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Metal Based High Frequency PCB Built on 3.0mm PTFE 1.0oz with Immersion Gold for Radio Device

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Ms. Ivy Deng

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Metal Based High Frequency PCB Built on 3.0mm PTFE 1.0oz with Immersion Gold for Radio Device

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Details Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-107.V1.0

Base Material:

Aluminum

Layer Count:

Single Side

PCB Thickness:

1.2mm - 9.0mm

PCB Size:

≤400mm X 500mm

Solder Mask:

Green, Red, Black, White, Blue Etc.

Copper Weight:

0.5oz, 1oz

Surface Finish:

Bare Copper, HASL, ENIG, Immersion Tin Etc.

Highlight:

3.0mm Teflon PCB Board

Radio Device Teflon PCB Board

3.0mm PCB Circuit Board

Product Description

Metal Based High Frequency PCB Built on 3.0mm PTFE 1.0oz with Immersion Gold for Radio Device

(PCB's are custom-made products, the picture and parameters shown are just for reference)

Metal based substrate is a combination of metal based high frequency materials. The intermediate medium is made of high frequency materials (such as PTFE and others), one side is coated with copper foil, the other side is coated with copper base or aluminum base. The PCB made on this kind of modified material, we can call it metal based high frequency PCB.

Parameters

DK @ 10GHz & Tolerance: 2.20+/- 0.03

Thermal Change of DK (ppm/℃) : -48

Loss Tangent, Df@10GHz: 0.001

Thermal Conductivity(W/mk): 0.35

Td (℃): 476

Coefficient of Thermal Expansion -50℃ -260 ℃: X 40; Y45; Z98

Density (g/cm³): 1.80

Volume Resisivity (Mohm.cm) 1x 10^8

Surface Resistivity (Mohm): 1 x 10^8

Moisture Absorption: 0.02

Peel Strength (N/cm) (1oz): 20

Flammability Rating: UL94 V0

Type of Metal Base: Aluminum, Copper

Thickness of Metal Base: 1.0mm, 2.0mm, 3.0mm, 4.0mm

Base copper: 0.5oz, 1oz

Modified woven fabric glass Teflon (PTFE) copper clad laminates with ceramic filler

Designator of Substrate

Material Composition / Dielectric Layer

Types

DK @ 10GHz & Tolerance

Thermal Change of Dk(ppm/℃)

Loss Tangent, Df@10GHz

Thermal Conductivity(W/mk)

Td (℃)

Coefficient of Thermal Expansion -50℃ -260 ℃ (ppm/℃)

Density (g/cm³):

Volume Resisivity (Mohm.cm)

Surface Resistivity (Mohm)

Moisture Absorption (%)

Peel Strength (N/cm) (1oz)

Flammability Rating

F4BTMS

PTFE/Ceramic/Superfine woven glass

F4BTMS220

2.20±0.03

-48

0.0010

0.35

476

1.80

1X10⁸

0.02

V-0

F4BTMS294

2.94±0.04

-20

0.0012

0.58

490

2.25

1X10⁸

0.03

V-0

F4BTMS300

3.00±0.04

-20

0.0013

0.58

490

2.28

1X10⁸

0.04

V-0

Thickness and size F4BTMS

Designator of Substrate	Standard Dielectric Thickness(Without the cladding) and Tolerance		Available Copper Foil	Standard Size
F4BTMS	0.127mm(5mil) ±0.0127mm(0.5mil) 0.254mm(10mil) ±0.02mm(1mil) 0.508mm(20mil) ±0.03mm(1.19mil) 0.762mm(30mil) ±0.04mm(1.58mil) 1.016mm(40mil) ±0.05mm(2mil) 1.524mm(60mil) ±0.05mm(2mil) 3.05mm(120mil) ±0.1mm(4mil) 5.08mm(200mil) ±0.127mm(5mil)	Non-standard thickness is increased by 0.254mm(10mil). Over 6.1mm(240mil), please contact us.	0.5oz, 1oz, ED Copper, RTF Copper, HVLP Copper, RA Copper, 50ῼ Resistance Copper	305mm x 460mm (12" x 18") 460mm x 610mm (18" x 24") 500mm x 600mm (19.7" x 23.6") 915mm x 1220mm (36" x 48")

Metal Based High Frequency PCB Built on 3.0mm PTFE 1.0oz with Immersion Gold for Radio Device 0

PCB Capability
PCB Material:	Modified PTFE Copper Clad with Ceramic Filler
Designator:	F4BTMS220
Dielectric constant @ 10GHz:	2.2
Dielectric constant @ 10GHz:	2.2
Layer count:	Single Layer
Copper weight:	0.5oz, 1oz
PCB thickness:	1.2mm - 9.0mm
PCB thickness:	0.047” - 0.354”
Solder mask:	Green, Red, Black, White, Blue etc.
PCB size:	≤400mm X 500mm
Surface finish:	Bare copper, HASL, ENIG, Immersion tin etc.

Metal Based High Frequency PCB Built on 3.0mm PTFE 1.0oz with Immersion Gold for Radio Device 1

Tags:

Products

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Detail Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-107.V1.0

Base Material:

Aluminum

Layer Count:

Single Side

PCB Thickness:

1.2mm - 9.0mm

PCB Size:

≤400mm X 500mm

Solder Mask:

Green, Red, Black, White, Blue Etc.

