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Immersion Gold RO4730G3 60mil Rogers PCB Board 1.524mm DK3.0
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Immersion Gold RO4730G3 60mil Rogers PCB Board 1.524mm DK3.0
  • name

Immersion Gold RO4730G3 60mil Rogers PCB Board 1.524mm DK3.0

MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-060.V1.0
Base Material:
RO4730G3 60mil
Layer Count:
2 Layers
PCB Thickness:
1.6mm
PCB Size:
110mm X 95mm = 1 Type = 1 Piece
Solder Mask:
Green
Silkscreen:
White
Copper Weight:
Outer Layer 35 μm
Surface Finish:
Immersion Gold
Highlight:

RO4730G3 60mil Rogers PCB Board

,

Immersion Gold Rogers PCB Board

,

1.524mm Rogers PCB Board

Product Description

 

Rogers High Frequency PCB Built on RO4730G3 60mil 1.524mm DK3.0 With Immersion Gold for Cellular Base Station Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers RO4730G3 antenna grade laminates are reliable, low-cost alternative to the conventional PTFE-based laminates. It has the mechanical and electrical properties that antenna designers need. The materials have a dielectric constant of 3.0 and a loss tangent of 0.0022 measured at 2.5 GHz when using LoPro Reverse Treated EDC foil. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Materials are available with demonstrated low PIM performance, with values better than -160dBc.

 

RO4730G3 materials are compatible with conventional epoxy and high temperature lead-free solder processing. It does not require the special treatment needed on traditional PTFE-based laminates for plated through holes preparation. Multi-layer can be achieved using RO4450F bondply at 175 ℃. The resin systems of RO4730G3 are designed to provide the properties sought after by antenna designers. The glass transition temperature exceeds 280oC, leading to a low Z-axis CTE, excellent plated through holes reliability, and lead free solder processability.

 

Typical application is cellular base station antennas.

 

General description

This is a type of double sided RF PCB built on 1.524mm (60mil) RO4730G3 for the application of Cellular Base Station Antenna PCB.

 

Basic specifications

Base material: RO4730G3 60mil (1.524mm)

Dielectric constant: 3.0+/-0.05

Layer count: 2 layers

Type: Through holes

Format: 110mm x 95mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm

Solder mask | Legend: Green | White

Final PCB height: 1.6 mm

Standard: IPC 6012 Class 2

Packing: 20 pieces are packed for shipment.

Lead time: 7 working days

Shelf life: 6 months

 

Data Sheet of Rogers 4730 (RO4730G3)

RO4730G3 Typical Value
Property RO4730G3 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.5 Z   10 GHz 23℃ IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 2.98 Z   1.7 GHz to 5 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0028 Z   10 GHz 23℃ IPC-TM-650 2.5.5.5
  2.5 GHz
Thermal Coefficient of ε +34 Z ppm/℃ -50 ℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability <0.4 X, Y mm/m after etech +E2/150 ℃ IPC-TM-650 2.4.39A
Volume Resistivity (0.030") 9 X 107   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity (0.030") 7.2 X 105   MΩ COND A IPC-TM-650 2.5.17.1
PIM -165   dBc 50 ohm 0.060" 43 dBm 1900 MHz
Electrical Strength (0.030") 730 Z V/mil   IPC-TM-650 2.5.6.2
Flexural Strength MD 181 (26.3)   Mpa (kpsi) RT ASTM D790
CMD 139 (20.2)  
Moisure Absorption 0.093 - % 48/50 IPC-TM-650 2.6.2.1 ASTM D570
Thermal Conductivity 0.45 Z W/mK 50℃ ASTM D5470
Coefficient of Thermal Expansion 15.9
14.4
35.2		 X
Y
Z		 ppm/℃ -50 ℃to 288℃ IPC-TM-650 2.4.4.1
Tg >280   ℃   IPC-TM-650 2.4.24
Td 411   ℃   ASTM D3850
Density 1.58   gm/cm3   ASTM D792
Copper Peel Stength 4.1   pli 1oz,LoPro EDC IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Tags: 

