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High Frequency 8mil RO4360G2 Rogers PCB Board For Small Cell Transceivers

High Frequency 8mil RO4360G2 Rogers PCB Board For Small Cell Transceivers

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-120.V1.0
Base Material:
Hydrocarbon Ceramic-filled Thermoset Materials
Layer Count:
Double Layer, Multilayer, Hybrid PCB
PCB Thickness:
8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish:
Bare Copper, HASL, ENIG, OSP Etc..
Highlight:

8mil Rogers PCB Board

,

RO4360G2 Rogers PCB Board

,

8mil High Frequency PCB

Product Description

 

Rogers RO4360G2 6-layer High Frequency PCB Based on 8mil Core With Immersion Gold for Small Cell Transceivers

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RO4360G2 laminates of Rogers Corporation are 6.15 Dk, low loss, glass-reinforced, hydrocarbon ceramic-filled thermoset materials that provide the ideal balance of performance and processing ease. RO4360G2 laminates extend Rogers' portfolio of high performance materials by providing customers with a product that is lead-free process capable and offers better rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs.

 

RO4360G2 laminates process similar to FR-4 and are automated assembly compatible. They have a low Z-axis CTE for design flexibility and have the same high Tg as all of the RO4000 product line. RO4360G2 laminates can be paired with RO4450F prepreg and lower-Dk RO4000 laminate in multi-layer designs.

 

RO4360G2 laminates, with a Dk of 6.15 (Design Dk 6.4), allow designers to reduce circuit dimensions in applications where size and cost are critical. They are the best value choice for engineers working on designs including power amplifiers, patch antennas, ground-based radar, and other general RF applications.

 

Features and benefits:

1. Thermoset resin system specially formulated to meet 6.15 Dk

1) Ease of fabrication / processes similar to FR-4

2) Material repeatability

3) Low loss

4) High thermal conductivity

5) Lower total PCB cost solution than competing PTFE products,

 

2. Low Z-axis CTE / High Tg

1) Design flexibility

2) Plated through-hole reliability

3) Automated assembly compatible

 

3. Environmentally friendly

1) Lead free process compatible

 

4. Regional finished goods inventory

1) Short lead times / quick inventory turns

2) Efficient supply chain

 

Some Typical Applications:

1. Base Station Power Amplifiers

2. Small Cell Transceivers

3. Patch antennas

4. Ground-based Radar

 

High Frequency 8mil RO4360G2 Rogers PCB Board For Small Cell Transceivers 0

 

PCB Capability

PCB Material: Hydrocarbon Ceramic-filled Thermoset Materials
Designation: RO4360G2
Dielectric constant: 6.15 ±0.15
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 

Stack up

High Frequency 8mil RO4360G2 Rogers PCB Board For Small Cell Transceivers 1

 

Data Sheet of RO4360G2

RO4360G2 Typical Value
Property RO4360G2 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.15 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
2.5 GHz/23℃
Dissipation Factor,tanδ 0.0038 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Conductivity 0.75   W/mK 50℃ ASTM D-5470
Volume Resistivity 4.0 X 1013   Ω.cm Elevated T IPC-TM-650 2.5.17.1
Surface Resistivity 9.0 X 1012   Ω Elevated T IPC-TM-650 2.5.17.1
Electrical Strength 784 Z V/mil   IPC-TM-650 2.5.6.2
Tensile Strength 131 (19) 97(14) X Y MPa (kpsi) 40 hrs 50%RH/23 ASTM D638
Flexural Strength 213(31) 145(21) X Y Mpa (kpsi) 40 hrs 50%RH/23 IPC-TM-650, 2.4.4
Coefficient of Thermal Expansion 13 14 28 X Y Z ppm/℃ -50 ℃to 288℃ After Replicated Heat Cycle IPC-TM-650, 2.1.41
Tg >280   ℃ TMA   IPC-TM-650 2.4.24.3
Td 407     ASTM D3850 using TGA
T288 >30 Z min 30 min / 125℃ Prebake IPC-TM-650 2.2.24.1
Moisure Absorption 0.08   % 50℃/48hr IPC-TM-650 2.6.2.1 ASTM D570
Thermal Coefficient of er -131 @10 GHz Z ppm/℃ -50℃ to 150 ℃ IPC-TM-650, 2.5.5.5
Density 2.16   gm/cm3 RT ASTM D792
Copper Peel Stength 5.2 (0.91)   pli (N/mm) Condtion B IPC-TM-650 2.4.8
Flammability V-0       UL 94 File QMTS2. E102765

 

