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Rogers RT / Duroid 5880LZ PCB Blog Exploring Lightweight And Capabilities

China Bicheng Electronics Technology Co., Ltd certification
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Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Rogers RT / Duroid 5880LZ PCB Blog Exploring Lightweight And Capabilities

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Rogers RT PCB Blog


Laminates PCB Blog


Rogers RT Composite PCB Material

Rogers RT/duroid 5880LZ laminates are composite materials that are filled with PTFE. They are specifically designed for use in exacting strip-line and micro-strip circuit applications. These laminates contain a unique filler that results in a low density of 1.4 gm/cm3, making them lightweight and ideal for high-performance, weight-sensitive applications.


The RT/duroid 5880LZ PCBs have a very low dielectric constant of 2.0 +/-0.04 and a low dissipation factor ranging from .0021 to .0027 at 10GHz. The dielectric constant is uniform from panel to panel and remains constant over a wide frequency range. The low dissipation factor extends the usefulness of these PCBs to Ku-band and above.


Typical applications of RT/duroid 5880LZ laminates include airborne antenna systems, lightweight feed networks, point-to-point digital radio antennas, and other similar applications.


Rogers RT / Duroid 5880LZ PCB Blog Exploring Lightweight And Capabilities 0


Property Typical Value RT/duroid® 5880LZ Direction Units Condition Test Method
Dielectric Constant er,Process 2.00 ± 0.04 Z   10 GHz/23°C IPC-TM-650,
Dielectric Constant er,Design 2.00 Z   8 GHz - 40 GHz Differential Phase Length Method
Dissipation Factor, tan Typ: 0.0021 Max: 0.0027 Z   10GHz/23°C IPC-TM-650,
Thermal Coefficient of Dielectric Constant, er +20 Z ppm/°C -50°C to 150°C 10GHz IPC-TM-650,
Volume Resistivity 1.74 X 10^7   Mohm•cm C-96/35/90 IPC-TM-650,
Surface Resistivity 2.08 X 10^6   Mohm C-96/35/90 IPC-TM-650,
Electrical Strength 40   KV D48/50 IPC-TM-650, 2.5.6
Dimensional Stability -0.38 X,Y %   IPC-TM-650, 2.4.39A
Moisture Absorption 0.31   % 24 hours/23°C IPC-TM-650,
Thermal Conductivity 0.33 Z W/m/°K 80°C ASTM C518
Coefficient of Thermal Expansion 54, 47 40 X,Y Z ppm/°C 0 to 150°C IPC-TM-650, 2.4.41
TML 0.01   %   ASTM E-595
CVCM 0.01    
WVR 0.01    
Density 1.4   gm/cm^3   ASTM D792
Copper Peel >4.0   pli   IPC-TM-650, 2.4.8
Flammability V-O       UL 94
Lead-Free Process Compatible YES        



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