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| Base Material: | RO3003 | Layer Count: | 1 Layer, 2 Layer, Multilayer, Hybrid PCB |
|---|---|---|---|
| PCB Thickness: | 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) | PCB Size: | ≤400mm X 500mm |
| Solder Mask: | Green, Black, Blue, Yellow, Red Etc. | Copper Weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Surface Finish: | Bare Copper, HASL, ENIG, OSP Etc.. | ||
| High Light: | RO3003 Rogers PCB Board,10mil Rogers PCB Board |
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Rogers RO3003 High Frequency PCB with 10mil, 20mil, 30mil and 60mil Thick Coating Immersion Gold, Immersion Silver, Immersion Tin and HASL
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Hello Everyone,
Today we’re going to talk about RO3003 high frequency PCBs.
RO3003 high frequency circuit laminates are ceramic-filled PTFE composites intended for using in commercial microwave and RF applications. Its obvious characteristic is that the electrical performance is exceptional and the mechanical property is stable and consistent. This allows our designers to develop multi-layer board design feeling free and free, without encountering warpage or reliability problems.
Let’s look at some features and applications.
First of all, low dielectric loss, DF=0.001, it can be used in applications up to 77 GHz.
Secondly, Stable dielectric constant versus temperature and frequency, it’s ideal material for band pass filters, microstrip patch antennas, and voltage controlled oscillators.
Thirdly, excellent mechanical properties versus temperature, it’s reliable stripline and multi-layer board constructions.
Fourthly, Uniform mechanical properties, it’s suitable for use with epoxy glass multi-layer board hybrid designs.
Finally, low in-plane expansion coefficient matches to copper, it allows for more reliable surface mounted assemblies; ideal for applications sensitive to temperature change and exhibit excellent dimensional stability.
Our PCB Capability (RO3003)
| PCB Capability | |
| PCB Material: | Ceramic-filled PTFE composite |
| Designator: | RO3003 |
| Dielectric constant: | 3.0 ±0.04 (process) |
| 3.0 (design) | |
| Layer count: | 1 Layer, 2 Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil (0.508mm) |
| 30mil (0.762mm), 60mil (1.524mm) | |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
RO3003 high frequency PCBs are available with double sided, multi-layer and hybrid construction, copper ranges from 0.5oz to 2oz, thickness from 0.3mm to 1.6mm, maximum size 400 by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.
The typical Applications are automotive radar applications, power amplifiers and antennas, direct broadcast satellite etc.
The basic colour of RO3003 PCB is white.
The manufacturing process of RO3003 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market.
Should you have any questions, please feel free to contact us.
Thank you for your reading.
Appendix: Data Sheet of RO3003
| RO3003 Typical Value | |||||
| Property | RO3003 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.0±0.04 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.001 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -3 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.06 0.07 |
X Y |
mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 107 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 107 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus | 930 823 |
X Y |
MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.04 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
| Specific Heat | 0.9 | j/g/k | Calculated | ||
| Thermal Conductivity | 0.5 | W/M/K | 50℃ | ASTM D 5470 | |
| Coefficient of Thermal Expansion (-55 to 288℃) |
17 16 25 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ℃ TGA | ASTM D 3850 | ||
| Density | 2.1 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 12.7 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Contact Person: i.deng
Tel: +8613481420915