High Frequency 8mil RO4360G2 Rogers PCB Board For Small Cell Transceivers 2

 

products
PRODUCTS DETAILS
High Frequency 8mil RO4360G2 Rogers PCB Board For Small Cell Transceivers
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-120.V1.0
Base Material:
Hydrocarbon Ceramic-filled Thermoset Materials
Layer Count:
Double Layer, Multilayer, Hybrid PCB
PCB Thickness:
8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish:
Bare Copper, HASL, ENIG, OSP Etc..
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

8mil Rogers PCB Board

,

RO4360G2 Rogers PCB Board

,

8mil High Frequency PCB

Product Description

 

Rogers RO4360G2 6-layer High Frequency PCB Based on 8mil Core With Immersion Gold for Small Cell Transceivers

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RO4360G2 laminates of Rogers Corporation are 6.15 Dk, low loss, glass-reinforced, hydrocarbon ceramic-filled thermoset materials that provide the ideal balance of performance and processing ease. RO4360G2 laminates extend Rogers' portfolio of high performance materials by providing customers with a product that is lead-free process capable and offers better rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs.

 

RO4360G2 laminates process similar to FR-4 and are automated assembly compatible. They have a low Z-axis CTE for design flexibility and have the same high Tg as all of the RO4000 product line. RO4360G2 laminates can be paired with RO4450F prepreg and lower-Dk RO4000 laminate in multi-layer designs.

 

RO4360G2 laminates, with a Dk of 6.15 (Design Dk 6.4), allow designers to reduce circuit dimensions in applications where size and cost are critical. They are the best value choice for engineers working on designs including power amplifiers, patch antennas, ground-based radar, and other general RF applications.

 

Features and benefits:

1. Thermoset resin system specially formulated to meet 6.15 Dk

1) Ease of fabrication / processes similar to FR-4

2) Material repeatability

3) Low loss

4) High thermal conductivity

5) Lower total PCB cost solution than competing PTFE products,

 

2. Low Z-axis CTE / High Tg

1) Design flexibility

2) Plated through-hole reliability

3) Automated assembly compatible

 

3. Environmentally friendly

1) Lead free process compatible

 

4. Regional finished goods inventory

1) Short lead times / quick inventory turns

2) Efficient supply chain

 

Some Typical Applications:

1. Base Station Power Amplifiers

2. Small Cell Transceivers

3. Patch antennas

4. Ground-based Radar

 

High Frequency 8mil RO4360G2 Rogers PCB Board For Small Cell Transceivers 0

 

PCB Capability

PCB Material: Hydrocarbon Ceramic-filled Thermoset Materials
Designation: RO4360G2
Dielectric constant: 6.15 ±0.15
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 

Stack up

High Frequency 8mil RO4360G2 Rogers PCB Board For Small Cell Transceivers 1

 

Data Sheet of RO4360G2

RO4360G2 Typical Value
Property RO4360G2 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.15 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
2.5 GHz/23℃
Dissipation Factor,tanδ 0.0038 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Conductivity 0.75   W/mK 50℃ ASTM D-5470
Volume Resistivity 4.0 X 1013   Ω.cm Elevated T IPC-TM-650 2.5.17.1
Surface Resistivity 9.0 X 1012   Ω Elevated T IPC-TM-650 2.5.17.1
Electrical Strength 784 Z V/mil   IPC-TM-650 2.5.6.2
Tensile Strength 131 (19) 97(14) X Y MPa (kpsi) 40 hrs 50%RH/23 ASTM D638
Flexural Strength 213(31) 145(21) X Y Mpa (kpsi) 40 hrs 50%RH/23 IPC-TM-650, 2.4.4
Coefficient of Thermal Expansion 13 14 28 X Y Z ppm/℃ -50 ℃to 288℃ After Replicated Heat Cycle IPC-TM-650, 2.1.41
Tg >280   ℃ TMA   IPC-TM-650 2.4.24.3
Td 407     ASTM D3850 using TGA
T288 >30 Z min 30 min / 125℃ Prebake IPC-TM-650 2.2.24.1
Moisure Absorption 0.08   % 50℃/48hr IPC-TM-650 2.6.2.1 ASTM D570
Thermal Coefficient of er -131 @10 GHz Z ppm/℃ -50℃ to 150 ℃ IPC-TM-650, 2.5.5.5
Density 2.16   gm/cm3 RT ASTM D792
Copper Peel Stength 5.2 (0.91)   pli (N/mm) Condtion B IPC-TM-650 2.4.8
Flammability V-0       UL 94 File QMTS2. E102765

 

High Frequency 8mil RO4360G2 Rogers PCB Board For Small Cell Transceivers 2

 

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