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Metal Based High Frequency PCB Built on 3.0mm PTFE 1.0oz with Immersion Gold for Radio Device

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Metal Based High Frequency PCB Built on 3.0mm PTFE 1.0oz with Immersion Gold for Radio Device

Metal Based High Frequency PCB Built on 3.0mm PTFE 1.0oz with Immersion Gold for Radio Device
Metal Based High Frequency PCB Built on 3.0mm PTFE 1.0oz with Immersion Gold for Radio Device Metal Based High Frequency PCB Built on 3.0mm PTFE 1.0oz with Immersion Gold for Radio Device

Large Image :  Metal Based High Frequency PCB Built on 3.0mm PTFE 1.0oz with Immersion Gold for Radio Device

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-107.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: Aluminum Layer Count: Single Side
PCB Thickness: 1.2mm - 9.0mm PCB Size: ≤400mm X 500mm
Solder Mask: Green, Red, Black, White, Blue Etc. Copper Weight: 0.5oz, 1oz
Surface Finish: Bare Copper, HASL, ENIG, Immersion Tin Etc.
High Light:

3.0mm Teflon PCB Board

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Radio Device Teflon PCB Board

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3.0mm PCB Circuit Board

 

Metal Based High Frequency PCB Built on 3.0mm PTFE 1.0oz with Immersion Gold for Radio Device

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Metal based substrate is a combination of metal based high frequency materials. The intermediate medium is made of high frequency materials (such as PTFE and others), one side is coated with copper foil, the other side is coated with copper base or aluminum base. The PCB made on this kind of modified material, we can call it metal based high frequency PCB.

 

Parameters

DK @ 10GHz & Tolerance: 2.20+/- 0.03

Thermal Change of DK (ppm/℃) : -48

Loss Tangent, Df@10GHz: 0.001

Thermal Conductivity(W/mk): 0.35

Td (℃): 476

Coefficient of Thermal Expansion -50℃ -260 ℃: X 40; Y45; Z98

Density (g/cm3): 1.80

Volume Resisivity (Mohm.cm) 1x 10^8

Surface Resistivity (Mohm): 1 x 10^8

Moisture Absorption: 0.02

Peel Strength (N/cm) (1oz): 20

Flammability Rating: UL94 V0

Type of Metal Base: Aluminum, Copper

Thickness of Metal Base: 1.0mm, 2.0mm, 3.0mm, 4.0mm

Base copper: 0.5oz, 1oz

 

Modified woven fabric glass Teflon (PTFE) copper clad laminates with ceramic filler

Designator of Substrate Material Composition / Dielectric Layer Types DK @ 10GHz & Tolerance Thermal Change of Dk(ppm/℃) Loss Tangent, Df@10GHz Thermal Conductivity(W/mk) Td (℃) Coefficient of Thermal Expansion -50℃ -260 ℃ (ppm/℃) Density (g/cm3): Volume Resisivity (Mohm.cm) Surface Resistivity (Mohm) Moisture Absorption (%) Peel Strength (N/cm) (1oz) Flammability Rating
X Y Z
F4BTMS PTFE/Ceramic/Superfine woven glass F4BTMS220 2.20±0.03 -48 0.0010 0.35 476 40 45 98 1.80 1X108 1X108 0.02 20 V-0
F4BTMS294 2.94±0.04 -20 0.0012 0.58 490 10 12 22 2.25 1X108 1X108 0.03 12 V-0
F4BTMS300 3.00±0.04 -20 0.0013 0.58 490 10 11 22 2.28 1X108 1X108 0.04 12 V-0

 

Thickness and size F4BTMS

Designator of Substrate Standard Dielectric Thickness(Without the cladding) and Tolerance Available Copper Foil Standard Size
F4BTMS 0.127mm(5mil) ±0.0127mm(0.5mil) 0.254mm(10mil) ±0.02mm(1mil) 0.508mm(20mil) ±0.03mm(1.19mil) 0.762mm(30mil) ±0.04mm(1.58mil) 1.016mm(40mil) ±0.05mm(2mil) 1.524mm(60mil) ±0.05mm(2mil) 3.05mm(120mil) ±0.1mm(4mil) 5.08mm(200mil) ±0.127mm(5mil) Non-standard thickness is increased by 0.254mm(10mil). Over 6.1mm(240mil), please contact us. 0.5oz, 1oz, ED Copper, RTF Copper, HVLP Copper, RA Copper, 50ῼ Resistance Copper 305mm x 460mm (12" x 18") 460mm x 610mm (18" x 24") 500mm x 600mm (19.7" x 23.6") 915mm x 1220mm (36" x 48")

 

Metal Based High Frequency PCB Built on 3.0mm PTFE 1.0oz with Immersion Gold for Radio Device 0

 

PCB Capability
PCB Material: Modified PTFE Copper Clad with Ceramic Filler
Designator: F4BTMS220
Dielectric constant @ 10GHz: 2.2
Layer count: Single Layer
Copper weight: 0.5oz, 1oz
PCB thickness: 1.2mm - 9.0mm
0.047” - 0.354”
Solder mask: Green, Red, Black, White, Blue etc.
PCB size: ≤400mm X 500mm
Surface finish: Bare copper, HASL, ENIG, Immersion tin etc.

 

Metal Based High Frequency PCB Built on 3.0mm PTFE 1.0oz with Immersion Gold for Radio Device 1

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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