogers Corporation are ceramic-filled laminates reinforced with woven fiberglass. This material is engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The dielectric constant of RO3203 High Frequency Circuit Materials is 3.02. This, along with a dissipation factor of 0.0016, extends the useful frequency range beyond 40 GHz.

 

RO3203 laminates combine the surface smoothness of a non-woven PTFE laminate, for finer line etching tolerances, with the rigidity of a woven-glass PTFE laminate. These materials can be fabricated into printed circuit boards using standard PTFE circuit board processing techniques. Available cladding options are 0.5, 1 or 2 oz./ft2 (17, 35, 70 micron thick) electrodeposited copper foil. These laminates are manufactured under an ISO 9002 certified quality system.

 

Features:

1. Uniform electrical and mechanical performance is ideal for complex multilayer high frequency structures.

2. Low dielectric loss for high frequency performance can be used in applications exceeding 20 GHz.4. Excellent mechanical properties over a wide range of dielectric constants are ideal for multilayer board designs.

3. Low in-plane expansion coefficient (matched to copper) is suitable for use with epoxy glass multilayer board hybrid designs and reliable surface mounted assemblies.

4. Economically priced for volume manufacturing.

 

Typical Applications:

1. Automotive Global Positioning Satellite Antennas

2. Datalink on Cable Systems

3. Direct Broadcast Satellites

4. Power Backplanes

5. Wireless Telecommunications Systems

 

Rogers 3203 Dual Layer Pcb 10mil High Frequency For Direct Broadcast Satellites 0

 

PCB Capability (RO3203)

PCB Material: Ceramic-filled Laminates Reinforced with Woven Fiberglass
Designation: RO3203
Dielectric constant: 3.02±0.04
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 

Data Sheet of RO3203

RO3203 Typical Value
Property RO3203 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.02±0.04 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Dissipation Factor,tanδ 0.0016 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Conductivity 0.47 (3.2)   W/mK Float 100℃ ASTM C518
Volume Resistivity 107   MΩ.cm A ASTM D257
Surface Resistivity 107   A ASTM D257
Dimensional Stability 0.08 X, Y mm/m +E2/150 after etch IPC-TM-650 2.4.3.9
Tensile Modulus   X Y kpsi RT ASTM D638
Flexural Modulus 400 300 X Y kpsi A ASTM D790
Tensile Strength 12.5 13 X Y kpsi RT ASTM D638
Flexural Strength 9 8 X Y kpsi A ASTM D790
Moisure Absorption <0.1   % D24/23 IPC-TM-650 2.6.2.1
Coefficient of Thermal Expansion 58 13 Z X,Y ppm/℃ -50 ℃to 288℃ ASTM D3386
Td 500   TGA ASTM D3850
Density 2.1   gm/cm3 23℃ ASTM D792
Copper Peel Stength 10 (1.74)   lbs/in (N/mm) After solder IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-Free Process Compatible Yes        

 

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