Home ProductsRogers PCB Board

High Frequency RO4003 Double Sided RF PCB Board For Antennas

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

I'm Online Chat Now

High Frequency RO4003 Double Sided RF PCB Board For Antennas

High Frequency RO4003 Double Sided RF PCB Board For Antennas
High Frequency RO4003 Double Sided RF PCB Board For Antennas High Frequency RO4003 Double Sided RF PCB Board For Antennas High Frequency RO4003 Double Sided RF PCB Board For Antennas High Frequency RO4003 Double Sided RF PCB Board For Antennas

Large Image :  High Frequency RO4003 Double Sided RF PCB Board For Antennas

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-009.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: RO4300C PCB Thickness: 0.3 Mm ±0.1
PCB Size: 58 X 110mm=1up Copper Weight: 35um
Layer Count: Double Sided Surface Finish: ENIG
High Light:

RO4003 Double Sided RF PCB Board

,

Antennas Double Sided PCB

,

RF High Frequency PCB

 

High Frequency PCB Double Sided RF PCB for Antennas 

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Introduction of RO4003C material

The Rogers Corporation manufactures woven glass reinforced hydrocarbon ceramic-filled laminates known as RO4003C high frequency materials. It can be manufactured using materials made of epoxy resin and shares the same electrical characteristics as PTFE/woven glass. Once working frequencies reach 500 MHz and beyond, designers have a much smaller number of laminates to choose from. Designers of RF microwave circuits, matching networks, and controlled impedance transmission lines can rely on the features of RO4003C material. Higher operating frequencies prevent the use of standard circuit board materials in many applications, while low dielectric loss enables RO4003C material to be employed in those applications. The dielectric constant is consistent across a wide frequency range and has one of the lowest temperature coefficients of any circuit board material. The thermal coefficient of expansion (CTE) of the RO4003C material offers the PCB designers a number of significant advantages. Due to its identical expansion coefficient to that of copper, RO4003C exhibits high dimensional stability, a quality required for the creation of mixed dielectric multi-layer boards. Even in applications that need extreme thermal shock, the RO4003C's low Z-axis CTE ensures dependable plated through-hole quality. The expansion characteristics of the RO4003C material are steady over the whole temperature range of PCB processing thanks to its Tg of >280C.

 

PCB Specifications

PCB SIZE 58 x 110mm=1up
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 35um(1 oz)+plate TOP layer
RO4003C 0.203mm
copper ------- 35um(1oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 6 mil / 11 mil
Minimum / Maximum Holes: 0.4 mm / 0.4 mm
Number of Different Holes: 1
Number of Drill Holes: 3
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: RO4003C Tg280, er<3.48, Rogers Corp.
Final foil external: 1.5 oz
Final foil internal: N/A
Final height of PCB: 0.3 mm ±0.1
PLATING AND COATING  
Surface Finish Immersion gold, 19.5%
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING N/A
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Typical applications are as follows:

Automotive Radar and Sensors

Cellular Base Station Antennas

Direct Broadcast Satellites

Low Noise Block

Power amplifiers

RFID

 

High Frequency RO4003 Double Sided RF PCB Board For Antennas 0

 

Data Sheet of Rogers 4003C (RO4003C)

RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23 IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z   10 GHz/23
2.5 GHz/23
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/ -50to 150 IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150 IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/ -55to288 IPC-TM-650 2.4.41
Tg >280   TMA A IPC-TM-650 2.4.24.3
Td 425   TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80 ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50
ASTM D 570
Density 1.79   gm/cm3 23 ASTM D 792
Copper Peel Stength 1.05
(6.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        

 

High Frequency RO4003 Double Sided RF PCB Board For Antennas 1

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

Send your inquiry directly to us (0 / 3000)