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Rogers RT/Duroid 6006 High Frequency PCB With Green Solder Mask

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Rogers RT/Duroid 6006 High Frequency PCB With Green Solder Mask

Rogers RT/Duroid 6006 High Frequency PCB With Green Solder Mask
Rogers RT/Duroid 6006 High Frequency PCB With Green Solder Mask Rogers RT/Duroid 6006 High Frequency PCB With Green Solder Mask Rogers RT/Duroid 6006 High Frequency PCB With Green Solder Mask

Large Image :  Rogers RT/Duroid 6006 High Frequency PCB With Green Solder Mask

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-062.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: Ceramic-PTFE Composite Layer Count: 1 Layer, 2 Layer
PCB Thickness: 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.90mm) PCB Size: ≤400mm X 500mm
Solder Mask: Green, Black, Blue, Yellow, Red Etc. Copper Weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish: Bare Copper, HASL, ENIG, Immersion Tin, OSP.
High Light:

Duroid 6006 High Frequency PCB

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Rogers RT High Frequency PCB

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Solder Mask High Frequency PCB

 

 Rogers RT/Duroid 6006 High Frequency PCB

 

Rogers RT/duroid 6006 microwave laminates are ceramic-PTFE composites which are designed for electronic and microwave circuit applications requiring a high dielectric constant. RT/duroid 6006 laminate is available with a dielectric constant value of 6.15.

 

Rogers RT/Duroid 6006 High Frequency PCB With Green Solder Mask 0

 

RT/duroid 6006 microwave laminates feature ease of fabrication and stability in use. This property results in the possibility of mass production and reducing the cost of goods. It has tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.

 

Rogers RT/Duroid 6006 High Frequency PCB With Green Solder Mask 1

 

Rogers RT/Duroid 6006 High Frequency PCB With Green Solder Mask 2

 

The typical applications are aircraft collision avoidance systems, ground radar warning systems, patch antennas, satellite communications systems etc.

 

RT/duroid 6006 Typical Value
Property RT/duroid 6006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.15 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped stripline
Dielectric Constant,εDesign 6.45 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0027 Z   10 GHz/A IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -410 Z ppm/℃ -50℃-170℃ IPC-TM-650 2.5.5.5
Volume Resistivity 7 x 107   Mohm.cm A IPC 2.5.17.1
Surface Resistivity 2 x 107   Mohm A IPC 2.5.17.1
Tensile Properties ASTM D638 (0.1/min. strain rate)
Young's Modulus 627(91) 517(75) X Y MPa(kpsi) A
Ultimate Stress 20(2.8) 17(2.5) X Y MPa(kpsi) A
Ultimate Strain 12 to 13 4 to 6 X Y % A
Compressive Properties   ASTM D695 (0.05/min. strain rate)
Young's Modulus 1069 (115) Z MPa(kpsi) A
Ultimate Stress 54(7.9) Z MPa(kpsi) A
Ultimate Strain 33 Z %  
Flexural Modulus 2634 (382) 1951 (283) X MPa(kpsi) A ASTM D790
Ultimate Stress 38 (5.5) X Y MPa(kpsi) A
Deformation under load 0.33 2.1 Z Z % 24hr/50℃/7MPa 24hr/150℃/7MPa ASTM D261
Moisture Absorption 0.05   % D48/50℃ 0.050"(1.27mm) thick IPC-TM-650 2.6.2.1
Thermal Conductivity 0.49   W/m/k 80℃ ASTM C518
Coefficient of Thermal Expansion 47
34
117
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.41
Td 500   ℃ TGA   ASTM D3850
Density 2.7   g/cm3   ASTM D792
Specific Heat 0.97(0.231)   j/g/k
(BTU/ib/OF)
  Calculated
Copper Peel 14.3 (2.5)   pli (N/mm) after solder float IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Contact Details
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Contact Person: i.deng

Tel: +8613481420915

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