Copper Weight:

0.5oz, 1oz

Surface Finish:

Bare Copper, HASL, ENIG, Immersion Tin Etc.

Minimum Order Quantity:

1PCS

Price:

USD9.99-99.99

Packaging Details:

Vacuum bags+Cartons

Delivery Time:

8-9 working days

Payment Terms:

T/T

Supply Ability:

5000PCS per month

Highlight

3.0mm Teflon PCB Board

Radio Device Teflon PCB Board

3.0mm PCB Circuit Board

Product Description

Metal Based High Frequency PCB Built on 3.0mm PTFE 1.0oz with Immersion Gold for Radio Device

(PCB's are custom-made products, the picture and parameters shown are just for reference)

Parameters

DK @ 10GHz & Tolerance: 2.20+/- 0.03

Thermal Change of DK (ppm/℃) : -48

Loss Tangent, Df@10GHz: 0.001

Thermal Conductivity(W/mk): 0.35

Td (℃): 476

Coefficient of Thermal Expansion -50℃ -260 ℃: X 40; Y45; Z98

Density (g/cm³): 1.80

Volume Resisivity (Mohm.cm) 1x 10^8

Surface Resistivity (Mohm): 1 x 10^8

Moisture Absorption: 0.02

Peel Strength (N/cm) (1oz): 20

Flammability Rating: UL94 V0

Type of Metal Base: Aluminum, Copper

Thickness of Metal Base: 1.0mm, 2.0mm, 3.0mm, 4.0mm

Base copper: 0.5oz, 1oz

Modified woven fabric glass Teflon (PTFE) copper clad laminates with ceramic filler

Designator of Substrate

Material Composition / Dielectric Layer

Types

DK @ 10GHz & Tolerance

Thermal Change of Dk(ppm/℃)

Loss Tangent, Df@10GHz

Thermal Conductivity(W/mk)

Td (℃)

Coefficient of Thermal Expansion -50℃ -260 ℃ (ppm/℃)

Density (g/cm³):

Volume Resisivity (Mohm.cm)

Surface Resistivity (Mohm)

Moisture Absorption (%)

Peel Strength (N/cm) (1oz)

Flammability Rating

F4BTMS

PTFE/Ceramic/Superfine woven glass

F4BTMS220

2.20±0.03

-48

0.0010

0.35

476

1.80

1X10⁸

0.02

V-0

F4BTMS294

2.94±0.04

-20

0.0012

0.58

490

2.25

1X10⁸

0.03

V-0

F4BTMS300

3.00±0.04

-20

0.0013

0.58

490

2.28

1X10⁸

0.04

V-0

Thickness and size F4BTMS

Designator of Substrate	Standard Dielectric Thickness(Without the cladding) and Tolerance		Available Copper Foil	Standard Size
F4BTMS	0.127mm(5mil) ±0.0127mm(0.5mil) 0.254mm(10mil) ±0.02mm(1mil) 0.508mm(20mil) ±0.03mm(1.19mil) 0.762mm(30mil) ±0.04mm(1.58mil) 1.016mm(40mil) ±0.05mm(2mil) 1.524mm(60mil) ±0.05mm(2mil) 3.05mm(120mil) ±0.1mm(4mil) 5.08mm(200mil) ±0.127mm(5mil)	Non-standard thickness is increased by 0.254mm(10mil). Over 6.1mm(240mil), please contact us.	0.5oz, 1oz, ED Copper, RTF Copper, HVLP Copper, RA Copper, 50ῼ Resistance Copper	305mm x 460mm (12" x 18") 460mm x 610mm (18" x 24") 500mm x 600mm (19.7" x 23.6") 915mm x 1220mm (36" x 48")

Metal Based High Frequency PCB Built on 3.0mm PTFE 1.0oz with Immersion Gold for Radio Device 0

PCB Capability
PCB Material:	Modified PTFE Copper Clad with Ceramic Filler
Designator:	F4BTMS220
Dielectric constant @ 10GHz:	2.2
Dielectric constant @ 10GHz:	2.2
Layer count:	Single Layer
Copper weight:	0.5oz, 1oz
PCB thickness:	1.2mm - 9.0mm
PCB thickness:	0.047” - 0.354”
Solder mask:	Green, Red, Black, White, Blue etc.
PCB size:	≤400mm X 500mm
Surface finish:	Bare copper, HASL, ENIG, Immersion tin etc.

Metal Based High Frequency PCB Built on 3.0mm PTFE 1.0oz with Immersion Gold for Radio Device 1

Tags:

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

Metal Based High Frequency PCB Built on 3.0mm PTFE 1.0oz with Immersion Gold for Radio Device

3.0mm Teflon PCB Board

Radio Device Teflon PCB Board

3.0mm PCB Circuit Board

3.0mm Teflon PCB Board,

1.5mm Teflon PCB Board,

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

3.0mm Teflon PCB Board

Radio Device Teflon PCB Board

3.0mm PCB Circuit Board

3.0mm Teflon PCB Board,

1.5mm Teflon PCB Board,