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Immersion Gold RO4730G3 60mil Rogers PCB Board 1.524mm DK3.0

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Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

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Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

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Immersion Gold RO4730G3 60mil Rogers PCB Board 1.524mm DK3.0

Large Image : Immersion Gold RO4730G3 60mil Rogers PCB Board 1.524mm DK3.0

Product Details:

Place of Origin:	CHINA
Brand Name:	Bicheng
Certification:	UL, ISO9001, IATF16949
Model Number:	BIC-060.V1.0

Payment & Shipping Terms:

Minimum Order Quantity:	1PCS
Packaging Details:	Vacuum bags+Cartons
Delivery Time:	8-9 working days
Payment Terms:	T/T
Supply Ability:	5000PCS per month

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Detailed Product Description

Base Material:	RO4730G3 60mil	Layer Count:	2 Layers
PCB Thickness:	1.6mm	PCB Size:	110mm X 95mm = 1 Type = 1 Piece
Solder Mask:	Green	Silkscreen:	White
Copper Weight:	Outer Layer 35 μm	Surface Finish:	Immersion Gold
High Light:	RO4730G3 60mil Rogers PCB Board , Immersion Gold Rogers PCB Board , 1.524mm Rogers PCB Board

Rogers High Frequency PCB Built on RO4730G3 60mil 1.524mm DK3.0 With Immersion Gold for Cellular Base Station Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RO4730G3 antenna grade laminates are reliable, low-cost alternative to the conventional PTFE-based laminates. It has the mechanical and electrical properties that antenna designers need. The materials have a dielectric constant of 3.0 and a loss tangent of 0.0022 measured at 2.5 GHz when using LoPro Reverse Treated EDC foil. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Materials are available with demonstrated low PIM performance, with values better than -160dBc.

RO4730G3 materials are compatible with conventional epoxy and high temperature lead-free solder processing. It does not require the special treatment needed on traditional PTFE-based laminates for plated through holes preparation. Multi-layer can be achieved using RO4450F bondply at 175 ℃. The resin systems of RO4730G3 are designed to provide the properties sought after by antenna designers. The glass transition temperature exceeds 280oC, leading to a low Z-axis CTE, excellent plated through holes reliability, and lead free solder processability.

Typical application is cellular base station antennas.

General description

This is a type of double sided RF PCB built on 1.524mm (60mil) RO4730G3 for the application of Cellular Base Station Antenna PCB.

Basic specifications

Base material: RO4730G3 60mil (1.524mm)

Dielectric constant: 3.0+/-0.05

Layer count: 2 layers

Type: Through holes

Format: 110mm x 95mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm

Solder mask | Legend: Green | White

Final PCB height: 1.6 mm

Standard: IPC 6012 Class 2

Packing: 20 pieces are packed for shipment.

Lead time: 7 working days

Shelf life: 6 months

Immersion Gold RO4730G3 60mil Rogers PCB Board 1.524mm DK3.0 0

Data Sheet of Rogers 4730 (RO4730G3)

RO4730G3 Typical Value
Property	RO4730G3	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.0±0.5	Z		10 GHz 23℃	IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign	2.98	Z		1.7 GHz to 5 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0028	Z		10 GHz 23℃	IPC-TM-650 2.5.5.5
Dissipation Factor,tanδ	0.0028	Z		2.5 GHz	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	+34	Z	ppm/℃	-50 ℃to 150℃	IPC-TM-650 2.5.5.5
Dimensional Stability	<0.4	X, Y	mm/m	after etech +E2/150 ℃	IPC-TM-650 2.4.39A
Volume Resistivity (0.030")	9 X 10⁷		MΩ.cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity (0.030")	7.2 X 10⁵		MΩ	COND A	IPC-TM-650 2.5.17.1
PIM	-165		dBc	50 ohm 0.060"	43 dBm 1900 MHz
Electrical Strength (0.030")	730	Z	V/mil		IPC-TM-650 2.5.6.2
Flexural Strength MD	181 (26.3)		Mpa (kpsi)	RT	ASTM D790
CMD	139 (20.2)		Mpa (kpsi)	RT	ASTM D790
Moisure Absorption	0.093	-	%	48/50	IPC-TM-650 2.6.2.1 ASTM D570
Thermal Conductivity	0.45	Z	W/mK	50℃	ASTM D5470
Coefficient of Thermal Expansion	15.9 14.4 35.2	X Y Z	ppm/℃	-50 ℃to 288℃	IPC-TM-650 2.4.4.1
Tg	>280		℃		IPC-TM-650 2.4.24
Td	411		℃		ASTM D3850
Density	1.58		gm/cm³		ASTM D792
Copper Peel Stength	4.1		pli	1oz,LoPro EDC	IPC-TM-650 2.4.8
Flammability	V-0				UL 94
Lead-free Process Compatible	Yes