RO4003C LoPro Rogers PCB Board,  

8mil Rogers PCB Board,  

0.5oz Rogers PCB Board

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products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
Immersion Gold RO4730G3 60mil Rogers PCB Board 1.524mm DK3.0
  • name
Immersion Gold RO4730G3 60mil Rogers PCB Board 1.524mm DK3.0
MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-060.V1.0
Base Material:
RO4730G3 60mil
Layer Count:
2 Layers
PCB Thickness:
1.6mm
PCB Size:
110mm X 95mm = 1 Type = 1 Piece
Solder Mask:
Green
Silkscreen:
White
Copper Weight:
Outer Layer 35 μm
Surface Finish:
Immersion Gold
Minimum Order Quantity:
1PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

RO4730G3 60mil Rogers PCB Board

,

Immersion Gold Rogers PCB Board

,

1.524mm Rogers PCB Board

Product Description

 

Rogers High Frequency PCB Built on RO4730G3 60mil 1.524mm DK3.0 With Immersion Gold for Cellular Base Station Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers RO4730G3 antenna grade laminates are reliable, low-cost alternative to the conventional PTFE-based laminates. It has the mechanical and electrical properties that antenna designers need. The materials have a dielectric constant of 3.0 and a loss tangent of 0.0022 measured at 2.5 GHz when using LoPro Reverse Treated EDC foil. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Materials are available with demonstrated low PIM performance, with values better than -160dBc.

 

RO4730G3 materials are compatible with conventional epoxy and high temperature lead-free solder processing. It does not require the special treatment needed on traditional PTFE-based laminates for plated through holes preparation. Multi-layer can be achieved using RO4450F bondply at 175 ℃. The resin systems of RO4730G3 are designed to provide the properties sought after by antenna designers. The glass transition temperature exceeds 280oC, leading to a low Z-axis CTE, excellent plated through holes reliability, and lead free solder processability.

 

Typical application is cellular base station antennas.

 

General description

This is a type of double sided RF PCB built on 1.524mm (60mil) RO4730G3 for the application of Cellular Base Station Antenna PCB.

 

Basic specifications

Base material: RO4730G3 60mil (1.524mm)

Dielectric constant: 3.0+/-0.05

Layer count: 2 layers

Type: Through holes

Format: 110mm x 95mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm

Solder mask | Legend: Green | White

Final PCB height: 1.6 mm

Standard: IPC 6012 Class 2

Packing: 20 pieces are packed for shipment.

Lead time: 7 working days

Shelf life: 6 months

 

Data Sheet of Rogers 4730 (RO4730G3)

RO4730G3 Typical Value
Property RO4730G3 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.5 Z   10 GHz 23℃ IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 2.98 Z   1.7 GHz to 5 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0028 Z   10 GHz 23℃ IPC-TM-650 2.5.5.5
  2.5 GHz
Thermal Coefficient of ε +34 Z ppm/℃ -50 ℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability <0.4 X, Y mm/m after etech +E2/150 ℃ IPC-TM-650 2.4.39A
Volume Resistivity (0.030") 9 X 107   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity (0.030") 7.2 X 105   MΩ COND A IPC-TM-650 2.5.17.1
PIM -165   dBc 50 ohm 0.060" 43 dBm 1900 MHz
Electrical Strength (0.030") 730 Z V/mil   IPC-TM-650 2.5.6.2
Flexural Strength MD 181 (26.3)   Mpa (kpsi) RT ASTM D790
CMD 139 (20.2)  
Moisure Absorption 0.093 - % 48/50 IPC-TM-650 2.6.2.1 ASTM D570
Thermal Conductivity 0.45 Z W/mK 50℃ ASTM D5470
Coefficient of Thermal Expansion 15.9
14.4
35.2		 X
Y
Z		 ppm/℃ -50 ℃to 288℃ IPC-TM-650 2.4.4.1
Tg >280   ℃   IPC-TM-650 2.4.24
Td 411   ℃   ASTM D3850
Density 1.58   gm/cm3   ASTM D792
Copper Peel Stength 4.1   pli 1oz,LoPro EDC IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Tags: 

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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